ECG008 WJCI | Alldatasheet

Document overview

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 4 April 2007 ECG008 InGaP HBT Gain Block Product Features

  • DC – 4 GHz
  • +24 dBm P1dB at 1 GHz
  • +40 dBm OIP3 at 1 GHz
  • 15 dB Gain at 1 GHz
  • 4.6 dB Noise Figure
  • Available in Lead-free / green
  • Internally matched to 50 Ω

Applications

  • Mobile Infrastructure
  • CATV / FTTX
  • W-LAN / ISM
  • RFID
  • WiMAX / WiBro Product Description The ECG008 is a general-purpose buffer amplifier that offers high d ynamic range in a low-cost surface-mount package. At 1000 MHz, the ECG008 typically provides 15 dB of gain, +40 dBm Output IP3, and +24 dBm P1dB. The ECG008 consists of Darlington p air amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a lead- free/green/RoHS-compliant SOT-89 p ackage. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the ECG008 will work for other various applications within the DC to 4 GHz frequency range such as CATV and mobile wireless. Functional Diagram RF IN GND RF OUT GND 1 2 3 Function Pin No. Input 1 Output/Bias 3 Ground 2, 4 Specifications (1) Parameter Units Min Typ Max Operational Bandwidth MHz DC 4000 Test Frequency MHz 1000 Gain dB 15 Output P1dB dBm +24 Output IP3 (3) dBm +40 Noise Figure dB 4.6 Test Frequency MHz 2000 Gain dB 13 14.3 Input Return Loss dB 25 Output Return Loss dB 14 Output P1dB dBm +23 Output IP3 (2) dBm +34 +37 Noise Figure dB 4.8 Device Voltage V 6.8 7.3 7.8 Device Current mA 120 Output mismatch w/o spurs VSWR 10:1 1. Test conditions unless otherwise noted: 25 ºC, Supply voltage = +9 V, Rbias = 14 Ω , 50 Ω system. 2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 °C Storage Temperature -65 to +150 °C RF Input Power (continuous) +15 dBm Device Current 160 mA Junction Temperature +250 °C Operation of this device above any of these parameters may cause permanent damage. Typical Performance (1) Parameter Units Typical Frequency MHz 500 900 1900 2140 S21 dB 14.7 14.6 14.3 14.3 S11 dB -26 -28.5 -28 -19.5 S22 dB -19.4 -17.4 -13.4 -15 Output P1dB dBm +24.3 +24 +23.3 +19.0 Output IP3 dBm +41 +40 +37 +30.5 Noise Figure dB 4.7 4.6 4.7 4.8

Ordering Information

Part No. Description ECG008B-G InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 package) ECG008B-PCB 700 – 2400 MHz Fully Assembled Eval. Board

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 4 April 2007 ECG008 InGaP HBT Gain Block Typical Device RF Performance (3) Supply Bias = +9 V, Rbias = 14 ΩΩ , Icc = 120 mA Frequency MHz 100 500 900 1900 2140 2400 3500 5800 S22 dB -20 -19 -17 -13 -13 -12 -7.9 -2.7 Output IP3 dBm +41.6 +41 +40 +37 +36 +34 1. Test conditions: T = 25º C, Supply Voltage = +9 V, Device Voltage = 7.3 V, Rbias = 14 Ω , Icc = 120 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3. Gain vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) Gain (dB) +25°C -40°C +85°C S11, S22 vs. Frequency -40 -35 -30 -25 -20 -15 -10 0 1 2 3 4 5 6 Frequency (GHz) S11, S22 (dB) S11 S22 Vde vs. Icc 100 120 140 Vde (V) Icc (mA) +25°C OIP3 vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) Ouput IP3 (dBm) +25°C -40°C +85°C Noise Figure vs. Frequency 2.5 3.5 4.5 500 1000 1500 2000 Frequency (MHz) NF (dB) P1dB vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) P1dB (dBm) +25°C -40°C +85°C S-Parameters (Vdevice = +7.3 V, ICC = 120 mA, T = 25°C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Device S-parameters are available for download off of the website at: http://www.wj.com

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 4 April 2007 ECG008 InGaP HBT Gain Block Recommended Application Circuit Recommended Component Values Reference Frequency (MHz) Designator 50 500 900 1900 2200 2500 3500 L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH C1, C2, C3 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The c omponent values in the table below are c ontained on the evaluation board to achieve optimal broadband performance. 3. R1 and R2 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures of unconditional stability with the use of the device. It is expected that li nearity parameters (OIP3 and P1dB) to degrade about only 0.5 dB, while overall gain will be about 2 dB less than the performance shown in page 1 and 2 of this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz. Ref. Desig. Value / Type Size L1 39 nH wirewound inductor 0603 C1, C2 56 pF chip capacitor 0603 C3 0.018 µ F chip capacitor 0603 C4 Do Not Place R1 18 Ω chip resistor 0603 R2 4.7 Ω chip resistor 0603 R3 14 Ω 1% tolerance 2010 Recommended Bias Resistor Values Supply Voltage R3 value Size

9 V 14 ohms 2010

10 V 23 ohms 2512

12 V 39 ohms 2512

The proper value for R3 is dependent upon the supply voltage a nd allows for bias s tability over temperature. WJ recommends a minimum supply bias of +9 V. A 1% tolerance resistor is recommended. ECG008B-PCB Performance Data (WJ’s evaluation board uses the circuit shown above.) Gain 0 1 2 3 4 Frequency (GHz) Return L oss -30 -20 -10 0 1 2 3 4 Frequency (GHz) S 11 S 22 Blocking Capacitor RF OUT RF Choke 0.018 µF Bias Resistor RF IN Bypass Capacitor Blocking Capacitor Vcc Icc = 120 mA ECG008B 18 Ω 4.7 Ω

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 4 April 2007 ECG008 InGaP HBT Gain Block ECG008B-G Mechanical Information This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 °C Thermal Resistance, Rth 86 °C/W Product Marking The c omponent will be marked with an “ E008G” designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead p ackage is marked with an “ E008” designator followed b y an alphanumeric lot code; it may also have been marked with an “ 6” designator followed by a 3-digit numeric lot code. Tape and reel specifications for this part are located o n the website in the “ Application Notes” section. MSL / ESD Rating ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should u se a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that t he ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.