DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 10
Technical content
Spec No. JENF243F-0031C-01 P1/10 MURATA MFG.CO., LTD Reference Only EMIFIL® (Three-terminal capacitor) 1. Scope This reference specification applies to DSS1NB3 series. 2. Part Numbering (Ex.) D S S 1 N B 3 2 A 220 Q 5 5 B ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ① Product ID (Disc-Type EMIFIL®） ② Structure S : Built-in Ferrite Beads Type ③ Style ④ Features ⑤ Temperature Characteristics B3:±10%（-40～+85℃ at 20℃） ⑥ Rated Voltage 2A :2A→100VDC、1H→50VDC ⑦ Capacitance □□□ Marked three digits system.(Ex. 22pF→220、22000pF→223) ⑧ Lead Type Q 5 5 : B u l k Lead Type :Straight Lead Lead Length(l) 25.0 mm min. ※ See item 9. Q91□: T a p i n g Lead Type :Straight Lead Dimension H: Q91 ：20.0±1.0 mm Q92：16.5±1.0 mm Q93：18.5±1.0 mm ※S e e i t e m 9 . ⑨ Packaging Code A : Ammo Pack / B : Bulk 3. Rating Operating temperature : -40 to +85°C Storage Temperature : -40 to +85°C Insulation Resistance : 1000MΩ min. Rated Current : 6A(DC) Equivalent Circuit : Others : See Table 1 Table 1 Customer Part Number Murata Part Number Capacitance Temperature Characteristics Rated Voltage Withstanding Voltage Unit Mass (Typical value) DSS1NB32A220Q55B 22 pF±10% ±10% 100VDC 250VDC 0.45g DSS1NB32A220Q91A DSS1NB32A220Q92A DSS1NB32A220Q93A DSS1NB32A330Q55B 33 pF±10% DSS1NB32A330Q91A DSS1NB32A330Q92A DSS1NB32A330Q93A DSS1NB32A470Q55B 47 pF±10% DSS1NB32A470Q91A DSS1NB32A470Q92A DSS1NB32A470Q93A GND （3） （1） GND （3） （1）
Spec No. JENF243F-0031C-01 P2/10 MURATA MFG.CO., LTD Reference Only Customer Part Number Murata Part Number Capacitance Temperature Characteristics Rated Voltage Withstanding Voltage Unit Mass (Typical value) DSS1NB32A680Q55B 68 pF±10% ±10% 100VDC 250VDC 0.45g DSS1NB32A680Q91A DSS1NB32A680Q92A DSS1NB32A680Q93A DSS1NB32A101Q55B 100 pF±10% DSS1NB32A101Q91A DSS1NB32A101Q92A DSS1NB32A101Q93A DSS1NB32A121Q55B 120 pF±10% DSS1NB32A121Q91A DSS1NB32A121Q92A DSS1NB32A121Q93A DSS1NB32A151Q55B 150 pF±10% DSS1NB32A151Q91A DSS1NB32A151Q92A DSS1NB32A151Q93A DSS1NB32A221Q55B 220 pF±10% DSS1NB32A221Q91A DSS1NB32A221Q92A DSS1NB32A221Q93A DSS1NB32A271Q55B 270 pF±10% DSS1NB32A271Q91A DSS1NB32A271Q92A DSS1NB32A271Q93A DSS1NB32A331Q55B 330 pF±10% DSS1NB32A331Q91A DSS1NB32A331Q92A DSS1NB32A331Q93A DSS1NB32A471Q55B 470 pF±10% DSS1NB32A471Q91A DSS1NB32A471Q92A DSS1NB32A471Q93A DSS1NB32A681Q55B 680 pF±10% DSS1NB32A681Q91A DSS1NB32A681Q92A DSS1NB32A681Q93A DSS1NB32A102Q55B 1000 pF±10% DSS1NB32A102Q91A DSS1NB32A102Q92A DSS1NB32A102Q93A DSS1NB32A152Q55B 1500 pF±10% DSS1NB32A152Q91A DSS1NB32A152Q92A DSS1NB32A152Q93A DSS1NB32A222Q55B 2200 pF±10% DSS1NB32A222Q91A DSS1NB32A222Q92A DSS1NB32A222Q93A DSS1NB32A332Q55B 3300 pF±10% DSS1NB32A332Q91A DSS1NB32A332Q92A DSS1NB32A332Q93A DSS1NB32A472Q55B 4700 pF±10% DSS1NB32A472Q91A DSS1NB32A472Q92A DSS1NB32A472Q93A
Spec No. JENF243F-0031C-01 P3/10 MURATA MFG.CO., LTD Reference Only 4. Style and Dimension See item 9. 5. Marking Trade Mark ： Marked as Capacitance ： Marked three digits system. (Ex.221) Rated Voltage ： Marked voltage value.(100V) 6. Testing Conditions <Unless otherwise specified> <In case of doubt> Temperature : Ordinary Temperature 15 to 35°C Perform a heat treatment at 150+0/-10°C for one hour H u m i d i t y : Ordinary Humidity 25 to 85 %(RH) and then set at room temperature for 24±2 hours. Temperature : 20 ± 2°C Humidity : 60 to 70 %(RH) Atmospheric Pressure : 86 to 106 kPa 7. Performance No. Item Specification Test Method
7.1 Appearance and
Meet item 9. Visual Inspection and measured with Slide Calipers. 7.2 Marking Marking is able to be read easily. Visual Inspection.
