ECG014

AH110-RFID WJCI | Alldatasheet

Document overview

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 7 June 2005 AH110 / ECG014

0.2 Watt, High Linearity InGaP HBT Amplifier Product Information

• 50 – 2000 MHz
• +23 dBm P1dB
• +39 dBm Output IP3
• 20.5 dB Gain @ 900 MHz
• 17.6 dB Gain @ 1900 MHz
• Single Positive Supply (+8V)
• Available in a lead-free / green

Applications

• Mobile Infrastructure
• Defense/Homeland Security Product Description The AH110 / ECG014 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve performance over a broad range with +39 dBm OIP3 and +23 dBm of compressed 1-dB power. It is housed in a lead- free/green/RoHS-compliant SOT-89 SMT package. All devices are 100% RF and DC tested. The product is targeted for use as a gain block/driver amplifier for various current and next generation wireless technologies such as GPRS, GSM and CDMA, where high linearity and medium power is required. In addition, the AH110 / ECG014 will work for numerous other applications within the 50 to 2000 MHz frequency range. Functional Diagram RF IN GND RF OUT GND 1 23 Function Pin No. Input / Base 1 Output / Collector 3 Ground 2, 4 Specifications (1) Parameters Units Min Typ Max Operational Bandwidth MHz 50 2000 Test Frequency MHz 900 Gain dB 20.5 Output P1dB dBm +23 Output OIP3 dBm +39 Test Frequency MHz 1900 Gain dB 17 17.6 Input Return Loss dB 17 Output Return Loss dB 7.4 Output P1dB dBm +23 Output IP3 (2) dBm +36.5 +38 IS-95A Channel Power @ -45 dBc ACPR, 1900 MHz dBm +16 Noise Figure dB 5.2 Operating Current Range (3) mA 85 100 135 Device Voltage (4) V 5 1. Test conditions unless otherwise noted: 25 °C, Vsupply = +8V, in tuned application circuit with Rbias = 30 Ω. 2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. The tuned application circuit is tuned for optimum ACPR performance. An improvement in OIP3 of 2 to 3 dB can be achieved for tuning for optimum OIP3 (with slightly degraded ACPR performance). 3. This corresponds to the quiescent current or operating current under small-signal conditions. 4. This device requires a minimum 7 V power supply through a dropping resistor. 8 V and 30 ohms are recommended for proper operation. Operation of the device directly to a 5 V supply could lead to thermal damage to the device. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 °C Storage Temperature -55 to +150 °C RF Input Power (continuous) +15 dBm Device Voltage +6 V Device Current 150 mA Junction Temperature +250 °C Operation of this device above any of these parameters may cause permanent damage. Typical Performance (5) Parameters Units Typical Frequency MHz 900 1900 S21 – Gain dB 20.5 17.6 S11 – Input R.L. dB -20 -17 S22 – Output R.L. dB -9.5 -7.4 Output P1dB Output IP3 (2) dBm dBm +22.8 +39 +23 +38 IS-95A Channel Power (6) dBm +17 +16 Noise Figure dB 5 5.2 Supply Bias +8 V @ 100 mA 5. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +8 V, Icc = 100 mA, +25° C, Rbias = 30 Ω. 6. This is measured with an IS-95 signal at (9 ch. Fwd)–45dBc ACPR.

Ordering Information

Part No. Description AH110-89* InGaP HBT Gain Block (lead-tin SOT-89 Pkg) ECG014B* InGaP HBT Gain Block (lead-tin SOT-89 Pkg) AH110-89G InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 Pkg) AH110-89PCB900 900 MHz Evaluation Board AH110-89PCB1900 1900 MHz Evaluation Board * This package is being phased out in favor of the green package type which is backwards compatible for existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website.

