FCW100 SEOUL | Alldatasheet

Document overview

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Technical content

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) Pb Free Specification SSC-FCW100 (Rev 1.7, General) Customer ApprovalApprovalDrawn SSC

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) [ Contents ] 1. Absolute maximum ratings 2. Electro-optical characteristics 3. CIE Chromaticity Diagram 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Recommended soldering pad design 8. Reel packing dimension 9. Packing 10. Precaution for use

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) SSC-FCW100SSC-FCW100

  • 2.0 X 1.5 X 0.5 mm
  • x, y coordination x: 0.31, Y 0.31

Features

Description

  • White colored SMT package
  • Suitable for all SMT assembly methods and all soldering methods

Applications

  • C ellular phone’s Flash lighting
  • O ther decoration lighting

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) 1. Absolute maximum ratings *1 2. Electro-Optical Characteristics ¡É-30 ~ 85Topr.Operation Temperature ¡É-40 ~ 100Tstg.Storage Temperature V5VRReverse Voltage mW560PdPower Dissipation ¡É125TjLED Junction Temperature mA600IFM *2Peak Forward Current mA175IFForward Current UnitValueSymbolParameter (Ta=25¡É) *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM conditions is pulse width Tw ¡Â300ms and Duty ratio¡Â1/10 -0.31- IF=175 §Ì Y lx@1m -9-IF=320 §Ì (Flash mode*2) 85.5-IF=175 §Ì lxIllumination*4 IF=320 §Ì (Flash mode*2) IF=320 §Ì (Flash mode*2) -9- V -3.2 2.5 2.7 Min 3.7 Max 130 0.31 5.5 3.0 Typ ¢ªIF=20 §Ì2¥è1/2Viewing Angle*5 LmIF=175 §Ì¥ÕVLuminous Flux*3 IF=175 §Ì VFForward Voltage X Chromaticity Coordination cd IF=175 §Ì IVLuminous Intensity*1 §ËVR=5VIRReverse Current UnitConditionSymbolParameter (Ta=25¡É) *1. The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *2. Flash mode conditions are pulse width Tw = 1sec, duty ratio = 2/7 *3. Luminous flux measurement allowance is ±10% *4. This luminous intensity (Lux) is measured at a distance of 1m with condition Ta = 25¡Éand it has 10% tolerance. *5. ¥è1/2 is the off-axis where the luminous intensity is ½ of the peak intensity. [Note] All measurements were made under the standardized environment of SSC (Tolerance : Color Coordinate ¡¾0.005, VF = ¡¾0.1)

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) 3. CIE chromaticity Diagram 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 y Coord. x Coord. 0.24 0.26 0.28 0.30 0.32 0.34 C y Coord. x Coord. B ¡ØColor Rank 0.335 0.335 0.300 0.317 0.2950.3170.272x C 0.3000.2550.255y 0.3350.3000.300y 0.2720.2920.247x B Chromaticity CoordinationRank

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) 4. Characteristic Diagram Relative Intensity vs Forward CurrentForward Current vs Forward Voltage 100 1000 Forward Current [mA] Forward Voltage [V] 0 100 200 300 400 500 600 100 150 200 250 Ratio of Luminous Intensity [%.] Forward Current [mA] Forward Current vs Derating Curve Forward Current vs Chromaticity Coordinate 50 100 150 200 250 300 350 0.29 0.30 0.31 0.32 0.33 Chromatisity Coordinate x, y [a.u.] Forward Current [mA] x y -25 0 25 50 75 100 10 0 12 0 14 0 16 0 18 0 20 0 Forward current IF(mA) A m bien t tem per atur e T a( o

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) Radiation Diagram 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 708090100110 120 130 140 150 160 170 1800.0 Y Y (Ta=25¡É, IF=175mA) Spectrum 400 450 500 550 600 650 700 750 0.0 0.2 0.4 0.6 0.8

1.0 Ta = 25

o C Intensity [a.u.] W avel engt h [nm]

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) 5. Soldering profile Reflow Soldering Conditions/ Profile (1) Lead Solder

  • Preliminary heating to be at 210¡Émax. for 2 minutes max.
  • Soldering heat to be at 240¡Émax. for 10 seconds max. 0 153 04 56 07 59 0 105 120 135 150 165 180 195 120 160 200 240 280 Soldering Times [sec] Device Surface Temperature [ o (2) Lead-Free Solder
  • Preliminary heating to be at 220¡Émax. for 2 minutes max.
  • Soldering heat to be at 260¡Émax. for 10 seconds max. 0 15 30 45 60 75 90 105 120 135 150 165 180 195 120 160 200 240 280 Device Surface Temperature [ o Soldering Times [sec] (3) Hand Soldering Condition
  • Not more than 3 seconds @MAX280¡É, under Soldering iron. [Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) 1.50 1.20 PCB Resin 1.60 2.00 2.00 1.50 ¡¾0.05 ¡¾0.030.18 0.50 Cathode Anode 0.50 [BO TTO M VIEW ][SIDE VIEW ][TOP VIEW ] [Circuit Diagram] 6. Outline Dimension Tolerance: ¡¾0.05, Unit: §® 7. Recommended Soldering pad design [ Normal Solder pad ] [ Solder pad for heat radiation ]

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) 4.0¡¾0.1 0.2¡¾0.05 8.0¡¾0.2 0.65¡¾0.1 ?1.5-0 +0.1 180 ¡¾0.2 Label 2¡¾0.2 60+0.2 11.4 9¡¾0.3 Tolerance: ¡¾0.2, Unit: §® 8. Reel Packing Dimension (1) Quantity: 2,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ¡¾0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10¢ªangle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) SIZE(mm) SE O U L SEM ICO NDUC TO R CO .,LTD *Material: Paper(SW3B(B)) CHIP LED CO DE : a b DATE : LO T NO : Q 'YT : 20,000EA Outer Box c CHIP LED PART : SS C-FC W 100 TYPE 7inch245 a 220 b Á¦Ç°¸í : S S C-FCW 100 ¼ö·® : 2,000 142 c Á¦Ç°¸í : S S C-FCW1 00 Aluminum Vinyl Bag Reel ¼ö·® : 2,000 9. Packing

Revision 1.7Revision 1.7 www.ZLED.com www.ZLED.com ¼­½Ä¹øÈ£ : SSC-QP-7-07-24 (Rev.0.0) 10. Precaution for Use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5¡É~30¡ÉHumidity : 60%HR max. (2) Attention after opened However LED is corresponded SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40¡É Humidity : less than 30% (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 60¡¾5¡É. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 80¡¾5¡Éor 12Hr at 100¡¾5¡É. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. (10) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (11) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (12) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (13) The LEDs must be soldered within seven days after opening the moisture-proof packing. (14) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (15) The appearance and specifications of the product may be modified for improvement without notice.