ECG012 WJCI | Alldatasheet

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 4 October 2006 ECG012

0.1 Watt, High Linearity InGaP HBT Amplifier Product Information

The Communications Edge TM Product Features 60 – 2500 MHz

  • +20 dBm P1dB
  • +36 dBm Output IP3
  • 14 dB Gain @ 900 MHz
  • 12.5 dB Gain @ 1900 MHz
  • Single Positive Supply (+3V)
  • Available in a lead-free / green

Applications

Final stage amplifiers for Repeaters

  • Mobile Infrastructure
  • CATV / DBS
  • Defense / Homeland Security Product Description The ECG012 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance across a br oad range with +36 dBm OIP3 and +20 dBm of compressed 1dB power. It is housed in a lead-free/green/RoHS- compliant SOT-89 SMT package. All devices are 100% RF and DC tested. The ECG012 is targeted for use as a driver amplifie r in wireless infrastructure where high linearity and me dium power is required. An internal active bias allows the ECG012 to maintain high linearity over temperature and operate directly off a single +3 V supply. This combination makes the device an excellent candidate for transceiver line cards in current and next generati on multi-carrier 3G base stations. Functional Diagram RF IN GND RF OUT GND 1 2 3 Function Pin No. Input 1 Output/Bias 3 Ground 2, 4 Specifications (1) Parameters Units Min Typ Max Operational Bandwidth MHz 60 2500 Test Frequency MHz 1900 Gain dB 11 12.5 Input Return Loss dB 15 Output Return Loss dB 10 Output P1dB dBm +20 Output IP3 (2) dBm +36 IS-95A Channel Power @ -45 dBc ACPR dBm +13 Noise Figure dB 4.9 Operating Current Range mA 65 100 145 Device Voltage V +3 1. Test conditions unless otherwise noted: 25 ºC, Vsupply = +3 V, in a tuned application circuit. 2. 3OIP measured with two tones at an output power of +6 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 °C Storage Temperature -65 to +150 °C RF Input Power (continuous) +15 dBm Device Voltage +6 V Device Current 220 mA Junction Temperature +250 °C Operation of this device above any of these parameters may cause permanent damage. Typical Performance (3) Parameters Units Typical Frequency MHz 900 1900 2140 S21 - Gain dB 14 12.5 11.5 S11 - Input R.L. dB -14 -15 -15 S22 - Output R.L. dB -10 -10 -10 Output P1dB dBm +20 +20 +20 Output IP3 dBm +35 +36 +36 Noise Figure dB 4.7 4.9 5.4 Supply Bias +3 V @ 100 mA 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +3 V, I = 100 mA, +25 °C

Ordering Information

Part No. Description ECG012B-G 0.1 Watt, High Linearity InGaP HBT Amplifier (lead-free/green/RoHS-compliant SOT-89 Pkg) ECG012B-PCB900 900 MHz Evaluation Board ECG012B-PCB1900 1900 MHz Evaluation Board ECG012B-PCB2140 2140 MHz Evaluation Board

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 4 October 2006 ECG012 The Communications Edge TM Typical Device Data S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 °C, unmatched 50 ohm system) 0 1000 2000 3000 Frequency (MHz) Gain / Maximum Stable Gain Gain (dB) DB(|S(2,1)|) DB(GMax()) 1.0 1.0 -1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S11 Swp Max 3000MHz Swp Min 50MHz 1.0 1.0 -1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S22 Swp Max 3000MHz Swp Min 50MHz Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 50 – 3000 MHz, w ith markers placed at 0.5 – 3.0 GHz in 0.5 GHz incr ements. S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 °C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014” Getek, 4 layers (other layers added for rigidity), .062” total thickness , 1 oz copper Microstrip line details: width = .026”, spacing = .026”

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 4 October 2006 ECG012 The Communications Edge TM