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 7 June 2005 AH110 / ECG014 Typical Device Data S-parameters (Vdevice = +5V, Icc = 100 mA, 25° C, unmatched 50 ohm system) 0 0.5 1 1.5 2 Frequency (GHz) Gain / Maximum Stable Gain Gain (dB) DB(|S[2,1]|) DB(GMax) 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S11 Swp Max 2.01283GHz Swp Min 0.01483GHz 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S22 Swp Max 2.01283GHz Swp Min 0.01483GHz Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in blue color. For a tuned circuit for a particular f requency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 50 – 2500 MHz, with markers placed at 0.25 – 2 GHz in 0.25 GHz increments. S-Parameters (Vdevice = +5 V, Icc = 100 mA, T = 25° C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014” Getek, 4 - layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning shunt capacitors. The markers and vias are spaced in .050” increments. C7/C8 are for 900 MHz matching circuits and C9/C12 are for 1900 MHz matching circuits. C8C7 C9C12

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 7 June 2005 AH110 / ECG014

900 MHz Application Circuit (AH110-89PCB900)

Typical RF Performance at 25°°°°C ∗ Please see note 2 on page 1. RES ID=R3 R=220 Ohm CAP ID=C4 C=56 pF CAP ID =C5 C=56 pF CAP ID=C1 C=56 pF IND ID=L2 L= 33 nH RES ID=R1 R=30 Ohm IND ID=L1 L=10 nH CAP ID=C2 C=1000 pF CAP CAP ID=C6 C=56 pF RES ID=R4 R=22 Ohm DIODE1 ID=D1 CAP ID=C8 C=0.8 pF CAP ID=C7 C=5.6 pF RES ID=R5 R=50 Ohm RES ID=R2 R=390 Ohm SUBCKT NET="AH110" PORT P=2 Z=50 Ohm PORT P=1 Z=50 Ohm +8 V ID=C3 C=.1uF a system using a DC regulator. boards. It is not specifically required in the final circuit layout in The diode D1 is used as over-voltage protection on the evaluation 8.2 v C7 is placed at silkscreen marker ‘C’ or center of component placed at 5.6 deg. @ 900 MHz away from pin 1. C8 is placed at 22 deg. @ 900 MHz away from pin 3. S21 vs. Frequency 840 860 880 900 920 940 Frequency (MHz) S21 (dB) +25°C +85°C -40°C S11 vs. Frequency -40 -35 -30 -25 -20 -15 -10 840 860 880 900 920 940 Frequency (MHz) S11 (dB) +25°C +85°C -40°C S22 vs. Frequency -25 -20 -15 -10 840 860 880 900 920 940 Frequency (MHz) S22 (dB) +25°C +85°C -40°C Noise Figure vs. Frequency 840 860 880 900 920 940 Frequency (MHz) NF (dB) +25°C +85°C -40°C P1 dB vs. Frequency 840 860 880 900 920 940 Frequency (MHz) P1 dB (dBm) +25°C +85°C -40°C ACPR vs. Channel Power IS-95, 9 Ch. Fw d, ±885 KHz offset, 30 KHz Meas. BW, 900 MHz -70 -65 -60 -55 -50 -45 -40 12 13 14 15 16 17 18 Output Channel Power (dBm) ACPR (dBc) +25°C +85°C -40°C OIP3 vs. Frequency +25°C, +9 dBm / tone 840 860 880 900 920 940 Frequency (MHz) OIP3 (dBm) OIP3 vs. Temperature Fre. = 900, 901 MHz, +9 dBm / tone -40 -15 10 35 60 85 Temperature (°C) OIP3 (dBm) OIP3 vs. Output Power Freq. = 900, 901 MHz, +25°C 6 7 8 9 10 11 12 13 14 Output Power (dBm) OIP3 (dBm) Frequency 900 MHz S21 – Gain 20.5 dB S11 – Input Return Loss -20 dB S22 – Output Return Loss -9.5 dB Output P1dB +22.8 dBm Output IP3∗ (+9 dBm / tone, 1 MHz spacing) +39 dBm Channel Power (@-45 dBc ACPR, IS-95 9 channels fwd) +17 dBm Noise Figure 5 dB Device Voltage +5 V Quiescent Current 100 mA

