ECP103G-PCB2450

ECP103 WJCI | Alldatasheet

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com October 2004 Rev 1 ECP103

1 Watt, High Linearity InGaP HBT Amplifier Product Information

The Communications Edge TM Product Features x 2300 - 2700 MHz x +30.5 dBm P1dB x +46 dBm Output IP3 x 10 dB Gain @ 2450 MHz x 9 dB Gain @ 2600 MHz x Single Positive Supply (+5V) x Available in SOIC-8 or 16pin 4mm QFN package

Applications

The ECP103 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve superior performance for various narrowband-tuned application circuits with up to +46 dBm OIP3 and +30.5 dBm of compressed 1-dB power. The part is housed in an industry standard SOIC-8 SMT package. All devices are 100% RF and DC tested. The ECP103 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the ECP103 to maintain high linearity over temperature and operate directly off a single +5V supply. This combination makes the device an excellent candidate for driver amplifier stages in wireless-LAN, digital multimedia broadcast, or fixed wireless applications. The device can also be used in next generation RFID readers. Functional Diagram ECP103D ECP103G Specifications (1) Parameter Units Min Typ Max Operational Bandwidth MHz 2300 2700 Test Frequency MHz 2450 Gain dB 10 Input Return Loss dB 18 Output Return Loss dB 8 Output P1dB dBm +30.5 Output IP3 (2) dBm +46 Noise Figure dB 6.3 Test Frequency MHz 2600 Gain dB 9 Output P1dB dBm +30 Output IP3 (2) dBm +45 Operating Current Range , Icc (3) mA 400 450 500 Device Voltage, Vcc V 5 1. Test conditions unless otherwise noted: T = 25ºC, Vsupply = +5 V in a tuned application circuit. 2. 3OIP measured with two tones at an output power of +15 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 90 mA at P1dB. Pin 1 is used as a reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 10.8 mA of current when used with a series bias resistor of R1=51 . (ie. total device current typically will be 461 mA.) Typical Performance (4) Parameter Units Typical Frequency MHz 2450 2600 S21 – Gain dB 10 9 S11 dB 15 15 S22 dB 8 8 Output P1dB dBm 30.5 30.0 Output IP3 dBm 46 45 W-CDMA Channel Power @ -45 dBc ACPR dBm 22.5 Noise Figure dB 7 7 7 Supply Bias (3) +5 V @ 450 mA 4. Typical parameters reflect performance in a tuned application circuit at +25 Absolute Maximum Rating Ordering Information Parameters Rating Part No. Description Operating Case Temperature -40 to +85 qC ECP103D 1 Watt InGaP HBT Amplifier (16p 4mm Pkg) Storage Temperature -65 to +150 qC ECP103G 1 Watt InGaP HBT Amplifier (Soic-8 Pkg) RF Input Power (continuous) +26 dBm ECP103D-PCB2450 2450 MHz Evaluation Board Device Voltage +8 V ECP103D-PCB2650 2600 MHz Evaluation Board Device Current 900 mA ECP103G-PCB2450 2450 MHz Evaluation Board Device Power 5 W ECP103G-PCB2650 2600 MHz Evaluation Board Operation of this device above any of these parameters may cause permanent damage. 14 13 7 8 N/C RF OUT RF OUT N/C Vref N/C RF IN N/C Vbias N/C N/C N/C N/C N/C N/C N/C Vref N/C RF IN N/C Vbias RF OUT RF OUT N/C

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com October 2004 Rev 1 ECP103 The Communications Edge TM Typical Device Data – ECP103G (Soic-8 Package) S-Parameters (Vcc = +5 V, Icc = 450 mA, T = 25 C, calibrated to device leads) 0 0.5 1 1.5 2 2.5 Frequency (GHz) Gain and Maximum Stable Gain -10 Gain (dB) DB(|S[2,1]|) DB(GMax) 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S11 Swp Max 5.05GHz Swp Min 0.05GHz 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S22 Swp Max 5.05GHz Swp Min 0.05GHz Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance loss plots are shown from 0.05 – 5.05 GHz, with markers placed in 0.5 GHz increments. S-Parameters (Vcc = +5 V, Icc = 450 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Application Circuit PC Board Layout Circuit Board Material: Top RF layer is .014” Getek, 4 total layers (0.062” thick) for mechanical rigidity 1 oz copper, Microstrip line details: width = .026” , spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning shunt capacitors – C8 and C9. The markers and vias are spaced in .050” increments.