900 MHz Application Circuit (ECG012B-PCB900)

S21 – Gain 14 dB S11 – Input Return Loss -14 dB S22 – Output Return Loss -10 dB Output IP3 (+6 dBm / tone, 1 MHz spacing) +35 dBm Output P1dB +20 dBm Noise Figure 4.7 dB Supply Voltage +3 V Supply Current 100 mA Measured parameters were taken at 25 °C. CAP ID=C4 C=56 pF CAP ID=C5 C=56 pF CAP ID=C9 C=1 pF DIODE1 ID=D1 CAP ID=C3 C=1000 pF CAP ID=C2 C=56 pF CAP ID=C1 C=100000 pF IND ID=L1 L=33 nH RES ID=L2 R=0 Ohm CAP ID=C7 C=5.6 pF RES ID=L3 R=0 Ohm RES ID=R1 R=820 Ohm SUBCKT ID=U1 NET="ECG012" PORT P=1 Z=50 Ohm PORT P=2 Z=50 Ohm Vcc = +3 V 5.6 V C7 should be placed at the silk screen marker 'F' on the WJ evaluation board. All passive components are of size 0603 unless otherwise noted. C9 should be placed between on the WJ evaluation board. size 1206 size 0805 The capacitor should be placed 19° @ 0.9GHz from pin 3 The capacitor should be placed 13.7° @ 0.9GHz from pin 1 of the ECG012 silk screen markers '8' and '9' size 0603 The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. of the ECG012. L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout.

1900 MHz Application Circuit (ECG012B-PCB1900)

S21 – Gain 12.5 dB S11 – Input Return Loss -15 dB S22 – Output Return Loss -10 dB Output IP3 (+6 dBm / tone, 1 MHz spacing) +36 dBm Output P1dB +20 dBm Noise Figure 4.9 dB Supply Voltage +3 V Supply Current 100 mA Measured parameters were taken at 25 °C. CAP ID=C4 C=56 pF CAP ID=C5 C=56 pF CAP ID=C9 C=1.2 pF DIODE1 ID=D1 CAP ID=C3 C=1000 pF CAP ID=C2 C=56 pF CAP ID=C1 C=100000 pF CAP ID=C7 C=2.4 pF IND ID=L1 L=18 nH RES ID=L3 R=0 Ohm RES ID=L2 R=0 Ohm RES ID=R1 R=820 Ohm SUBCKT ID=U1 NET="ECG012" PORT P=1 Z=50 Ohm PORT P=2 Z=50 Ohm Vcc = +3 V 5.6 V C7 should be placed at the silk screen marker 'A' on the WJ evaluation board. All passive components are of size 0603 unless otherwise noted. C9 should be placed at on the WJ evaluation board. size 1206 size 0805 The capacitor should be placed 34° @ 1.9GHz from pin 3 The capacitor should be placed 4.6° @ 1.9GHz from pin 1 of the ECG012 silk screen marker '7' The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. of the ECG012. L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout.

2140 MHz Application Circuit (ECG012B-PCB2140)

S21 – Gain 11.5 dB S11 – Input Return Loss -15 dB S22 – Output Return Loss -10 dB Output IP3 (+6 dBm / tone, 1 MHz spacing) +34 dBm Output P1dB +20 dBm Noise Figure 5.4 dB Supply Voltage +3 V Supply Current 100 mA Measured parameters were taken at 25 °C. CAP ID=C4 C=56 pF CAP ID=C5 C=56 pF CAP ID=C9 C=.8 pF DIODE1 ID=D1 CAP ID=C3 C=1000 pF CAP ID=C2 C=56 pF CAP ID=C1 C=100000 pF IND ID=L1 L=18 nH RES ID=L3 R=0 Ohm CAP ID=C6 C=1.5 pF CAP ID=L2 C=2 pF RES ID=R1 R=820 Ohm SUBCKT ID=U1 NET="ECG012" PORT P=1 Z=50 Ohm PORT P=2 Z=50 Ohm Vcc = +3 V 5.6 V C6 should be placed between silk screen markers 'E' & 'F' on the WJ evaluation board. All passive components are of size 0603 unless otherwise noted. C9 should be placed at on the WJ evaluation board. size 1206 size 0805 The capacitor should be placed 14.2° @ 2.14GHz from pin 3 The capacitor should be placed 28.9° @ 2.14GHz from pin 1 of the ECG012 silk screen marker '3' The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. of the ECG012. L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. configuration. Component R1 is shown in the silkscreen but is not used for this

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 4 October 2006 ECG012 The Communications Edge TM ECG012B-G Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 °C Thermal Resistance, Rth (1) 149 °C / W Junction Temperature, Tj (2) 130 °C Notes: 1. The thermal resistance is referenced from the junction- to-case at a case temperature of 85 °C. 2. This corresponds to the typical biasing conditio n of +3V, 100 mA at an 85 °C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 °C. Product Marking The component will be marked with an “E012G” designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an “E012” designator followed by an alphanumeric lot code. Tape and reel specification for this part is located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 100 1000 10000 60 70 80 90 100 110 120 Tab Temperature (° C)