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 7 June 2005 AH110 / ECG014

1960 MHz Application Circuit (AH110-89PCB1960)

Typical RF Performance at 25°°°°C ∗ Please see note 2 on page 1. IND ID=L3 L=1 nH RES ID=R3 R=220 Ohm CAP ID=C4 C=56 pF CAP ID=C5 C=56 pF CAP ID=C1 C=56 pF IND ID=L2 L=15 nH RE S ID=R1 R= 30 Ohm IND ID=L1 L=15 nH CAP ID=C2 C=1000 pF CAP CAP ID=C6 C=56 pF RES ID=R4 R=22 Ohm DIODE1 ID=D1 CA P ID=C9 C=1.5 pF CAP ID =C12 C=0.7 pF RES ID=R2 R=390 Ohm SUBCKT NET="AH110" PORT P=2 Z=50 Ohm PORT P=1 Z=50 Ohm +8 V ID=C3 C=.1uF a system using a DC regulator. boards. It is not specifically required in the final circuit layout in The diode D1 is used as over-voltage protection on the evaluation 8.2 v C9 placed at silkscreen marker ‘8” or center of component placed at 39 deg. @ 1900 MHz away from pin 1. C12 is placed at silkscreen marker ‘I” or center of component placed at 43 deg. @ 1.9 GHz away from pin 1. S21 vs. Frequency 1850 1870 1890 1910 1930 1950 1970 1990 Frequency (MHz) S21 (dB) +25°C +85°C -40°C S11 vs. Frequency -25 -20 -15 -10 1850 1870 1890 1910 1930 1950 1970 1990 Frequency (MHz) S11 (dB) +25°C +85°C -40°C S22 vs. Frequency -12 -10 1850 1870 1890 1910 1930 1950 1970 1990 Frequency (MHz) S22 (dB) +25°C +85°C -40°C Noise Figure vs. Frequency 1850 1870 1890 1910 1930 1950 1970 1990 Frequency (MHz) NF (dB) +25°C +85°C -40°C P1 dB vs. Frequency 1850 1870 1890 1910 1930 1950 1970 1990 Frequency (MHz) P1 dB (dBm) +25°C +85°C -40°C AC PR vs. Channel Power IS-95, 9 Ch. Fwd. ±885 KHz offset, 30 KHz Meas. BW, 1900 MHz -70 -65 -60 -55 -50 -45 -40 -35 10 11 12 13 14 15 16 17 18 Output Power (dBm) ACPR (dBc) OIP3 vs. Frequency +25°C, +9 dBm / tone 1850 1870 1890 1910 1930 1950 1970 1990 Frequency (MHz) OIP3 (dBm) OIP3 vs. Temperature freq. = 1900, 1901 MHz, +9 dBm / tone -40 -15 10 35 60 85 Temperature (°C) OIP3 (dBm) OIP3 vs. Output Power Freq. = 1900, 1901 MHz, 25°C 6 7 8 9 10 11 12 13 14 Output Power (dBm) OIP3 (dBm) Frequency 1960 MHz S21 – Gain 17.6 dB S11 – Input Return Loss -17 dB S22 – Output Return Loss -7.4 dB Output P1dB +23 dBm Output IP3∗ (+9 dBm / tone, 1 MHz spacing) +38 dBm Channel Power (@-45 dBc ACPR, IS-95 9 channels fwd) +16 dBm Noise Figure 5.2 dB Device Voltage +5 V Quiescent Current 100 mA

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 5 of 7 June 2005 AH110 / ECG014 AH110 (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 ° C Thermal Resistance, Rth (1) 128 ° C / W Junction Temperature, Tjc (2) 149 ° C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85 ° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. Product Marking The component will be marked with an “AH110” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 6 of 7 June 2005 AH110 / ECG014 AH110-89G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Land Pattern Product Marking The component will be marked with an “AH110G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 ° C Thermal Resistance, Rth (1) 128 ° C / W Junction Temperature, Tjc (2) 149 ° C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85 ° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. MTTF vs. GND Tab Temperature 100 1000 10000 100000 60 70 80 90 100 110 120 Tab Temperature (°C)

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 7 of 7 June 2005 AH110 / ECG014 ECG014B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 ° C Thermal Resistance, Rth (1) 128 ° C / W Junction Temperature, Tjc (2) 149 ° C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85 ° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. Product Marking The component will be marked with an “E014” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.