ESRN03B01S2 CYSTEKEC | Alldatasheet

Document overview

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Technical content

Features

  • B i d i r e c t i o n a l u n i t • Replacement for MLV (0805)
  • 350W peak pulse power capability per line with a 8/20μs w a v e f o r m • Low clamping voltage
  • P r o t e c t s o n e p o w e r o r I / O p o r t • Ultra low capacitance
  • P b - f r e e l e a d p l a t i n g a n d h a l o g e n - f r e e p a c k a g e • Low leakage current
  • Transient protection for data line to IEC61000-4-2 (ESD) ±15kV(air) ±8kV (contact) Mechanical Data
  • Case : SOD-323, Molded plastic
  • Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
  • Mounting position : Any
  • Epoxy: UL 94V-0 rate flame retardant E q u i v a l e n t C i r c u i t O u t l i n e ESRN03B01S2 SOD-323

Ordering Information

ESRN03B01S2-0-T1-G SOD-323 (Pb-free lead plating and halogen-free package) 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 2/2 ESRN03B01S2 CYStek Product Specification Maximum Ratings and Characteristics(TA=25°C, unless otherwise noted) Parameter Symbol Value Unit Peak pulse power dissipation with a 8/20μs waveform (Note 1) PPP 350 W ESD voltage (HBM waveform per IE C61000-4-2) VESD 30 kV Peak forward surge current, 8.3ms single half sine wave uni-directional only (Note 2) IFSM 6 A Typical thermal resistance, junction to ambient air (Note 3) RthJA 500 Typical thermal resistance, junction to case RthJC 300 °C /W Power dissipation PD 0.25 W Operating junction and storage temperature range TJ;TSTG -55 ~ +150 °C Notes: 1. Non-repetitive current pulse, per Fig. 5 and derated above TA=25°C per Fig. 1. 2. Mounted on 8.3ms single half sine-wave or equivalent square wave, duty cycle=4 pulses per minute maximum. 3. Mounted on PCB with 10mm x 10 mm x 2mm Cu pads to each terminal. Electrical Characteristics Ratings at 25℃ ambient temperature, unless otherwise noted. Characteristic Symbol Condition Min. Typ Max. Unit Reverse Stand-off V oltage VRWM - - 3 Reverse Breakdown V oltage VBR IT=1mA 3.3 3.8 4.5 V Reverse Leakage Current IR VRWM=3V - - 1 μA IPP=1A, tp=8/20μs - - 6.5 IPP=3A, tp=8/20μs - - 8.5 Clamping V oltage VC IPP=8A, tp=8/20μs - - 13.9 V Junction Capacitance Cj VR=0V , f=1MHz - 1.6 3 pF Recommended Footprint mm inch

CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 3/3 ESRN03B01S2 CYStek Product Specification Typical Characteristics Typical Breakdown Voltage vs Temperature 3.2 3.4 3.6 3.8 4.2 4.4 4.6 4.8 -50 0 50 100 150 Temperature (℃) Breakdown Voltage VBR(V) IT=1mA Pin1 to Pin 2 or Pin2 to Pin1 Typical Leakage Current vs Temperature 100 150 200 -50 0 50 100 150 Temperature (℃) Leakage Current IR (uA) VR=3V Pin1 to Pin 2 or Pin2 to Pin1 Typical Leakage Current vs Reverse Voltage 1000 2000 3000 4000 5000 6000 0123456 Reverse Voltage VR(V) Leakage Current IR (μA) TA=25℃ Pin1 to Pin 2 or Pin2 to Pin1 Typical Capacitance vs Reverse Voltage 00 . 511 . 522 . 53 Reverse Voltage VR(V) Capacitance (pF) TA=25℃, f=1MHz Pin1 to Pin 2 or Pin2 to Pin1 Typical Clamping Voltage vs Peak Pulse Current 0 6 12 18 24 Peak Pulse Current-IPP(A) Clamping Voltage-Vc(V) TA=25℃ Waveform Parameters tr=8μs;td=20 μs Power Derating Curve 100 110 0 25 50 75 100 125 150 Ambient Temperature-T A(°C) Percentage of rated Power or IPP(%) TA=25℃ Waveform Parameters tr=8μs;td=20 μs

CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 4/4 ESRN03B01S2 CYStek Product Specification Typical Characteristics(Cont.) Non-repetitive Peak Pulse Power vs Pulse Time 100 1000 10000 0.1 1 10 100 1000 Pulse Time-tP(μs) Peak Pulse Power-PPP(W) Non-repetitive Peak Pulse Power vs Pulse Time 100 110 0 5 10 15 20 25 30 Time( μs) Percent of IPP(%) Waveform parameters : tr=8μs, td=20μs e td=IPP/2

CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 5/5 ESRN03B01S2 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 6/6 ESRN03B01S2 CYStek Product Specification Recommended Wave Soldering Profile

CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 7/7 ESRN03B01S2 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 8/8 ESRN03B01S2 CYStek Product Specification SOD-323 Dimension Marking: 2-Lead SOD-323 Plastic Surface Mounted Package, CYStek Package Code: S2 *: Typical Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.