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Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness. Processability by workpiece material DFS8910/8960 & DAS8920/8930 Advanced planarization Surface Planer Bump height variation 1.7 µm 0.5 µm Bump surface roughness (Rz) 1.373 µm 0.039 µm Metal Resin Others Good processability Au Cu Other Photoresist (positive & negative) Polymide Composites of materials stated on the left Difficult processability Ni(electrolysis) Ｆe Reinforced resin Si Glass Ceramics [Processing example 1] Bump planarization The planarization process reduces Au bump height variation and stress (temperature and load) when bonding Au-Au interfaces for use in next generation SiP solutions. Note: Actual processability varies depending on the workpiece. Please contact your DISCO sales representative for details. Support for a variety of workpiece types Three models for a variety of applications Optional support is also available for irregularly shaped workpieces, including substrates, die, or square workpieces. Wafer diameter Features DFS8910 φ8” Fully-automatic workpiece handling, processing, and cleaning DFS8960 φ300/200 mm DAS8920 φ8” Simple and compact semi- automatic modelDAS8930 φ300 mm Before planarization After planarization DFS8960 DAS8920

DFS8910/8960, DAS8920/8930 Specifications Environmental conditions

  • Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃).
  • Keep cutting water 2 ℃ above room temperature (fluctuations within 1 ℃ over one hour).
  • Keep spindle cooling water temperature between 20 - 25 ℃ (fluctuations within 2 ℃ over an hour).
  • The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
  • This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments. * The above specifications may change due to technical modifications. Please confirm when placing your order. * For further information please contact your local sales representatives. * When using any substance other than deionized water, please contact your local representatives. 2015.12 [Processing example 2] LED phosphor resin planarization Variations in resin thickness of the LE D emission unit is the cause of color irregularities. Planarization of the resin and bumps with high accuracy using a diamond bit can contribute towards the stabilization of LED color emissions. The even surface thickness results in uniform LED color distribution [Processing example 3] Protective tape planarization Backgrinding of wafers with large bumps can result in high wafer thickness variation. The final wafer surface thickness variation can be reduced by tape planarization prior to grinding. DFS8910 DFS8960 DAS8920 DAS8930 Wafer diameter - ø8* ø300/200 mm ø8 ø300 mm Number of spindles - 1211 Number of chuck tables - 1211 Transport/Cleaning - - With With Without Without Process precision TTV μm Less than 2.0 Less than 3.0 Less than 2.0 Less than 3.0 surface roughness μm Within Ra 0.02 Within Ra 0.02 Within Ra 0.02 Within Ra 0.02 Utilities Machine dimensions (W × D × H) mm 1,200 X 2,670 X 1,800 1,400X3,312X1,870 500 X 1,235 X 1,800 730 X 1,570 X 1,800 Machine weight kg Approx. 2,400 Approx.5,000 Approx. 800 Approx. 1,600 * For customers who would like to process workpieces greater than ø8" in diameter, please contact your local DISCO sales representative. www.disco.co.jp