ECG008B-G

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Document overview

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Technical content

Datasheet: Rev B 12/04/14 - 1 of 7 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com

Applications

 Wireless Infrastructure  CATV / SATV / MoCA  Point to Point  Defense & Aerospace  Test & Measurement Equipment  General Purpose Wireless Product Features  DC – 4 GHz  +24 dBm P1dB at 1 GHz  +40 dBm OIP3 at 1 GHz  15 dB Gain at 1 GHz  4.6 dB Noise Figure  Internally matched to 50 Ω  Lead-free / green / RoHS-Compliant SOT-89 Package Functional Block Diagram RF IN GND RF OUT / VCC 1 2 3 Backside Paddle - GND Pin Configuration Pin No. Label

1 RF IN

2 GND

3 RF OUT / VCC

Ordering Information

Part No. Description ECG008B-G InGaP HBT Gain Block ECG008B-PCB 500 – 4000 MHz Evaluation Board Standard T/R size = 1000 pieces on a 7” reel General Description The ECG008 B-G is a general -purpose buffer amplifier that offers high dynamic range in a low -cost surface - mount package. At 1000 MHz, the ECG008B-G typically provides 15 dB of gain, +40 dBm Ou tput IP3, and +24 dBm P1dB. The ECG008 B-G consists of Darlington pair amplifiers using the high reliability InGaP / GaAs HBT process technology and only requires DC -blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a lead -free/green/RoHS-compliant SOT -89 package. All devices are 100% RF and DC tested. This broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies. In addition, the ECG0038B-G will satisfy general amplification requirements in the DC to 4 GHz frequency range such as CATV and mobile wireless.

Datasheet: Rev B 12/04/14 - 2 of 7 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Recommended Operating Conditions Parameter Min Typ Max Units TCASE −40 +85 °C Junction Temperature +160 °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Absolute Maximum Ratings Parameter Rating Storage Temperature −65 to 150 °C RF Input Power (Continuous) +15 dBm Device Current 160 mA Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications Test conditions unless otherwise noted: VSUPPLY = +9 V, RBIAS = 14 Ω, Temp.=+25 °C, 50 Ω System Parameter Conditions Min Typ Max Units Operational Bandwidth DC 4000 MHz Gain Freq.=1000 MHz Pout=+2 dBm / Tone, Δf = 1 MHz 15 dB Output P1dB +24 dBm Output IP3 +40 dBm Noise Figure 4.6 dB Gain Freq.=2000 MHz Pout=+2 dBm / Tone, Δf = 1 MHz 13 14.3 17.2 dB Input Return Loss 25 dB Output Return Loss 14 dB Output P1dB +23 dBm Output IP3 +34 +37 dBm Noise Figure 4.8 dB Device Voltage +6.8 +7.3 +7.8 V Device Current 120 mA Output mismatch w/o spurs 10:1 VSWR Thermal Resistance 86 °C / W Typical Device RF Performance (1) Test conditions unless otherwise noted: VSUPPLY = +9 V, ICC = 120 mA (typ.), RBIAS = 14 Ω, Temp.=+25 °C, 50 Ω System Parameter Typical Units Frequency 100 500 900 1900 2140 2400 3500 5800 MHz Input Return Loss 25 26 28.5 28 25 23.2 15.4 6 dB Output Return Loss 20 19 17 13 13 12 7.9 2.7 dB Output IP3 (2) +41.6 +41 +40 +37 +36 +34 dBm Notes: 1. Gain and return loss values presented above, and in the plots of the following section, are measured at the device level. Application specific performance values will differ in accordance with external components selected for the desired frequency band of operation. P1dB, OIP3 and NF data is measured using the application circuit shown on page 4. 2. Pout = +9 dBm / tone, 1 MHz tone spacing.

Datasheet: Rev B 12/04/14 - 3 of 7 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Typical RF Device Performance (1) Test conditions unless otherwise noted: VSUPPLY = +9 V, ICC = 120 mA (typ.), RBIAS = 14 Ω, 50 Ω System 500 1000 1500 2000 2500 3000 Gain (dB) Frequency (MHz) Gain vs. Frequency +85°C +25°C −40°C -40 -35 -30 -25 -20 -15 -10 0 1 2 3 4 5 6 |S11|, |S22| (dB) Frequency (GHz) Return Loss vs. Frequency |S22| |S11| Temp.=+25°C 100 120 140 ICC (mA) VDE (V) VDE vs. ICC Temp.=+25°C 500 1000 1500 2000 2500 3000 Ouput IP3 (dBm) Frequency (MHz) OIP3 vs. Frequency +85°C +25°C −40°C 500 1000 1500 2000 2500 3000 P1dB (dBm) Frequency (MHz) P1dB vs. Frequency +85°C +25°C −40°C 2.0 2.5 3.0 3.5 4.0 4.5 5.0 500 1000 1500 2000 NF (dB) Frequency (MHz) Noise Figure vs. Frequency Temp.=+25°C Typical Device S-Parameters Test Conditions: VDEVICE= +7.3 V, ICC = 120 mA, Temp. =+25 °C, Calibrated to device leads Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Notes: 1. Device S-parameters are available for download off of the website at: www.triquint.com