7.3 Capacitance and
Meet item 3. Table 2 Frequency Test Voltage Capacitance 1±0.1MHz 1 ±0.2Vrms 22pF ～150pF 1±0.1kHz 1 ±0.2Vrms 220pF ～100000pF
7.4 Insulation
Resistance(I.R.) Meet item 3. Test Voltage : Rated Voltage Time : 1 minute through a suitable resistor 1MΩ. Customer Part Number Murata Part Number Capacitance Temperature Characteristics Rated Voltage Withstanding Voltage Unit Mass (Typical value) DSS1NB32A682Q55B 6800 pF±10% ±10% 100VDC 250VDC 0.45g DSS1NB32A682Q91A DSS1NB32A682Q92A DSS1NB32A682Q93A DSS1NB32A103Q55B 10000 pF±10% DSS1NB32A103Q91A DSS1NB32A103Q92A DSS1NB32A103Q93A DSS1NB32A153Q55B 15000 pF±10% DSS1NB32A153Q91A DSS1NB32A153Q92A DSS1NB32A153Q93A DSS1NB32A223Q55B 22000 pF±10% DSS1NB32A223Q91A DSS1NB32A223Q92A DSS1NB32A223Q93A DSS1NB31H333Q55B 33000 pF±10% 50VDC 125VDC DSS1NB31H333Q91A DSS1NB31H333Q92A DSS1NB31H333Q93A DSS1NB31H473Q55B 47000 pF±10% DSS1NB31H473Q91A DSS1NB31H473Q92A DSS1NB31H473Q93A DSS1NB31H104Q55B 100000pF±10% DSS1NB31H104Q91A DSS1NB31H104Q92A DSS1NB31H104Q93A
Spec No. JENF243F-0031C-01 P4/10 MURATA MFG.CO., LTD Reference Only No. Item Specification Test Method
7.5 Withstanding
Products shall not be damaged. Test Voltage : 2.5 times for Rated Voltage Time : 1 to 5 seconds Charge Current : 10 mA max. It shall be applied between input / output terminal and ground terminal.
7.6 Temperature
Meet item 3. Capacitance shall be measured at each step specified in Table 3 after reaching the thermal equilibrium. The capacitance change against the capacitance at step 3 shall be calculated. Table3 Step 1 2 3 4 5 Temp. (°C)
7.7 Solderability Along the circumference of terminal
shall be covered with new solder at least 75%. Flux : Ethanol solution of rosin,25(wt)% (dipped for 5 to 10 seconds) Pre-heat : 150±10℃, 60～90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature 245±5℃ Immersion Time : 2 ± 0.5 seconds Immersion Depth : 2 to 2.5 mm from the bottom of the body.
7.8 Resistance to
Soldering Heat① Meet Table 4. Table 4 Appearance No damaged. Capacitance Change within ± 30% Withstanding Voltage No damaged. Flux : Ethanol solution of rosin,25(wt)% (dipped for 5 to 10 seconds) Pre-heat : 150±10℃, 60～90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5 °C Immersion Time : 3± 0.5 seconds Immersion Depth : 1.6 ± 0.7 mm from the bottom of the body. Then measured after exposure in the room condition for 4 to 24hours. Resistance to Soldering Heat② Soldering iron output: 30W Tip temperature : 370±10°C Soldering time : 5s(+0/-1s) 7.9 Humidity Meet Table 5. Table 5 Temperature : 60°C Humidity : 90 to 95 %(RH) Time : 500 hours(+24-0 hours) Then measured after exposure in the room condition for 4 to 24hours.
