DH10N40 WXDH | Alldatasheet

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Jiangsu DonghaiSemiconductorTechnologyCO.,LTD. Rev.1.0 Page1of 12 DH10N40/DHF10N40/DHI10N40/ DHE10N40/DHB10N40/DHD10N40 10A 400V N-channel Enhancement Mode Power MOSFET

4 Electrical Characteristics

4.1 Absolute Maximum Rating(Tc=25℃,unless otherwise noted)

UnitsDH10N40/DHI10N40/DHE10 N40/DHB10N40/DHD10N40 DHF10 N40 Drian-to-Source Voltage VDSS 400 V Gate-to-Source Voltage VGSS ±30 V Continuous Drain Current TC=25℃ ID 10 A TC=100℃ 6.3 A Pulsed Drain Current(1) IDM 40 A Single PulseAvalanche Energy(4) EAS 450 mJ Peak Diode Recovery dv/dt(5) dv/dt 5 V/ns Power Dissipation Ta=25℃ Ptot 2.0 2.0 W TC=25℃ Ptot 100 35 W Isolation Voltage VISO / 2500 V JunctionTemperature Range Tj -55～150 ℃ StorageTemperature Range Tstg -55～150 ℃ MaximumTemperature for soldering TL 300 ℃

4.2 Thermal Characteristics

UnitDH10N40/DHI10N40/DHE10 N40/DHB10N40/DHD10N40 DHF10 N40 Thermal Resistance,Junction to Case-sink RthJC 1.25 3.57 ℃/W Thermal Resistance,Junction toAmbient RthJA 62.5 62.5 ℃/W

1 Description

These N-channel enhanced vdmosfets, is obtained by the self-aligned planar technology which reduce the conduction loss, improve switching performance and enhance the avalanche energy.Which accords with the RoHS standard.

2 Features

  • Fastswitching
  • Low on-state resiatance(Rdson≤0.55Ω)
  • Low gate charge(Typ: 23nC)
  • Low reverse transfer capacitances(Typ: 8pF)
  • 100% single pulse avalanche energy test
  • 100%ΔVDStest

3 Applications

  • Used in various power switching circuit for system miniaturization and higher efficiency.
  • Power switch circuit of adaptor and charger VDSS = 400V RDS(on)(TYP)= 0.44Ω ID = 10A 1 2 3 4 5 6 7 8 A B C D 87654321 D C B A Title N u mb er R ev isio nSize D D ate: 1 0 -A p r-2 0 1 7 Sh eet o f File: D :\\ Pr og ram Files\\p ro tel 99 se\\文件夹\\W X D H D raw n B y : G S D TO-220C TO-220F TO-262 TO-263 TO-252B TO-251B A ll data sheet.com

Jiangsu DonghaiSemiconductorTechnologyCO.,LTD. Rev.1.0 Page2of 12 DH10N40/DHF10N40/DHI10N40/ DHE10N40/DHB10N40/DHD10N40

4.3 Electrical Characteristics(Tc=25℃,unless otherwise noted)

Parameter Symbol TestCondition Value UnitsMin Typ Max Off Characteristics Drain-to-Source Breakdown Voltage BVDSS ID=250μA,VGS=0V 400 -- -- V Drain-to-Source Leakage Current IDSS VDS=400V,VGS=0V,TC=25℃ -- -- 1 μA VDS=320V,VGS=0V,TC=125℃ -- -- 100 μA Gate-to-Source Leakage Current IGSS VGS=±30V -- -- ±100 nA On Characteristics GateThreshold Voltage VGS(th) VDS=VGS,ID=250μA 2 -- 4 V Drain-to-Source on-state Resistance RDS(on) VGS=10V,ID=5A -- 0.44 0.55 Ω Forward Transfer Conductance gfs VDS=15V,ID=5A -- 8.5 -- S Dynamic Characteristics Input Capacitance Ciss VGS=0V,VDS=25V,f=1.0MHz -- 1126 -- pFOutput Capacitance Coss -- 124 -- Reverse Transfer Capacitance Crss -- 8 -- Switching Characteristics Turn-on Delay Time td(on) ID=10A, VDD=200V, RG=10Ω -- 18 -- nSTurn-on RiseTime tr -- 23 -- Turn-off Delay Time td(off) -- 41 -- Turn-offFallTime tf -- 19 -- Total Gate Charge Qg ID=10A,VDD=320V,VGS=10V -- 23 -- nCGate-to-Source Charge Qgs -- 5.2 -- Gate-to-Drain(“Miller”) Charge Qgd -- 8.5 -- Drain-Source Diode Characteristics Diode Forward Voltage(3) VFSD VGS=0V,IS=10A -- -- 1.5 V Diode Forward Current IS -- -- 10 A Reverse RecoveryTime(3) trr TJ=25℃,IF=10A, dIF/dt=100A/μS,VGS=0V -- 376 -- nS Reverse Recovery Charge(3) Qrr -- 2560 -- nC Notes： 1: Repetitive rating, pulse width limited by maximum junction temperature. 2: Surface mounted on FR4 Board, t≤10sec. 3: Pulse width ≤ 300μs, duty cycle ≤ 2%. 4. L=10mH,ID=9.5A,VDD=50V,VGATE=400V,StartTJ=25℃. 5. ISD=10A,di/dt≤100A/μs,VDD≤BVDSS, StartTJ=25℃. A ll data sheet.com

