EC1078 WJCI | Alldatasheet

Document overview

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 4 April 2006 EC1078 InGaP HBT Gain Block Product Information The Communications Edge TM Product Features

  • DC – 3.5 GHz
  • +21 dBm P1dB at 1 GHz
  • +37 dBm OIP3 at 1 GHz
  • 20 dB Gain at 1 GHz
  • 4.4 dB Noise Figure at 2 GHz
  • Available in Lead-free / green
  • Internally matched to 50 Ω

Applications

  • Mobile Infrastructure
  • CATV / FTTX
  • W-LAN / ISM
  • RFID
  • WiMAX / WiBro Product Description The EC1078B is a general-pur pose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the EC1078B typically provides 20 dB of gain, +37 dBm Output IP3, and +21 dBm P1dB. The EC1078B consists of Darlin gton pair amplifiers using the high reliability InGaP/Ga As HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a low-cost, surface-mountable lead-free/green/RoHS-compliant SOT- 89 package. All devices are 100% RF and DC tested. The broadband MMIC amplifier ca n be directly applied to various current and next ge neration wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the EC1078B will work for ot her various applications within the DC to 3.5 GHz frequency range such as CATV and mobile wireless. Functional Diagram RF IN GND RF OUT GND 1 23 Function Pin No. Input 1 Output/Bias 3 Ground 2, 4 Specifications (1) Parameter Units Min Typ Max Operational Bandwidth MHz DC 3500 Test Frequency MHz 1000 Gain dB 20 Output P1dB dBm +21 Output IP3 (2) dBm +37 Test Frequency MHz 2000 Gain dB 17 Large-signal Gain (3) dB 14.7 16 Input Return Loss dB 12 Output Return Loss dB 8 Output P1dB dBm +20 Output IP3 (2) dBm +33 Noise Figure dB 4.4 Test Frequency MHz 3000 Gain dB 13 14.5 Device Voltage V 5.3 5.6 5.9 Device Current mA 96 1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +7 V, Rbias = 14 Ω, 50 Ω System. 2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Large-signal gain is tested with an input power level of +3 dBm. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 °C Storage Temperature -55 to +150 °C Device Current 150 mA RF Input Power (continuous) +12 dBm Junction Temperature +250 °C Operation of this device above any of these parameters may cause permanent damage. Typical Performance (1) Parameter Units Typical Frequency MHz 500 900 1900 2140 S21 dB 20.7 20 17.2 16.6 S11 dB -13 -14 -14 -15 S22 dB -12 -12 -12 -12 Output P1dB dBm +20.6 +21 +20.5 +20 Output IP3 (2) dBm +37.5 +37 +33.5 +32.5 Noise Figure dB 3.1 3.5 4.3 4.4

Ordering Information

Part No. Description EC1078B-G InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 package) EC1078B-PCB 700 – 2400 MHz Fully Assembled Eval. Board

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 4 April 2006 EC1078 InGaP HBT Gain Block Product Information The Communications Edge TM Typical Device RF Performance Supply Bias = +7 V, Rbias = 14 Ω, Icc = 96 mA Frequency MHz 100 500 900 1900 2140 2400 3500 S11 dB -13 -13 -14 -14 -15 -15 -13 S22 dB -11 -12 -12 -12 -12 -11 -9.2 Output P1dB dBm +20 + 20.6 +21 +20.5 +20 +19 Output IP3 dBm +38 +37. 5 +37 +33.5 +32.5 +32 1. Test conditions: T = 25º C, Supply Voltage = +7 V, Device Voltage = 5.6 V, Rbias = 14 Ω, Icc = 96 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3. Gain vs. Frequency 0123456 Frequency (GHz) Gain (dB) S11, S22 vs. Frequency -20 -16 -12

0123456 Frequency (GHz)

S11, S22 (dB) S22 S11 Icc vs. Vde 120 160 200 02468 Vde (V) Icc (mA) 25°C OIP3 vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) OIP3 (dBm) 25°C 85°C -40°C Noise Figure vs. Frequency 500 1000 1500 2000 Frequency (MHz) NF (dB) P1dB vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) P1dB (dBm) 25°C 85°C -40°C

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 4 April 2006 EC1078 InGaP HBT Gain Block Product Information The Communications Edge TM Recommended Application Circuit (EC1078B-PCB) Recommended Component Values Reference Frequency (MHz) Designator 50 500 900 1900 2200 2500 3500 L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH C1, C2, C3 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The component values in the table below are contained on the evaluation board to achieve optimal broadband performance. 3. R1 and R2 are shown in the circuit diagram to avoid pot ential instabilities. The configuration shown above assures of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to degrade about only 0.5 dB, while overall gain will be about 1 dB less than the performance shown in page 1 and 2 of this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz. Ref. Desig. Value / Type Size L1 39 nH wirewound inductor 0603 C1, C2 56 pF chip capacitor 0603 C3 0.018 μF chip capacitor 0603 C4 Do Not Place R1 6 Ω chip resistor 0603 R2 6 Ω chip resistor 0603 R3 14 Ω 1% tolerance 2010 Recommended Bias Resistor Values Supply Voltage R bias value Size 7 V 14.6 ohms 1210

8 V 25 ohms 1210

9 V 35 ohms 2010

10 V 46 ohms 2010

12 V 67 ohms 2512

The proper value for R bias is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +7 V. A 1% tolerance resistor is recommended. Typical Device S-Parameters S-Parameters (Vdevice = +5.6 V, ICC = 96 mA, T = 25°C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Device S-parameters are available for download off of the website at: http://www.wj.com Blocking Capacitor RF OUT RF Choke 0.018 µF Bias Resistor RF IN Bypass Capacitor Blocking Capacitor Vcc Icc = 96 mA EC1078B 6 Ω 6 Ω

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 4 April 2006 EC1078 InGaP HBT Gain Block Product Information The Communications Edge TM EC1078B-G Mechanical Information This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes. Outline Drawing Land Pattern Product Marking The component will be marked with an “1078G” designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an “1078” designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical fo r the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.