ECP100

ECP100D WJCI | Alldatasheet

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 1 of 7 April 2006 ECP100D

1 Watt, High Linearity InGaP HBT Amplifier Product Information

The Communications Edge TM Product Features x 400 – 2300 MHz x +31.5 dBm P1dB x +46 dBm Output IP3 x 18 dB Gain @ 900 MHz x 12 dB Gain @ 1960 MHz x Single Positive Supply (+5V) x Lead-free/Green/RoHS-compliant 16pin 4mm QFN package

Applications

x Final stage amplifiers for Repeaters x Mobile Infrastructure x Defense / Homeland Security Product Description The ECP100D is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve superior performance for various narrowband-tuned application circuits with up to +46 dBm OIP3 and +31.5 dBm of compressed 1-dB power. It is housed in an industry standard Lead- free/Green/RoHS-compliant 16-pin 4x4mm QFN SMT package. All devices are 100% RF and DC tested. The product is targeted for use as driver amplifier for various current and next generation wireless technologies such as GPRS, GSM, CDMA, W-CDMA, and UMTS, where high linearity and high power is required. The internal active bias allows the ECP100D to maintain high linearity over temperature and operate directly off a +5 V supply. Functional Diagram Function Pin No. Vref 1 RF Input 3 RF Output 10, 11 Vbias 16 GND Backside Paddle N/C or GND 2, 4-9, 12-15 Specifications (1) Parameter Units Min Typ Max Operational Bandwidth MHz 400 2300 Test Frequency MHz 2140 Gain dB 10 11 Input Return Loss dB 18 Output Return Loss dB 8 Output P1dB dBm +29 +31.5 Output IP3 (2) dBm +43.8 +45 IS-95 Channel Power @ -45 dBc ACPR, 1960MHz dBm +25.5 W-CDMA Channel Power @ -45 dBc ACPR, 2140 MHz dBm +23 Noise Figure dB 6.3 Operating Current Range , Icc (3) mA 400 450 500 Device Voltage, Vcc V 5 1. Test conditions unless otherwise noted: T = 25 ºC, Vsupply = +5 V in a tuned application circuit. 2. 3OIP measured with two tones at an output power of +15 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 10, 11 and 16. It is expected that the current can increase by an additional 90 mA at P1dB. Pin 1 is used as a reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 10.8 mA of current when used with a series bias resistor of R1=51 . (ie. total device current typically will be 461 mA.) Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 qC Storage Temperature -65 to +125 qC RF Input Power (continuous) +26 dBm Device Voltage +8 V Device Current 900 mA Device Power 5 W Junction Temperature +250 qC Operation of this device above any of these parameters may cause permanent damage. Typical Performance (4) Parameter Units Typical Frequency MHz 900 1960 2140 S21 – Gain dB 18 12 11 S11 dB -13 -11 -18 S22 dB -7 -10 -8 Output P1dB dBm +31 +32 +31.5 Output IP3 dBm +46 +46 +45 IS-95A Channel Power @ -45 dBc ACPR dBm +25. 5 +25.5 W-CDMA Channel Power @ -45 dBc ACPR dBm +23 Noise Figure dB 7.0 5.5 6.2 Supply Bias (3) +5 V @ 450 mA 4. Typical parameters reflect performance in a tuned application circuit at +25

Ordering Information

Part No. Description ECP100D-G 1 Watt InGaP HBT Amplifier (Lead-free/Green/RoHS-compliant 16-pin 4x4mm Pkg.) ECP100D-PCB900 900 MHz Evaluation Board ECP100D-PCB1960 1960 MHz Evaluation Board ECP100D-PCB2140 2140 MHz Evaluation Board 14 13 7 8 N/C RF OUT RF OUT N/C Vref N/C RF IN N/C Vbias N/C N/C N/C N/C N/C N/C N/C

