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3 AMP SURFACE MOUNT GLASS

SUPER FAST RECOVERY RECTIFIER li FEATURES hp © Super fast recovery time e For surface mount applications m Reliable low cost construction utilizing molded plastic technique - . e Low forward voltage drop a Outline Drawing e UL recognized 94V-O plastic material - - 19) e High temperature soldering: 250 °C/10 seconds SMC G8 at terminals : ; Beer] ¢ Glass passivated junction | a 2000.13 . 260(820) Hi Mechanical Data np tay © Case: Molded plastic a | , . 1032 e Polarity: Indicated on cathode ara) f . 1 = e Weight: 0.007 ounces, 0.21 grams += Ten | g g oon 52) °° —4 Lcoatezy | eeoe.76) |, OOKLT L c098. 19) U 305(7.75) Dimensions in inches and (millimeters) HB Maximum Ratings & Characteristics © Ratings at 25° C ambient temperature unless otherwise specified © Single phase, half wave, 60Hz, resistive or inductive load © For capacitive load, derate current by 20% T8338 esac] es30 [units | | Maximum Recurrent Peak Reverse Voltage | Varw | 50 | 100 | 180 «| 200 |v | Maximum RMS Input Voltage | Vews| 35 [70 | 405 | 40 | VY |_ Maximum DG Blocking Voltage | Voc [| 50 [00 | 150 | 200 |v Maximum Average Forward Output Current. ly , . | law | 3.0 A .375" 9.5mm lead length @TL= 100°C | Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave Irsm 100 | A Superimposed On Rated Load | MaximumForward Voltage Drop ALBOA | Ve PC Maximum Reverse Current At Rated @ TA=25°C 10 pA | DC Blocking Voltage per Bridge Element @ Ta= 100°C _ 500 pA | Maximum Reverse Recovery Time’ (See Note) | tr | 25 | ns | | Typical Thermal Resistance'(See Note) Romy | OC Typical Thermal Resistance*(See Note) [Rett | Operating Temperature Range ~65 to +150 joc} Storage Temperature R __ _ : -65 to +150 __ Lc_| Note: *Test conditions: IF=0.5A, IR = 1.0A, Irr = 0.254. *“*Measured at 1.0 MHZ and applied reverse voltage of 4.0V DC ***Thermal resistance junction lead/ambient measured on PC board 8.0mm? X (0.013mm thick) Collmer Semiconductor, Inc.