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com October 2004 Rev 1 ECP103 The Communications Edge TM

2450 MHz Application Circuit (ECP103G-PCB2450)

Typical RF Performance at 25qC Frequency 2450 MHz S21 – Gain 10 dB S11 – Input Return Loss -14 dB S22 – Output Return Loss -10 dB Output P1dB +30.5 dBm Output IP3 (+17 dBm / tone, 1 MHz spacing) +46 dBm Noise Figure 7 dB Device / Supply Voltage +5 V Quiescent Current (1) 450 mA 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. S21 vs. Frequency 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) S21 (dB) +25°C +85°C -40°C S11 vs. Frequency -25 -20 -15 -10 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) S11 (dB) +25°C +85°C -40°C S22 vs. Frequency -25 -20 -15 -10 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) S22 (dB) +25 °C +85 °C -40°C Noise Figure vs. Frequency 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) NF (dB) +25°C +85°C -40°C P1 dB vs. Frequency 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) P1 dB (dBm) +25°C +85°C -40°C ACPR vs. Channel Power IS-95, 9 Ch. Fwd. ±885 KHz offset, 30 KHz Meas BW, 1960 MHz -85 -80 -75 -70 -65 -60 -55 -50 -45 -40 15 16 17 18 19 20 21 22 23 24 25 26 27 Output Channel Power (dBm) ACPR (dBc) +25°C +85°C -40°C OIP3 vs. Frequency +25°C, 15 dBm / tone 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) OIP3 (dBm) OIP3 vs. Temperature freq. = 1960, 1961 MHz, +15 dBm -40 -15 10 35 60 85 Temperature ( °C) OIP3 (dBm) OIP3 vs. Output Power freq. = 1960, 1961 MHz, +25°C 10 12 14 16 18 20 22 Output Power (dBm) OIP3 (dBm)

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com October 2004 Rev 1 ECP103 The Communications Edge TM ECP103G (SOIC-8 Package) Mechanical Information Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85q C Thermal Resistance, Rth (1) 33q C / W Junction Temperature, Tjc (2) 159q C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85 C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 450 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 Product Marking The component will be marked with an “ ECP103G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Functional Diagram Function Pin No. Vref 1 Input 3 Output 6, 7 Vbias 8 GND Backside Paddle N/C or GND 2, 4, 5 Mounting Config. Notes 1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135º ) diameter drill and have a final plated thru diameter of .25 mm (.010º ). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8 All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 100 1000 10000 100000 1000000 50 60 70 80 90 100 Tab temperature (° C) MTTF (million hrs)

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com October 2004 Rev 1 ECP103 The Communications Edge TM ECP103D (16-pin 4x4mm Package) Mechanical Information Outline Drawing Land Pattern 0.65mm TYP. TYP. SOLDERMASK SWELL TO BE 0.5mm FROM OUTSIDE EDGE OF ALL PADS GROUND PLANE AREA FOR VIAS 2.23mm X 2.23mm RECOMMENDED PAD 0.76mm X 0.34mm DEVICE GROUND PAD 2.0mm X 2.0mm 4.00mm 16L 4.0mm X 4.0mm PACKAGE 0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE PLACED ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO TOP, BOTTOM, AND INTERNAL GROUND PLANES IN ORDER TO MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MATERIAL, VIA BARREL PLATING TO BE MIN. 0.0014 THICK. VIAS TO BE PLUGGED WITH EITHER CONDUCTIVE OR NON-CONDUCTIVE EPOXY TO PREVENT SOLDER. DRAINS THROUGH VIA IN REFLOW PROCESS Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85q C Thermal Resistance, Rth (1) 33q C / W Junction Temperature, Tjc (2) 159q C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85 C. Tjc is a function of the voltage at pins 10 and 11 and the current applied to pins 10, 11, and 16 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 450 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 Product Marking The component will be marked with an ª ECP103Dº designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the ª Application Notesº section. ESD / MSL Information ESD Rating: Class 1B Value: Passes between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Functional Diagram Function Pin No. Vref 1 RF Input 3 RF Output 10, 11 Vbias 16 GND Backside Paddle N/C or GND 2, 4-9, 12-15 Mounting Config. Notes 1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135º ) diameter drill and have a final plated thru diameter of .25 mm (.010º ). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8 All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 100 1000 10000 100000 1000000 50 60 70 80 90 100 Tab temperature (° C) MTTF (million hrs) 14 13 7 8 N/C RF OUT RF OUT N/C Vref N/C RF IN N/C Vbias N/C N/C N/C N/C N/C N/C N/C