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 2 of 7 April 2006 ECP100D The Communications Edge TM Typical Device Data – ECP100D (QFN 4x4mm Package) S-Parameters (Vcc = +5 V, Icc = 450 mA, T = 25 C, calibrated to device leads) 50 550 1050 1550 2050 2500 Frequency (MHz) Gain / Maximum Stable Gain Gain (dB) DB(|S(2,1)|) DB(GMax()) 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S11 Swp Max 4000MHz Swp Min 50MHz 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S22 Swp Max 4000MHz Swp Min 50MHz Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. S-Parameters (Vcc = +5 V, Icc = 450 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Application Circuit PC Board Layout Circuit Board Material: Top RF layer is .014” Getek, 4 total layers (0.062” thick) for mechanical rigidity 1 oz copper, Microstrip line details: width = .026” , spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning shunt capacitors – C8, C9 and C10. The markers and vias are spaced in .050” increments.

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 3 of 7 April 2006 ECP100D The Communications Edge TM

900 MHz Application Circuit (ECP100D-PCB900)

Typical RF Performance at 25 qC Frequency 900 MHz S21 ± Gain 18 dB S11 ± Input Return Loss -13 dB S22 ± Output Return Loss -7.0 dB Output P1dB +31 dBm Output IP3 (+15 dBm / tone, 1 MHz spacing) +46 dBm Channel Power (@-45 dBc ACPR, IS-95 9 channels fwd) +25.5 dBm Noise Figure 7.0 dB Device / Supply Voltage +5 V Quiescent Current (1) 450 mA 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. CAP ID=C1 C=56 pF CAP ID=C2 C=56 pF CAP ID=C3 C=56 pF CAP ID=C4 C=10000000 pF CAP ID=C5 C=1000 pF CAP ID=C6 C=10 pF CAP ID=C7 C=1000 pF CAP ID=C8 C=8.2 pF CAP ID=C9 C=6.8 pF TLINP ID=FR4 Z0=50 Ohm L=475 mil Eeff=3.16 Loss=0 F0=0 MHz TLINP ID=FR1 Z0=50 Ohm L=175 mil Eeff=3.16 Loss=0 F0=0 MHz RES ID=R1 R=51 Ohm RES ID=R2 R=22 Ohm IND ID=L1 L=33 nH RES ID=R3 R=51 Ohm 5678 13 14 15 16 SUBCKT ID=ECP100D NET="QFN" PORT P=1 Z=50 Ohm PORT P=2 Z=50 Ohm "C" on the WJ evaluation board as shown. This component should be placed at silk screen marker edge of the ECP100D pins to the center of the component.

• The transmission line length are from the evaluation board as shown. silk screen marker "9" on the WJ This component should be placed at +5 V All passive components are of size 0603 unless otherwise noted. size 1008 +5.6 V zener S21 vs. Frequency (MHz) 840 860 880 900 920 940 Frequency (MHz) S21 (dB) +25°C +85°C -40°C S11 vs. Frequency -20 -16 -12 840 860 880 900 920 940 Frequency (MHz) S11 (dB) +25°C +85°C -40°C S22 vs. Frequency -20 -16 -12 840 860 880 900 920 940 Frequency (MHz) S22 (dB) +25°C +85°C -40°C Noise Figure vs. Frequency 840 860 880 900 920 940 Frequency (MHz) NF (dB) +25°C +85°C -40°C P1 dB vs. Frequency 840 860 880 900 920 940 Frequency (MHz) P1 dB (dBm) +25°C +85°C -40°C ACPR vs. Channel Power IS-95, 9 Ch. Fwd, ±885 KHz offset, 30 KHz Meas BW, 900 MHz -70 -65 -60 -55 -50 -45 -40 19 20 21 22 23 24 25 26 27 Output Channel Power (dBm) ACPR (dBc) +25°C +85°C -40°C OIP3 vs. Output Power freq. = 900, 901 MHz, +25°C 10 13 16 19 22 25 Output Power (dBm) OIP3 (dBm) OIP3 vs. Temperature freq. = 900, 901 MHz, +15 dBm -40 -15 10 35 60 85 Temperature (°C ) OIP3 (dBm) OIP3 vs. Frequency +25°C, +15 dBm / tone 840 860 880 900 920 940 Frequency (MHz) OIP3 (dBm) 13 14 15 16 5 6 7 8

