ESAC63-006R

ESAC63-006R FUJI | Alldatasheet

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Device Name ： Type Name ： Spec. No. ： D A T E APPROVEDN A M E DRAWN CHECKED DWG.NO. H04-004-07b MS5D3019 1/12 Fuji Electric Device Technology Co.,Ltd. CHECKED T h i s m a t er i a l a n d t h e in f or m at i o n h e r ei n i s th e pr o pe r ty o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o sed in an y wa y w ha tsoe v er f or th e u s e o f an y third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t he e xp re s s wr i tt e n c on s en t o f Fuji Electric Device Technology Co.,Ltd. JAN.-25-‘07 JAN.-25-‘07 JAN.-25-‘07 SILICON DIODE ESAC63-006R MS5D3019

DWG.NO. H04-004-06b Revised Records DWG.NO. MS5D3019 2/12Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. Date Classi- fication Ind. Content Applied date Drawn Checked Approved JAN.-25 date

DWG.NO. DWG.NO. MS5D3019 3/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. 1. SCOPE This specification provides the ratings and the test requirement for FUJI SILICON DIODE ESAC63-006R 2. OUT VIEW , MARKING , MOLDING RESIN , CHARACTERISTICS (1) Out view is shown MS5D3019 9/12 (2) Marking is shown MS5D3019 9/12 It is marked to type name or abbreviated type name, polarity and Lot No. (3) Molding resin Epoxy resin UL:V-0 (4) Characteristics is shown MS5D3019 10/12～12/12 Bar Code Label of EIAJ C -3 Specification. Indispensable description items are shown as below. (1) Type Name (2) Production Code (3) Quantity (4) Lot №(Date code) (5) Company Code 3. RATINGS 3.1 MAXIMUM RATINGS (at Ta=25℃ unless otherwise specified.) ITEM SYMBOL CONDITIONS RATINGS UNITS Repetitive peak reverse voltage VRRM 60 V Average output current Io 50Hz Square wave duty =1/2 Tc = 118℃ 20 * A Non-repetitive forward surge current** IFSM Sine wave, 10ms 1shot 120 A Operating junction temperature Tj 150 ℃ Storage temperature Tstg -40～＋150 ℃ * Out put current of center tap full wave connection. Rating per element 3.2 ELECTRICAL CHARACTERISTICS (at Ta=25℃ unless otherwise specified.) ITEM SYMBOL CONDITIONS MAXIMUM UNITS Forward voltage * VF IF = 8A 0.58 V Reverse current * IR VR = VRRM 15 mA Thermal resistance Rth(j-c) Junction to case 2 ℃/W * Rating per element

3.3 MECHANICAL CHARACTERISTICS

Mounting torque Recommended torque 0.3～0.5 N･m Approximate mass 2 g

DWG.NO. DWG.NO. MS5D3019 4/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. 4. TEST AND INSPECTION

4.1 STANDARD TEST CONDITION

Standard test condition is Ta=25℃、65%R.H. If judgment is no doubt, the test condition is possible to test in normal condition

4.2 STRUCTURE INSPECTION

It inspect with eye and measure, Item 2 shall be satisfied.

4.3 FORWARD AND REVERSE CHARACTERISTICS

It inspect on the standard condition, Item 3.2 shall be satisfied.

4.4 TEST

No. Test Items Testing methods and Conditions Reference Standard EIAJ ED4701 Sampling number Acceptance number

1 Terminal

(Tensile) Pull force : 10N Force maintaining duration :10±1s EIAJ ED4701/401 method 1

2 Terminal

(Bending) Load force : 5N Number of times : 2times(90deg./time) EIAJ ED4701/401 method 3

3 Mounting

Screwing torque value:(M3) : 40±10N・cm EIAJ ED4701/402 method 2

4 Vibration Frequency : 100Hz to 2kHz

Acceleration : 100m/s2 Sweeping time : 4min./1 cycle 4times for each X, Y&Z directions. EIAJ ED4701/403 test code D

5 Shock Peak amplitude : 15km/s2

Duration time : 0.5ms 3times for each X, Y&Z directions. EIAJ ED4701/404 test code D Solder ability 1 Solder : Sn-37Pb Solder temp. : 235±5℃ Immersion time : 5±0.5s Apply to flux Solder ability 2 Solder : Sn-3Ag-0.5Cu Solder temp. : 245±5℃ Immersion time : 5±0.5s Apply to flux EIAJ ED4701/303 test code A Mechanical test

7 Resistance to

Solder temp. : 260±5°C Immersion time : 10±1s Number of times : 1times EIAJ ED4701/302 test code A (0 : 1)

