ECG003 WJCI | Alldatasheet

Document overview

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 4 April 2007 ECG003 InGaP HBT Gain Block Product Features

  • DC – 6 GHz
  • +24 dBm P1dB at 1 GHz
  • +39 dBm OIP3 at 1 GHz
  • 20 dB Gain at 1 GHz
  • 3.6 dB Noise Figure
  • Available in Lead-free / green
  • Internally matched to 50 Ω

Applications

  • Mobile Infrastructure
  • CATV / FTTX
  • W-LAN / ISM
  • RFID
  • WiMAX / WiBro Product Description The ECG003 is a general-purpose buffer amplifier that offers high d ynamic range in a low-cost surface-mount package. At 1000 MHz, the ECG003 typically provides 20 dB of gain, +39 dBm Output IP3, and +24 dBm P1dB. The ECG003 consists of Darlington p air amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a low- cost, surface-mount lead-free/green/RoHS-compliant SOT- 89 package. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the ECG003 will work for other various applications within the DC to 6 GHz frequency range such as CATV and mobile wireless. Functional Diagram RF IN GND RF OUT GND 1 2 3 Function Pin No. Input 1 Output/Bias 3 Ground 2, 4 Specifications (1) Parameter Units Min Typ Max Operational Bandwidth MHz DC 6000 Test Frequency MHz 1000 Gain dB 20 Output P1dB dBm +24 Output IP3 (3) dBm +39 Noise Figure dB 3.5 Test Frequency MHz 2000 Gain dB 18 19 Input Return Loss dB 15 Output Return Loss dB 10 Output P1dB dBm +23 Output IP3 (2) dBm +34 +36 Noise Figure dB 3.6 Device Voltage V 6.7 7.2 7.6 Device Current mA 110 Output mismatch w/o spurs VSWR 10:1 1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +9 V, Rbias = 16 Ω , 50 Ω System. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 °C Storage Temperature -65 to +150 °C RF Input Power (continuous) +10 dBm Device Current 160 mA Junction Temperature +250 °C Operation of this device above any of these parameters may cause permanent damage. Typical Performance (1) Parameter Units Typical Frequency MHz 500 900 1900 2140 S21 dB 21 20 19 18.7 S11 dB -19 -18 -16 -15 S22 dB -14 -13 -10 -10 Output P1dB dBm +24.4 +24 +23 +22.5 Output IP3 dBm +39 +39 +36 +35 Noise Figure dB 3.5 3.5 3.6 3.7

Ordering Information

Part No. Description ECG003B-G InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 package) ECG003B-PCB 700 – 2400 MHz Fully Assembled Eval. Board

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 4 April 2007 ECG003 InGaP HBT Gain Block Typical Device RF Performance (3) Supply Bias = +9 V, Rbias = 16 ΩΩ , Icc = 110 mA Frequency MHz 100 500 900 1900 2140 2400 3500 5800 S21 dB 21 21 20.4 19 18.7 18.2 17.4 14 S11 dB -20 -19 -18 -16 -15 -13 -12 -6 S22 dB -15 -14 -13 -10 -10 -8 -7 -3 Output IP3 dBm +38 +39 +39 +36 +35 +34 +31 1. Test conditions: T = 25º C, Supply Voltage = +9 V, Device Voltage = 7.2 V, Rbias = 16 Ω , Icc = 110 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3. Gain vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) Gain (dB) +25C -40C +85C S11 , S22 vs . Frequency -25 -20 -15 -10 0 1 2 3 4 5 6 Frequ ency (GHz) S11 S22 Icc vs. Vde 100 120 140 Vde (V) Icc (mA) +25C OIP3 vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) OIP3 (dBm) +25C -40C +85C Noise Figure vs. Frequency 1.5 2.5 3.5 500 1000 1500 2000 Frequency (MHz) NF (dB) P1dB vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) P1dB (dBm) +25C -40C -85C S-Parameters (Vdevice = +7.2 V, ICC = 110 mA, T = 25°C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Device S-parameters are available for download off of the website at: http://www.wj.com

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 4 April 2007 ECG003 InGaP HBT Gain Block Recommended Application Circuit Recommended Component Values Reference Frequency (MHz) Designator 50 500 900 1900 2200 2500 3500 L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH C1, C2, C3 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The c omponent values in the table below are c ontained on the evaluation board to achieve optimal broadband performance. 3. R1 and R2 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures of unconditional stability with the use of the device. It is expected that li nearity parameters (OIP3 and P1dB) to degrade about only 0.5 dB, while overall gain will be about 2 dB less than the performance shown in page 1 and 2 of this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz. Ref. Desig. Value / Type Size L1 39 nH wirewound inductor 0603 C1, C2 56 pF chip capacitor 0603 C3 0.018 µ F chip capacitor 0603 C4 Do Not Place R1 18 Ω chip resistor 0603 R2 4.7 Ω chip resistor 0603 R3 16 Ω 1% tolerance 2010 Recommended Bias Resistor Values Supply Voltage R3 value Size

9 V 16 ohms 2010

10 V 25 ohms 2512

12 V 44 ohms 2512

The proper value for R3 is d ependent upon the supply voltage a nd allows for bias s tability over temperature. WJ recommends a minimum supply bias of +9 V. A 1% tolerance resistor is recommended. ECG003B-PCB Performance Data (WJ’s evaluation board uses the circuit shown above.) Gain 0 1 2 3 4 Frequency (GHz) Return Loss -30 -20 -10 0 1 2 3 4 Frequency (GHz) S11 & S22 (dB) S11 S22 Blocking Capacitor RF OUT RF Choke 0.018 µF Bias Resistor RF IN Bypass Capacitor Blocking Capacitor Vcc Icc = 110 mA ECG003B 18 Ω 4.7 Ω

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 4 April 2007 ECG003 InGaP HBT Gain Block ECG003B-G Mechanical Information This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. Outline Drawing Land Pattern Product Marking The c omponent will be marked with an “ E003G” designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead p ackage is marked with an “ E003” designator followed b y an alphanumeric lot code; it may also have been marked with an “ 8” designator followed by a 3-digit numeric lot code. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. MSL / ESD Rating ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should u se a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that t he ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 °C Thermal Resistance, Rth 86 °C/W