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 4 of 7 April 2006 ECP100D The Communications Edge TM

1960 MHz Application Circuit (ECP100D-PCB1960)

Typical RF Performance at 25 qC Frequency 1960 MHz S21 ± Gain 12 dB S11 ± Input Return Loss -11 dB S22 ± Output Return Loss -10 dB Output P1dB +32 dBm Output IP3 (+17 dBm / tone, 1 MHz spacing) +46 dBm Channel Power (@-45 dBc ACPR, IS-95 9 channels fwd) +25.5 dBm Noise Figure 5.5 dB Device / Supply Voltage +5 V Quiescent Current (1) 450 mA 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. CAP ID=C1 C=56 pF CAP ID=C2 C=56 pF CAP ID=C3 C=56 pF CAP ID=C4 C=10000000 pF CAP ID=C5 C=1000 pF CAP ID=C6 C=10 pF CAP ID=C7 C=1000 pF CAP ID=C8 C=.8 pF CAP ID=C9 C=3.3 pF TLINP ID=FR4 Z0=50 Ohm L=150 mil Eeff=3.16 Loss=0 F0=0 MHz TLINP ID=FR1 Z0=50 Ohm L=175 mil Eeff=3.16 Loss=0 F0=0 MHz RES ID=R1 R=51 Ohm RES ID=R2 R=22 Ohm IND ID=L1 L=18 nH RES ID=R3 R=51 Ohm TLINP ID=FR2 Z0=50 Ohm L=300 mil Eeff=3.16 Loss=0 F0=0 MHz CAP ID=C10 C=.8 5678 13 14 15 16 SUBCKT ID=ECP100D NET="QFN" PORT P=1 Z=50 Ohm PORT P=2 Z=50 Ohm "C" on the W J evaluation board as shown. This component should be placed at silk screen marker edge of the ECP100D pins to the center of the component.

• The transmission line length are from the evaluation board as shown. silk screen markers "2" and "3" on the WJ This component sh ould be placed between +5 V All passive components are of size 0603 unless otherwise noted. size 1008 This component should be placed at silk screen marker "9" on the WJ evaluation board as shown. +5.6 V zener S21 vs. Frequency 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) S21 (dB) +25°C +85°C -40°C S11 vs. Frequency -25 -20 -15 -10 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) S11 (dB) +25°C +85°C -40°C S22 vs. Frequency -25 -20 -15 -10 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) S22 (dB) +25 °C +85 °C -40°C Noise Figure vs. Frequency 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) NF (dB) +25°C +85°C -40°C P1 dB vs. Frequency 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) P1 dB (dBm) +25°C +85°C -40°C ACPR vs. Channel Power IS-95, 9 Ch. Fwd. ±885 KHz offset, 30 KHz Meas BW, 1960 MHz -85 -80 -75 -70 -65 -60 -55 -50 -45 -40 15 16 17 18 19 20 21 22 23 24 25 26 27 Output Channel Power (dBm) ACPR (dBc) +25°C +85°C -40°C OIP3 vs. Frequency +25°C, 15 dBm / tone 1930 1940 1950 1960 1970 1980 1990 Frequency (MHz) OIP3 (dBm) OIP3 vs. Temperature freq. = 1960, 1961 MHz, +15 dBm -40 -15 10 35 60 85 Temperature ( °C) OIP3 (dBm) OIP3 vs. Output Power freq. = 1960, 1961 MHz, +25°C 10 12 14 16 18 20 22 Output Power (dBm) OIP3 (dBm) 13 14 15 16 5 6 7 8