Datasheet: Rev B 12/04/14 - 4 of 7 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com ECG008B-PCB Evaluation Board C1 R1 C2 RF Output J4 GND Vsupply 2, Backside Paddle 3J1 RF Input L1 RF Choke DC Blocking Capacitor DC Blocking Capacitor 0.018 uF Bypass Capacitor 4.7  18  Bias Resistor Notes: 1. See Evaluation Board PCB Information section for material and stack-up. Bill of Material: ECG008B-PCB Ref. Des. Value Description U1 n/a ECG008B-G L1 39 nH Wirewound Inductor, 0603 C1, C2 56 pF Chip Capacitor, 0603 C3 0.018 F Chip Capacitor, 0603 C4 Do Not Place R1 18 Ω Chip Resistor, 0603 R2 4.7 Ω Chip Resistor, 0603 R3 14 Ω 1% Tolerance, 2010 RBIAS Values for Various VSUPPLY VSUPPLY (VCC) 9 10 12 R3 (Ω) 14 23 39 Component Size 2010 2512 2512 Component Values for Specific Frequencies Frequency (MHz) 50 500 900 1900 2200 2500 3500 L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH C1, C2, C3 .018 uF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF Application Circuit RF Performance

Datasheet: Rev B 12/04/14 - 5 of 7 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Evaluation Board PCB Information TriQuint PCB 1069136 Material and Stack-up 1 oz. Cu bottom layer Nelco N-4000-13 Core Nelco N-4000-13 1 oz. Cu top layer 1 oz. Cu inner layer 1 oz. Cu inner layer 0.062" ± 0.006" Finished Board Thickness 0.014" 0.014" 50 Ohm Line Dimensions: Width=0.028" Spacing=0.036" Pin Configuration and Description RF IN GND RF OUT / VCC 1 2 3 Backside Paddle - GND Pin No. Label Description 1 RF IN RF input, matched to 50 ohms. External DC Block is required. 3 RF OUT / VCC RF output / DC supply, matched to 50 ohms. External DC Block, bias choke, and dropping resistor is required. 2, Backside Paddle GND Paddle RF/DC ground. Use recommended via pattern to minimize inductance and thermal resistance. See PCB Mounting Pattern for suggested footprint.

Datasheet: Rev B 12/04/14 - 6 of 7 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Package Marking and Dimensions Marking: Product Identifier – E008G Lot Code – YXXX Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Dimension and tolerance formats conform to ASME Y14.4M-1994. 3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. 4. Contact plating: NiPdAu PCB Mounting Pattern Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. 4. Do not remove or minimize via hole structure in the PCB. Thermal and RF grounding is critical. 6. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. 3.86 [0.152] 0.76 [0.030] 0.38 [0.015] Ø.254 (.010) PLATED THRU VIA HOLES 0.76 [0.030] 2X 1.27 [0.050] 0.86 [0.034] 2X 0.58 [0.023] 4.50 [0.177] 2.65 [0.104] PACKAGE OUTLINE 3.86 [0.152] 3.03 [0.119] 1.62 (.064) 4.40 (.173) .35 (.014) .36 (.014) .44 (.017) 1.40 (.055) D C B SYMBOL A 4.60 (.181) 4.50 (.177) 1.83 (.072) 1.73 (.068) 1.60 (.063) MAX .44 (.017) .48 (.019) .56 (.022) .50 (.020) .40 (.016) .42 (.0165) 1.50 (.059) TYPMIN 3.94 (.155) 2.13 (.084) 2.29 (.090) e H L E SYMBOL 2.29 (.090) 2.60 (.102) 4.25 (.167) 1.20 (.047)

1.50 BSC

(.059) 1.10 (.043) 4.10 (.161)

3.00 BSC

(.118) 2.20 (.087) 2.50 (.098) MAXMIN .89 (.035) TYP B e 2X B1 E L H D C Alternate Backside Patterns - Reflow Compatible (Part may be supplied with either pattern) A HALF ETCHING DEPTH 0.001" E008G YXXX

Datasheet: Rev B 12/04/14 - 7 of 7 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Product Compliance Information ESD Sensitivity Ratings Caution! ESD-Sensitive Device ESD Rating: Class 1A Value: ≥ 250 V to < 500 V Test: Human Body Model (HBM) Standard: ESDA/JEDEC Standard JS-001-2012 Solderability Compatible with both lead-free (260 °C maximum reflow temperature) and tin/lead (245 °C maximum reflow temperature) soldering processes. Contact plating: NiPdAu RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes:  Lead Free  Halogen Free (Chlorine, Bromine)  Antimony Free  TBBP-A (C15H12Br402) Free  PFOS Free  SVHC Free MSL Rating MSL Rating: Level 3 Test: 260 °C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-020 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Email: info-sales@triquint.com Fax: +1.503.615.8902 For technical questions and application information: Email: sjcapplications.engineering@triquint.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibil ity or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with a ll faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itsel f or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life -saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.