Jiangsu DonghaiSemiconductorTechnologyCO.,LTD. Rev.1.0 Page3of 12 DH10N40/DHF10N40/DHI10N40/ DHE10N40/DHB10N40/DHD10N40

5 Typical characteristics diagrams

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Jiangsu DonghaiSemiconductorTechnologyCO.,LTD. Rev.1.0 Page4of 12 DH10N40/DHF10N40/DHI10N40/ DHE10N40/DHB10N40/DHD10N40

5 Typical characteristics diagrams(continues)

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Jiangsu DonghaiSemiconductorTechnologyCO.,LTD. Rev.1.0 Page6of 12 DH10N40/DHF10N40/DHI10N40/ DHE10N40/DHB10N40/DHD10N40

6 Typical Test Circuit and Waveform

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6 Typical Test Circuit and Waveform(continues)

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7 Product Names Rules

8 Product Specifications and Packaging Models

Product Model PackageType Mark Name RoHS Package Quantity DH10N40 TO-220 DH10N40 Pb-free Tube 1000/box DHF10N40 TO-220F DHF10N40 Pb-free Tube 1000/box DHB10N40 TO-251 DHB10N40 Pb-free Tube 3000/box DHD10N40 TO-252 DHD10N40 Pb-free Tape ＆ Reel 2500/box DHI10N40 TO-262 DHI10N40 Pb-free Tube 1000/box DHE10N40 TO-263 DHE10N40 Pb-free Tape ＆ Reel 800/box RatedVoltageCode With2Digital,For Example: 60onbehalfof 600V 06onbehalfof 60V SpecialFunctionCode E onbehalfof build-in ESD Nothing onbehalfof notESD PackagingCode 220F:F 220:Nothing 251: B 252: D 262: I 263: E RatedCurrentCode With1-3Digital ForExample: 7onbehalfof 7A 60onbehalfof 60A 120onbehalfof 120A ChannelPolarityCode NonbehalfofNchannel PonbehalfofPchannel DHFXXXNEXX LOGOCode: DH A ll data sheet.com

Jiangsu DonghaiSemiconductorTechnologyCO.,LTD. Rev.1.0 Page9of 12 DH10N40/DHF10N40/DHI10N40/ DHE10N40/DHB10N40/DHD10N40

9 Dimensions

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Jiangsu DonghaiSemiconductorTechnologyCO.,LTD. Rev.1.0 Page10of12 DH10N40/DHF10N40/DHI10N40/ DHE10N40/DHB10N40/DHD10N40

9 Dimensions(continues)

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10 Attentions

 Jiangsu Donghai SemiconductorTechnology CO.,LTD.reserves the right to change the specification without prior notice!The customer should obtain the latest version of the information before making the orderand verify that the information is complete and up to date.  It is the responsibility of the purchaser for any failure or failure of any semiconductor product under certain conditions. It is the responsibility of the purchaser to comply with safety standards and to take safety measures in the system design and machine manufacturing of Donghai products in order to avoid potential risk of failure. Injury or property damage.  Product promotion is endless,our company will be dedicated to provide customers with better products.

11 Appendix

Revision history: Date REV. Description Page 2019.03.14 1.0 Original A ll data sheet.com