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 5 of 7 April 2006 ECP100D The Communications Edge TM

2140 MHz Application Circuit (ECP100D-PCB2140)

Typical RF Performance at 25 qC Frequency 2140 MHz S21 ± Gain 11 dB S11 ± Input Return Loss -18 dB S22 ± Output Return Loss -8.0 dB Output P1dB +31.5 dBm Output IP3 (+15 dBm / tone, 1 MHz spacing) +45 dBm Channel Power (@-45 dBc ACPR, IS-95 9 channels fwd) +23 dBm Noise Figure 6.2 dB Device / Supply Voltage +5 V Quiescent Current (1) 450 mA 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. CAP ID=C1 C=56 pF CAP ID=C2 C=56 pF CAP ID=C3 C=56 pF CAP ID=C4 C=10000000 pF CAP ID=C5 C=1000 pF CAP ID=C6 C=10 pF CAP ID=C7 C=1000 pF CAP ID=C8 C=1.0 pF CAP ID=C9 C=2.4 pF TLINP ID=FR4 Z0=50 Ohm L=175 mil Eeff=3.16 Loss=0 F0=0 MHz TLINP ID=FR1 Z0=50 Ohm L=375 mil Eeff=3.16 Loss=0 F0=0 MHz RES ID=R1 R=51 Ohm RES ID=R2 R=22 Ohm IND ID=L1 L=18 nH RES ID=R3 R=51 Ohm 5678 13 14 15 16 SUBCKT ID=ECP100D NET="QFN" PORT P=1 Z=50 Ohm PORT P=2 Z=50 Ohm "G" on the WJ evaluation board as shown. This component should be placed at silk screen marker edge of the ECP100D pins to the center of the component.

• The transmission line length are from the WJ evaluation board as shown. at silk screen marker "3" on the This component should be placed +5 V All passive components are of size 0603 unless otherwise noted. size 1008 +5.6 V zener S21 vs. Frequency 2110 2120 2130 2140 2150 2160 2170 Frequency (MHz) S21 (dB) +25°C +85°C -40°C S11 vs. Frequency -30 -26 -22 -18 -14 -10 2110 2120 2130 2140 2150 2160 2170 Frequency (MHz) S11 (dB) +25°C +85°C -40°C S22 vs. Frequency -20 -15 -10 2110 2120 2130 2140 2150 2160 2170 Frequency (MHz) S22 (dB) +25°C +85°C -40°C Noise Figure vs. Frequency 2110 2120 2130 2140 2150 2160 2170 Frequency (MHz) NF (dB) +25°C +85°C -40°C P1 dB vs. Frequency 2110 2120 2130 2140 2150 2160 2170 Frequency (MHz) P1 dB (dBm) +25°C +85°C -40°C ACPR vs. Channel Power 3GPP W-CDMA, Test Model 1+64 DPCH, ±5MHz offset, 2140 MHz -65 -60 -55 -50 -45 -40 19 20 21 22 23 24Output Channel Power (dBm) ACPR (dBc) +25°C +85°C -40°C OIP3 vs. Temperature freq. = 2140, 2141 MHz, +15 dBm / tone -40 -15 10 35 60 85 Temperature (°C ) OIP3 (dBm) OIP3 vs. Frequency +25°C, +15 dBm / tone 2110 2120 2130 2140 2150 2160 2170 Frequency (MHz) OIP3 (dBm) OIP3 vs. Output Power freq. = 2140, 2141 MHz, 25°C 10 12 14 16 18 20 22 Output Power (dBm) OIP3 (dBm) 13 14 15 16 5 6 7 8

