ECGLBXXCG E-CMOS | Alldatasheet
Document overview
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Technical content
Features
◆ 450 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects one I/O line (bidirectional) ◆ Low clamping voltage ◆ Working voltages: 3.3V, 5V, 8V, 12V, 15V, 24V ◆ Low leakage current Mechanical Characteristics ◆ JEDEC SOD-323 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 5 Millgrams (Approximate) ◆ Quantity Per Reel : 3,000pcs ◆ Reel Size : 7 inch ◆ Lead Finish : Lead Free
Low Capacitance TVS Diode Array ECGLBxxCG Device Characteristics MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) PARAMETER SYMBOL VALUE UNITS Peak Pulse Power (tp=8/20µs waveform) PPP 450 Watts Lead Soldering Temperature TL 260 (10 sec.) ℃ Operating Temperature Range TJ -55 ~ 150 ℃ Storage Temperature Range TSTG -55 ~ 150 ℃ ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) PART NUMBER DEVICE MARKING VRWM (V) (max.) VB (V) (min.) IT (mA) VC @1A (max.) VC (max.) (@A) IR (µA) (max.) CT (pF) (typ.) ECGBL03CG A3 3.3 4.0 1 5.8 18.0 25 1 3 ECGBL05CG A5 5.0 6.0 1 9.8 21.0 23 1 3 ECGBL08CG A8 8.0 8.5 1 13.4 23.0 20 1 3 ECGBL12CG AD 12.0 13.3 1 19.0 30.0 14 1 3 ECGBL15CG AE 15.0 16.7 1 24.0 39.0 10 1 3 ECGBL24CG AH 24.0 26.7 1 43.0 56.0 7 1 3
Low Capacitance TVS Diode Array ECGLBxxCG SOLDERING FOOTPRINT