DWG.NO. DWG.NO. MS5D3019 5/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. Test No. Test Items Testing methods and Conditions Reference Standard EIAJ ED4701 Sampling number Acceptance number 1 High Temp. Storage Temperature :Ｔstg max Test duration : 1000h EIAJ ED4701/201 22 2 Low Temp. Storage Temperature :Ｔstg min Test duration : 1000h EIAJ ED4701/202 22

3 Temperature

Temperature : 85±2°C Relative humidity : 85±5% Test duration : 1000h EIAJ ED4701/103 test code C

4 Temperature

Temperature : 85±2°C Relative humidity : 85±5% Bias Voltage : VRRM× 0.8 Test duration : 1000h EIAJ ED4701/103 test code C

5 Unsaturated

Temperature : 130±2°C Relative humidity : 85±5% Vapor pressure : 230kPa Test duration : 48h EIAJ ED4701/103 test code F

6 Temperature

High temp. side : Tstg max Room temp. : 5～35℃ Low temp. side : Tstg min Duration time : HT 30min,RT 5min LT 30min Number of cycles : 100 cycles EIAJ ED4701/105 22

7 Thermal

Fluid : pure water(running water) High temp. side : 100+0/-5°C Low temp. side : 0+5/-0°C Duration time : HT 5min,LT 5min Number of cycles : 100 cycles EIAJ ED4701/307 test code A

8 Steady state

Ta=25±5°C Rated load Test duration : 1000h

9 Intermittent

Tj=Tjmax ～50℃ 3min ON, 3min OFF Test duration : 10000cycles EIAJ ED4701/106 Endurance test 10 High Temp. Reverse Bias Temperature : Ta=100 °C Bias Voltage : VR=VRRM duty=1/2 Test duration : 1000h EIAJ ED4701/101 (0 : 1) IR ≦USL x 2 USL : Upper specification LimitFailure Criteria VF≦USL x 1.1

DWG.NO. DWG.NO. MS5D3019 6/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. 5.Cautions ・Although Fuji Electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing physical injury, fire, or other problem in case any of the products fail. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. ・The products described in this specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. ・Computers ・OA equipment ・Communications equipment (Terminal devices) ・Measurement equipment ・Machine tools ・AV equipment ・Electrical home appliances ・Personal equipment ・Industrial robots etc. ・The products described in this Specification are not designed or manufactured to be used in equipment or systems used under life -threatening situations. If you are considering using these produ cts in the equipment listed below, first check the system construction and required reliability, and take adequate safety measures such as a backup system to prevent the equipment from malfunctioning. ・Transportation equipment (automobiles, trains, ships, etc.) ・Backbone network equipment ・Traffic-signal control equipment ・Gas alarms, leakage gas auto breakers ・Submarine repeater equipment ・Burglar alarms, fire alarms, emergency equipment ・Medical equipment ・Nuclear control equipment etc. ・Do not use the products in this Specification for equipment requiring strict reliability such as (but not limited to): ・Aerospace equipment ・Aeronautical equipment 6.Warnings ・The Diodes should be used in products within their absolute maximum rating (voltage, current, temperature, etc. ). The diodes may be destroyed if used beyond the rating. ・The equipment containing Diodes should have adequate fuses or circuit breakers to prevent the equipment from causing secondary destruction (ex. fire, explosion etc…). ・Use the Diodes within their reliability and lifetime under certain environments or conditions. The Diodes may fail before the target lifetime of your products if used under certain reliability conditions. ・You must design the Diodes to be operated within the specified maximum ratings (voltage, current, temperature, etc. ) to prevent possible failure or destruction of devices. ・Consider the possible temperature rise not only for the junction and case, but also for the outer leads. ・Do not directly touch the leads or package of the Diodes while power is supplied or during operation, to avoid electric shock and burns. ・The Diodes are made of incombustible material. However, if a Diode fails, it may emit smoke of flame. Also, operating the Diodes near any flammabl e place or material may cause the Diodes to emit smoke or flame in case the Diodes become even hotter during operation. Design the arrangement to prevent the spread of fire. ・The Diodes should not used in an environment in the presence of acid, organic mat ter, or corrosive gas. (hydrogen sulfide, sulfurous acid gas.) ・The Diodes should not used in an irradiated field since they are not radiation proof.

DWG.NO. DWG.NO. MS5D3019 7/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. Installation ・Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Method Solder temperature Duration Flow 260±5℃ 10±1sec Soldering iron 350±10℃ 3.5±0.5sec ・The immersion depth of the lead should basically be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. ・When flow-soldering, be careful to avoid immersing the package in the solder bath. ・Refer to the following torque reference When mounting the device on a heat sink. Excess torque applied to the mounting screw causes damage to the device and weak torque will increase the thermal resistance, both of which conditions may destroy the device. Table 2:Recommended tightening torque Package style Screw Recommended tightening torque TO-220 M3 0.3～0.5N・m ・The heat sink should have a flatness within ±30μm and roughness within 10 μm. Also, keep the tightening torque within the limits of this specification. ・Improper handling may cause isolation breakdown leading to a critical accident. ・We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is important to evenly apply the compound and to eliminate any air voids. Storage ・The Diodes must be stored at a standard temperature of 5 to 35 ℃ and relative humidity of 45 to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. ・The Diodes should not be subjected to rapid changes in temperature to avo id condensation on the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is steady. ・The Diodes should not be stored on top of each other, since this may cause excessive external force on the case. ・The Diodes should not b e stored with the lead terminals remaining unprocessed. Rust may cause presoldered connections to go fail during later processing. ・The Diodes should be stored in antistatic containers or shipping bags.

DWG.NO. DWG.NO. MS5D3019 8/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. 7.Appendix ・This products does not contain PBBs (Polybrominated Biphenyl) or PBDEs (Polybrominated Diphenyl Ether ) , substances. ・This products does not contain Class-I ODS and Class-II ODS substances set force by ‘Clean Air Act of US’law. ・If you have any questions about any part of this Specification, please contact Fuji Electric Device Technology or itssales agent before using the product ・Neither Fuji nor its agents shall be held liable for any injury caused by using the products not in accordance with the instructions. ・The application examples described in this specification are merely typical uses of Fuji Electric DeviceTechnologyproducts. This specification does not confer any industrial property rights or other rights, nor constitute a license for such rights.

DWG.NO. DWG.NO. MS5D3019 9/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. Sn-Cu dipping (Pb＜1000ppm)

DWG.NO. DWG.NO. MS5D3019 10/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. 0 2 4 6 8 10 Per 1element DC Square wave λ=180° Sine wave λ=180° Square wave λ=120° Square wave λ=60° Forward Power Dissipation(max.) ＷＦ Forward Power Dissipation （Ｗ） Ｉｏ Average Output Current （Ａ） 0 5 10 15 20 25 30 35 40 45 50 55 60 65 Reverse Power Dissipation(max.) α=180° DC ＰＲ Reverse Power Dissipation （Ｗ） ＶＲ Reverse Voltage （Ｖ） λ 360° α 360° VR 0.01 0.1 100 Tj=150℃ Tj=125℃ Tj=100℃ Tj=25℃ Forward Characteristic (typ.) ＩＦ Forward Current （Ａ） ＶＦ Forward Voltage （Ｖ） 0 10 20 30 40 50 60 70 Reverse Characteristic (typ.) Tj= 25℃ Tj=100℃ Tj=125℃ Tj=150℃ ＩR Reverse Current （ｍＡ） ＶR Reverse Voltage （Ｖ）

DWG.NO. DWG.NO. MS5D3019 11/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. 0 5 10 15 20 25 30 100 110 120 130 140 150 160 λ:Conduction angle of forward current for each rectifier element Io:Output current of center-tap full wave connection Square wave λ=120° Square wave λ=60° Square wave λ=180° Sine wave λ=180° DC Current Derating (Io-Tc)(max.) Ｔｃ Case Temperature （℃） Ｉｏ Average Output Current （Ａ） 1 10 100 100 1000 Junction Capacitance Characteristic (typ.) Ｃj Junction Capacitance （ｐＦ） ＶＲ Reverse Voltage （Ｖ） λ 360° VR=30V V 1 10 100 100 1000 Surge Capability ＩFSM Peak Half - Wave Current （Ａ） Number of Cycles at 50Hz

DWG.NO. DWG.NO. MS5D3019 12/12 H04-004-03a Fuji Electric Device TechnologyCo.,Ltd. T h i s ma t er i a l an d t he i n fo rm a t i on h e r e in i s t he pr o p er t y o f Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,l e n t , o r di s cl o se d in an y w ay wha tso e ver f or th e us e of a ny third party nor used f o r t h e m a n u f a c t u r i n g p u r p o s e s w i t h o u t t h e e x pr es s w ri t te n co n sen t o f Fuji Electric Device Technology Co.,Ltd. T Time (s) Transient Thermal Impedance (max.) Transient Thermal Impedance （℃／Ｗ） Rth j-c:2.0°C/W