7.10 Humidity Life Temperature : 40 ± 2°C
Humidity : 90 to 95 %(RH) Time : 500 hours(+24-0 hours) Applying Voltage : 1H/ Rated Voltage 50VDC 2A/ Rated Voltage 100VDC Then measured after exposure in the room condition for 4 to 24hours.
7.11 Heat Life Temperature : 85 ± 3°C
Applying Voltage : 1H/ Rated Voltage 50VDC 2A/ Rated Voltage 100VDC Time : 500 hours(+24-0 hours) Then measured after exposure in the room condition for 4 to 24hours. Appearance No damaged. Capacitance Change within ± 30% Inslation Resistance 10MΩ min.
Spec No. JENF243F-0031C-01 P5/10 MURATA MFG.CO., LTD Reference Only 8. Mounting Hole B u l k T a p i n g 9. Style and Dimension
9.1 Bulk(Straight Lead Type) : Q55B
in mm) ∗1.Bottom of dielectric may be exposed. ∗2.There should not be the exposure of the ferrite bead if a hole is on the top of ferrite bead. 2.5±0.2 φ0.8 - 3 2.5±0.2 2.5±0.2 φ1.0 - 3 2.5±0.2 単位：mm(in mm) Marking side 8.5 max 3.5 max 7.5 max 25.0 min F1=2.5±0.5 123 (3) (1) φ0.56 +0.8 -0.25.0 φ0.6
Spec No. JENF243F-0031C-01 P6/10 MURATA MFG.CO., LTD Reference Only
9.2 Taping(Straight Lead Type) : Q9□A
(All symbols in the illustrations below are described in Table 4) 3.5max ∗1.Bottom of dielectric may be exposed. ∗2.There should not be the exposure of the ferrite bead if a hole is on the top of ferrite bead. Table 4 Code Description Dimensions Remark P Pitch of Component 12.7 Product Inclination ΔS Determines Crossing P0 Pitch of Sprocket Hole 12.7±0.2 P1 Length from Hole Center to Lead 3.85±0.7 P2 Length from Hole Center t o C o m p o n e n t C e n t e r 6.35±1.3 D Width of Body 8.5 max. ΔS Deviation along tape, Left or Right 0±1.0 W Carrier Tape Width 18.0±0.5 W1 Position of Sprocket Hole 9.0 +0,-0.5 Tape Widthwise Shift l Protrusion Length +0.5 ∼ -1.0 D0 Diameter of Sprocket Hole φ 4.0±0.1 d Lead Diameter φ 0.6 t1 Total Tape Thickness 0.7±0.2 Includes Thickness of Bonding Tape t2 Total Thickness,Tape and Lead Wire 1.5 max. Δh1 Deviation across Tape,front 1.0 max. Δh2 Deviation across Tape,rear 1.0 max. L Portion to Cut in Case of Defect 11.0 +0,-1.0 W0 Hold Down Tape Width 12.0±0.5 W2 Hold Down Tape Position 1.5±1.5 H Lead length between sprocket hole and forming position Q91 20.0±1.0 Q92 16.5±1.0 Q93 18.5±1.0 (in mm) 7.5max
Spec No. JENF243F-0031C-01 P7/10 MURATA MFG.CO., LTD Reference Only 10. Taping (1) A maximum of 0.3% of the components quantity per Ammo pack may be missing without consecutive missing components. (2) The adhesive power of the tape shall have over 2.94N at the following condition. (3) Splicing method of tape 1. Carrier tape Carrier tape shall be spliced by cellophane tape. Overall thickness shall be less than 1.05 mm. (in mm) 2. Hold down tape Hold down tape shall be spliced with overlapping. Overall thickness shall be less than 1.05 mm. (in mm) 3. Both carrier tape and hold down tape Both tapes shall be cut zigzag and spliced with splicing tape. 11. Packing
11.1 Packing quantity
The standard packing quantity is as follows. (The packing quantity may be changed due to a fraction of order.) Minimun Packing Form and Quantity Terminal Configuration A Unit Quantity Packing Form ∗ Standard Quantity i n a c o n t a i n e r (corrugated cardboard box) Bulk 250 pcs. In a plastic bag 5000pcs. Taping 1500 pcs. In an Ammo pack 7500pcs. ∗ A quantity in a container is depending on a quantity of an order.
