F10390

F10390 SEOUL | Alldatasheet

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Rev06 – 2005/09 1 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Power LED TECHNICAL DATA F10390

Rev06 – 2005/09 2 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 SPECIFICATIONS - Features

• Super high flux output and high luminance
• Designed for high current operation
• Low thermal resistance
• SMT solderbility
• Lead (Pb) Free Product – RoHS Compliant - Applications
• General Illumination - Outdoor & Indoor architectural lighting - Decorative lighting - Torch lighting - Portable lighting (Flash and lamp) and Reading lighting - LCD Backlighting - Description Z-Power series is designed for high current operation and high flux output applications. Z-Power LED's thermal management perform exceeds other power LED solutions. It incorporates state of the art SMD design and Thermal emission material. Z Power LED is ideal light sources for general illumination applications, custom designed solutions, automotive large LCD backlights.

Rev06 – 2005/09 3 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Full code form : X1 X2 X3 X4 X5 X6 –X 7 X8 –X 9 X10 X11 X12 X13 1. Part number -X 1 : Color -X 2 : Z-Power LED series number -X 3 : LENS type -X 4 : Chip Quantity -X 5 : Package outline size -X 6 : Metal PCB type 2. Internal Number -X 7 -X 8 3. Code Labeling -X 9 : Luminous Flux (or Radiant Flux for Royal) -X 10 X11X12 : Dominant Wavelength (or x,y coordinates rank code) -X 13 : Forward Voltage For more information about binning and labeling, refer to the Application Note -1 Full Code explanation of Z-Power LED series

Rev06 – 2005/09 4 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Notes : 1. All dimensions are in millimeters. 2. Scale : none 3. This drawing is reference only for engineering 1. Outline Dimensions B GR Green Red Slug (+)

Rev06 – 2005/09 5 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 3. Absolute Maximum Ratings (at TA=25ºC) ºC125TjJunction Temperature -±20,000V HBM-ESD Sensitivity [5] ºC-40 ~ +120TstgStorage Temperature W3.5PDPower Dissipation ºC-30 ~ +85ToprOperating Temperature A1.2IFForward Current UnitValueSymbolParameter 2. Electro-Optical Characteristics (at TA=25ºC) F V-R:2.5 ,B/G:3.4-VF Forward Voltage [4] K-6000-CCTCorrelated Color Temperature [3] MaxTypMin -60 lm-ФV [2]Luminous Flux [1] Unit Value SymbolParameter White Please do not drive a rated current more than 5 sec. without proper heat sink *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT ±5% tester tolerance [4] A tolerance of ±0.06V on forward voltage measurements [5] Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. mAR:237, G:370, B:120IForward Current

Rev06 – 2005/09 6 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 2. Electro-Optical Characteristics (at IF=350mA, TA=25ºC) 3. Absolute Maximum Ratings (at TA=25ºC) ºC125TjJunction Temperature -±20,000V HBM-ESD Sensitivity [6] ºC-40 ~ +120TstgStorage Temperature W1.6PDPower Dissipation ºC-30 ~ +85ToprOperating Temperature A0.4IFForward Current UnitValueSymbolParameter Blue *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrated sphere. [3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of ±0.5nm for dominant wavelength [4] A tolerance of ±0.06V on forward voltage measurements [5] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. 1. Please do not drive at rated current more than 5 sec. without proper heat sink 2. Blue power light sources represented here are IEC825 Class 2 for eye safety ºC /W8RθJ-BThermal Resistance [5] nm475460455λDDominant Wavelength [3] MaxTypMin 4.0 3.5 deg.1302Θ 1/2View Angle V3.0VFForward Voltage [4] lm6ФV [2]Luminous Flux [1] Unit Value SymbolParameter

Rev06 – 2005/09 7 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 2. Electro-Optical Characteristics (at IF=350mA, TA=25ºC) 3. Absolute Maximum Ratings (at TA=25ºC) ºC125TjJunction Temperature -±20,000V HBM-ESD Sensitivity [6] ºC-40 ~ +120TstgStorage Temperature W1.6PDPower Dissipation ºC-30 ~ +85ToprOperating Temperature A0.4IFForward Current UnitValueSymbolParameter Green Please do not drive a rated current more than 5 sec. without proper heat sink *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrated sphere. [3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of ±0.5nm for dominant wavelength [4] A tolerance of ±0.06V on forward voltage measurements [5] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. ºC /W8RθJ-BThermal Resistance [5] nm535527520λDDominant Wavelength [3] MaxTypMin 4.0 3.5 deg.1302Θ 1/2View Angle V3.0VFForward Voltage [4] lm24ФV [2]Luminous Flux [1] Unit Value SymbolParameter

Rev06 – 2005/09 8 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 2. Electro-Optical Characteristics (at IF=350mA, TA=25ºC) 3. Absolute Maximum Ratings (at TA=25ºC) ºC100TjJunction Temperature -±20,000V HBM-ESD Sensitivity [6] ºC-40 ~ +120TstgStorage Temperature W1.2PDPower Dissipation ºC-30 ~ +85ToprOperating Temperature A0.4IFForward Current UnitValueSymbolParameter Red Please do not drive a rated current more than 5 sec. without proper heat sink *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrated sphere. [3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of ±0.5nm for dominant wavelength [4] A tolerance of ±0.06V on forward voltage measurements [5] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. ºC /W12RθJ-BThermal Resistance [5] deg.1282Θ 1/2View Angle nm632625618λDDominant Wavelength [3] MaxTypMin 3.0 2.5 V2.0VFForward Voltage [4] lm22ФV [1]Luminous Flux [1] Unit Value SymbolParameter

Rev06 – 2005/09 9 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 4. Forward Voltage vs. Forward Current (Ta=25℃) 5. Forward Current vs. Normalized Relative Luminous Flux (Ta=25℃) 0 100 200 300 400 500 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 Forward Voltage(V) Forward Current(mA) RED GREEN BLUE 0 100 200 300 400 500 600 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Forward Current(mA) Relative Luminous Flux(a.u) RED GREEN BLUE

Rev06 – 2005/09 10 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 400 500 600 700 0.0 0.2 0.4 0.6 0.8 1.0 Relative Spectral Power Distribution Wavelength (nm) 6. Spectrum for white(Ta=25℃) 7. Wavelength Curve for Red, Green, Blue (Ta=25℃) 400 500 600 700 0.0 0.2 0.4 0.6 0.8 1.0 Relative Spectral Power Distribution Wavelength (nm)

Rev06 – 2005/09 11 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 9. Radiant pattern for Red 8. Radiant pattern for White -100 -80 -60 -40 -20 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 Relative Intensity Directional angle (deg.) -100 -80 -60 -40 -20 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0Relative Intensity Directional angle (deg.)

Rev06 – 2005/09 12 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 11. Radiant pattern for Blue 10. Radiant pattern for Green -100 -80 -60 -40 -20 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 Relative Intensity Directional angle (deg.) -100 -80 -60 -40 -20 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 Relative Intensity Directional angle (deg.)

Rev06 – 2005/09 13 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 12. Forward Current Vs Wavelength shift (Ta=25℃) 13. Junction Temp Vs Wavelength shift (Ta=25℃) 0 50 100 15 0 200 250 300 350 40 0 Dominant wavelength Shift(nm) F orw ard cu rren t(IF ) RE D GRE E N BL U E 0 25 50 75 100 125 150 Dominant wavelength shift(nm) Junc tion T em perat ur e( o RE D GR E E N BL U E

Rev06 – 2005/09 14 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 14. Temperature of Junction vs. Relative Light Output for Blue,Green,Red (Ta=25℃) 15. Ambient Temperature vs Allowable Forward Current for 1 chip White,Blue,Green,Cyan 0 20 40 60 80 100 120 100 120Relative Light Output(%) Junction Temperature( o RED GREEN BLUE 0 20 40 60 80 100 120 100 200 300 400 500Current (mA) Ambient Temperature T ( o RjaT = 40 o C / W RjaT = 30 o C / W RjaT = 20 o C / W

Rev06 – 2005/09 15 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 16. Ambient Temperature vs Allowable Forward Current for 1 chip Red, Amber 0 20 40 60 80 100 120 100 200 300 400 500 Current (mA) Ambient Temperature TA ( o RjaT = 40 o C / W RjaT = 30 o C / W RjaT = 20 o C / W

Rev06 – 2005/09 16 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 17. Reel Packaging Note : 1. The number of loaded products in the reel is 250ea 2. All dimensions are in millimeters 3. Scale none 4. This drawing is reference only engineering 10 pitch cumlative tolerance on tape ±0.2 R 0.3 TYPICAL 5° TYPICAL MIN 1.5 CENTER

Rev06 – 2005/09 17 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 18. Packaging structure Note : 1. 5 reels are loaded in box 2. Scale none 3. This drawing is reference only engineering 4. For more information about binning and labeling, refer to the Application Note - 1 a SEOUL SEMICONDUCTOR CO.,LTD Z POWER LED Outer Box TYPE a c 200 b Z POWER LED c 340 350 b SIZE(mm) Aluminum Vinyl Bag SEOUL SEMICONDUCTOR CO., LTD QUANTITY : 250

Rev06 – 2005/09 18 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 19. Recommended solder pad Copper <Rear view> Thermal enhanced PCB5 solder point Silk plating is recommended at 0.2mm thickness to avoid any possible short both side

Rev06 – 2005/09 19 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 20. Soldering Profile (1) Reflow Soldering Conditions / Profile Pre-heating 200 180 150 Temp [°C] 220 240 260 Rising 5 °C/sec Cooling -5 °C/sec Time [Hr] Tm : Reflow machine setting temp Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) (2) Hand Soldering conditions - Lead : Not more than 3 seconds @MAX280℃ - Slug : Use a thermal-adhesives * Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.

Rev06 – 2005/09 20 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 21. Precaution for use (1) Storage Avoid the absorption of moisture, we recommended to store Z Power LEDs in a dry box (or desiccator) with a desiccant . Otherwise, store them in the following environment: Temperature : 5℃~30℃ Humidity : 50% max. (2) Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package (within 24Hrs). b. Keeping of a fraction -S ealing - Temperature : 5 ~ 40℃ Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 60±5℃. (3) Any mechanical force or any excess vibration shall not be applied to apply during cooling process to normal temp after soldering. (4) Avoid quick cooling (5) Components should not be mounted on warped direction of PCB. (6) Anti radioactive ray design is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) The package with lens can NOT be solder reflowed. It will damage the lens. (13) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (14) Slug polarity is anode.

Rev06 – 2005/09 21 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 22. Handling of silicone resin LEDs Z-Power LED is encapsulated by silicone resin for the highest flux efficiency. Notes for handling of Silicone resin Z-Power LEDs 1) Avoid touching silicone resin parts especially by sharp tools such as Pincette(Tweezers) 2) Avoid leaving fingerprints on silicone resin parts. 3) Dust sensitivity silicone resin need containers having cover for storage. 4) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevent. 5) Please do not force over 3000 gf impact or pressure diagonally on the silicon lens. It will cause fatal damage of this product 6) Please do not recommend to cover the silicone resin of the LEDs with other resin (epoxy, urethane, etc)