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 6 of 7 April 2006 ECP100D The Communications Edge TM Application Note: Reduced Bias Configurations The ECP100D, like the AH215-S8 can be configured to operate with lower bias current by varying the bias-adjust resistor ± R1. The recommended circuit configurations shown previously in this datasheet have the device operating in Class A operation. Lowering the current has little effect on the gain, OIP3, and P1dB performance of the device, but will slightly lower the ACLR/ACPR performance of the device as shown below. An example of the measured data below represents the AH215- S8 measured and configured for 2.14 GHz applications. It is expected that variation of the bias current for other frequency applications will produce similar performance results. AH215S8-PCB2140 Performance Data (ohms) Icq (mA) Pdiss (W) P1dB (dBm) OIP3 (dBm) 51 450 2.25 +31.0 +47.1 68 400 2.00 +30.9 +46.4 100 350 1.75 +30.8 +46.4 130 300 1.50 +30.6 +45.5 180 250 1.25 +30.5 +43.6 CAP ID=C1 C=56 pF CAP ID=C2 C=56 pF CAP ID=C3 C=56 pF CAP ID=C4 C=10000000 pF CAP ID=C5 C=1000 pF CAP ID=C6 C=10 pF CAP ID=C7 C=1000 pF CAP ID=C8 C=1.0 pF CAP ID=C9 C=2.4 pF TLINP ID=FR4 Z0=50 Ohm L=175 mil Eeff=3.16 Loss=0 F0=0 MHz TLINP ID=FR1 Z0=50 Ohm L=375 mil Eeff=3.16 Loss=0 F0=0 MHz RES ID=R1 R=51 Ohm RES ID=R2 R=22 Ohm IND ID=L1 L=18 nH RES ID=R3 R=51 Ohm 5678 13 14 15 16 SUBCKT ID=ECP100D NET="QFN" PORT P=1 Z=50 Ohm PORT P=2 Z=50 Ohm "G" on the WJ evaluation board as shown. This component should be placed at silk screen marker edge of the ECP100D pins to the center of the component.

• The transmission line length are from the WJ evaluation board as shown. at silk screen marker "3" on the This component should be placed +5 V All passive components are of size 0603 unless otherwise noted. size 1008 +5.6 V zener 2.14GHz Gain vs. Output Power 8.5 9.5 10.5 11.5 16 18 20 22 24 26 28 30 32 Output Power (dBm) Gain (dB) Idq=450mA 'Class A' Idq=400mA Idq=350mA Idq=300mA Idq=250mA 2.14GHz OIP3 vs. Output Power per Tone 10 12 14 16 18 20 22 24 Power Out per Tone (dBm) OIP3 (dBm) Idq=450mA 'Class A' Idq=400mA Idq=350mA Idq=300mA Idq=250mA W-CDMA ACLR vs. Output Channel Power 3GPP W-CDMA, Test Model 1 + 64 DPCH, ±5 MHz offset -65 -60 -55 -50 -45 -40 -35 12 14 16 18 20 22 24 W-CDMA Channel Power Out (dBm) ACLR (dBc) Idq=450mA 'Class A' Idq=400mA Idq=350mA Idq=300mA Idq=250mA CW PAE vs. Output Power 100 16 18 20 22 24 26 28 30 32 CW Tone Power Out (dBm) PAE (%) Idq=450mA 'Class A' Idq=400mA Idq=350mA Idq=300mA Idq=250mA

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 7 of 7 April 2006 ECP100D The Communications Edge TM ECP100D-G Mechanical Information This package is Lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded (maximum 245 qC reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 qC Thermal Resistance, Rth (1) 33 qC / W Junction Temperature, Tj (2) 159 qC Notes: 1. The thermal resistance is referenced from the junction-to-case at a case temperature of 85 C. Tjc is a function of the voltage at pins 10 and 11 and the current applied to pins 10, 11, and 16 and can be calculated by: Tj = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 450 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. Product Marking The component will be marked with an “ E100G” designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an “ EC100D” designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 2 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. A heatsink underneath the area of the PCB for the mounted device is recommended for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135º ) diameter drill and have a final plated thru diameter of .25 mm (.010º ). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 100 1000 10000 100000 1000000 50 60 70 80 90 100 Tab temperature (° C) MTTF (million hrs)