11.2 Packing Form
(1) Bulk <A plastic bag pack> 1.Products are packed into a plastic bag. 2.The plastic bags are put into a container (corrugated cardboard box) depending on a quantity of an order. Hold down tape Carrier tape F 2.94 N 30 to 50 Hold down tape Carrier tape Cellophane tape Direction of feed Overall thickness Direction of feed 20 to 30 Hold down tape Hold down tape Carrier tape Overall thickness a plastic bag container label a container the plastic bag with products
Spec No. JENF243F-0031C-01 P8/10 MURATA MFG.CO., LTD Reference Only (2) Taping <An ammo pack> 1 .Folding the tape per 25 pitches,products are packed into an ammo package so that each product of each layer wound zigzag is put on top of one another. [Fig 3] 2. The dimensions of the ammo package are indicated in [Fig 4]. 3. The ammo packages are put into a container (corrugated cardboard box) depending on a quantity of an order. 4. Not less than 3 consecutive of component shall be missing on both edge of tape. [ F i g 3 ] [ F i g 4 ] The unloading direction : Right The hold down tape : Upper (in mm) The product body : Left along the unloading direction 12. Marking on package
12.1 Unit Package
Bulk : Marked on a plastic bag. Taping : Marked on a label stuck on an ammo package. Marking on a unit package consists of : Customer part number, MURATA part number, Inspection number(∗1), RoHS marking (∗2), Quantity, etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number
12.2 Container
Marking on the label stuck on a container consists of : Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking (∗2), Quantity, etc 13. △! Caution
13.1 Mounting holes
Mounting holes should be designed as specified in this specifications. Or different design from this specifications may cause cracks in ceramics which may lead to smoking / firing.
13.2 Caution for the product angle adjust work
Take care not to apply any mechanical stress to prod uct body at the lead terminal bending process for product angle adjustment after insertion.
13.3 Limitation of Applications
Please contact us before using our pr oducts for the applications listed bel ow which require especially high reliability for the prevention of defec ts which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (7) Traffic signal equipment (2) Aerospace equipment (7) Disaster prevention / crime prevention equipment (3) Undersea equipment (9) Data-processing equipment (4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements (5) Medical equipment to the applications listed in the above (6) Transportation equipment (vehicles, trains, ships, etc.) zig zag label 340 max. 240 max. 51 max.
Spec No. JENF243F-0031C-01 P9/10 MURATA MFG.CO., LTD Reference Only 14. Notice
14.1 Soldering
(1) Use rosin-based flux. Do not use strong acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Use Sn-3.0Ag-0.5Cu solder (2) Standard flow soldering profile. Solde r temperature Soldering time 250～260 °C 4 ～6s (3) Resistance to soldering iron goes in the following condition that tip temperature is 350 °C max. And soldering time is 5 s max. (4) Products and the leads should not be subjected to any mechanical stress during soldering process. (and also while subjected to the equivalent high temperature.)
14.2 Cleaning
Products shall be cleaned on following conditions. (1) Cleaning Temperature: 60℃ max.(40 ℃ max. for Isopropyl alcohol). (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power：20W / l max. Frequency：28kHz ∼ 40kHz Time ：5 minutes max. (3) Cleaning agent 1. alcohol cleaning agents. ・Isopropyl alcohol (IPA) 2. Aqueous cleaning agent ・Pine Alpha ST-100S (4) Ensure that residual flux and residual cleaning agent is completely removed. Products should be thoroughly dried after aqueous agent has been removed with de-ionized water. (5) For other cleaning methods, please contact Murata engineering.
14.3 Operating Environment
(1) Do not use products in corrosive gases such as chlorine gas, acid or sulfide gas. (2) Do not use products in the environment where water, oil or organic solvents may adhere to products. (3) Do not adhere any resin to products, coat nor mold products with any resin (including adhesive)to prevent mechanical and chemical stress on products. 14.4 Storage and handling requirements. (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition To prevent products quality deterioration, stored conditions should be controlled as follows ; 1. Temperature : -10 to 40 degrees centigrade 2. Humidity : 15 to 85% relative humidity 3. Products should be stored without sudden changes in temperature and humidity. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of lead terminals resulting in poor solderability. 4. Products should be stored on the pale tte for the prevention of the infl uence from humidity, dust and so on. 5. Products should be stored in the warehouse without heat shock, vibration,direct sunlight and so on. (3) Handling Conditions Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 1 minutes min. Soldering time Solder temp. 250 200 150 100 Temperature (°C) Pre- heating(in air) Soldering Gradual Cooling (in air)300
Spec No. JENF243F-0031C-01 P10/10 MURATA MFG.CO., LTD Reference Only 15. △! Note (1)Please make sure that your product has been evaluated in view of your s pecifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference spec ification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering.