ECP053 WJCI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 3

Technical content

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com August 2004 ECP053 ½ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM Product Features

  • 2300 – 2700 MHz
  • +28 dBm P1dB
  • +43 dBm Output IP3
  • 13 dB Gain @ 2450 MHz
  • Single Positive Supply (+5V)
  • Available in SOIC-8 or 16pin 4mm QFN package

Applications

  • W-LAN
  • RFID
  • DMB
  • Fixed Wireless Product Description The ECP053 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance for various narrowband-tuned application circuits with up to +43 dBm OIP3 and +28 dBm of compressed 1dB power. It is housed in an industry standard SOIC-8 or 16-pin 4x4mm QFN SMT package. All de vices are 100% RF and DC tested. The ECP053 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the ECP053 to maintain high linearity over temperature and operate directly off a si ngle +5V supply. This combination makes the device an excellent candidate for driver amplifier stages in wireless-LAN, digital multimedia broadcast, or fixed wireless applications. The device can also be used in next generation RFID readers. Functional Diagram ECP053D ECP053G Specifications (1) Parameter Units Min Typ Max Operational Bandwidth MHz 2300 2700 Test Frequency MHz 2450 Gain dB 13 Input Return Loss dB 20 Output Return Loss dB 8 Output P1dB dBm +27 Output IP3 (2) dBm +42 Noise Figure dB 5.3 Test Frequency MHz 2600 Gain dB 12 Input Return Loss dB 23 Output Return Loss dB 8 Output P1dB dBm +27 Output IP3 (2) dBm +42 Operating Current Range, Icc (3) mA 200 250 300 Device Voltage, Vcc V +5 Test conditions unless otherwise noted. 1. T = 25ºC, Vsupply = +5 V, Frequency = 2650 MHz, in tuned application circuit. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 50 mA at P1dB. Pin 1 is used as a reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 12mA of current when used with a series bias resistor of R1=100Ω. (ie. total device current typically will be 262 mA.) Absolute Maximum Rating Ordering Information Parameters Rating Part No. Description Operating Case Temperature -40 to +85 °C ECP053D ½ Watt InGaP HBT Amplifier (16p 4mm Pkg) Storage Temperature -65 to +150 °C ECP053G ½ Watt InGaP HB T Amplifier (Soic-8 Pkg) RF Input Power (continuous) +28 dBm ECP053D-PCB2450 2450 MHz Evaluation Board Device Voltage +8 V ECP053D-PCB2600 2600 MHz Evaluation Board Device Current 400 mA ECP053G-PCB2450 2450 MHz Evaluation Board Device Power 2 W ECP053G-PCB2600 2600 MHz Evaluation Board Operation of this device above any of these parameters may cause permanent damage. 16 15 14 13 5 6 7 8 N/C RF OUT RF OUT N/C Vref N/C RF IN N/C Vbias N/C N/C N/C N/C N/C N/C N/C Vref N/C RF IN N/C Vbias RF OUT RF OUT N/C

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com August 2004 ECP053 1/2 Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM ECP053G (SOIC-8 Package) Mechanical Information Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 ° C Thermal Resistance, Rth (1) 62 ° C / W Junction Temperature, Tjc (2) 162 ° C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85 ° C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85 ° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. Product Marking The component will be marked with an “ECP053G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Functional Diagram Function Pin No. Vref 1 Input 3 Output 6, 7 Vbias 8 GND Backside Paddle N/C or GND 2, 4, 5 Mounting Config. Notes 1. A heatsink underneath the ar ea of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be adde d near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8 All dimensions are in millimeters (inches). Angles are in degree MTTF vs. GND Tab Temperature 100 1000 10000 100000 60 70 80 90 100 110 120 Tab Temperature (°C) MTTF (million hrs)

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com August 2004 ECP053 1/2 Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM ECP053D (16-pin 4x4mm Package) Mechanical Information Outline Drawing Land Pattern 0.65mm TYP. TYP. SOLDERMASK SWELL TO BE 0.5mm FROM OUTSIDE EDGE OF ALL PADS GROUND PLANE AREA FOR VIAS 2.23mm X 2.23mm RECOMMENDED PAD 0.76mm X 0.34mm DEVICE GROUND PAD 2.0mm X 2.0mm 4.00mm 16L 4.0mm X 4.0mm PACKAGE 0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO BOTTOM, AND INTERNAL GROUIND PLANES IN ORDE MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MA VIA BARREL PLATTING TO BE MIN. 0.0014 THICK. VIA PLUGGED WITH EITHER CONDUCTIVE OR NON-COND EPOXY TO PREVENT SOLDER. DRAINS THROUGH VI REFLOW PROCESS Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 ° C Thermal Resistance, Rth (1) 62 ° C / W Junction Temperature, Tjc (2) 162 ° C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85 ° C. Tjc is a function of the voltage at pins 10 and 11 and the current applied to pins 10, 11, and 16 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85 ° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. Product Marking The component will be marked with an “ECP053D” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Functional Diagram Function Pin No. Vref 1 RF Input 3 RF Output 10, 11 Vbias 16 GND Backside Paddle N/C or GND 2, 4-9, 12-15 Mounting Config. Notes 1. A heatsink underneath the ar ea of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be adde d near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8 All dimensions are in millimeters (inches). Angles are in degrees. 16 15 14 13 5 6 7 8 N/C RF OUT RF OUT N/C Vref N/C RF IN N/C Vbias N/C N/C N/C N/C N/C N/C N/C MTTF vs. GND Tab Temperature 100 1000 10000 100000 60 70 80 90 100 110 120 Tab Temperature (°C) MTTF (million hrs)