DFG8540 DISCO | Alldatasheet

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Technical content

Fully Automatic In-Feed Surface Grinder Advanced thinning power for large wafers Grinder of choice The DFG8540/8560 improves upon the functionality and performance that made the DISCO 800 series the grinder of choice at facilities around the world. Thin grinding (<100 µm) Advanced handling systems and design features facilitate high yield for thin wafer grinding. Design flexibility The DFG8540/8560 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140/8160) for in-line processing solutions. Improved grinding quality Through innovations in equipment design, both spindles now grind wafers at the same relative position. This improves single wafer thickness variation as well as wafer to wafer thickness variation. Backward-compatibility Supports the same proven technology of DISCO’s 800-series grinding wheels, spindles, chuck tables and dresser boards. Handy panel LCD touch screen DFG8560 Easy operation The DFG8540/8560 utilizes an LCD touch screen graphical user interface, making operation and maintenance intuitive and easy.

Fully Automatic In-Feed Surface Grinder DFG8540/8560 Specifications Safe wafer handling with the thin wafer robot pick Environmental conditions

  • Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃).
  • Keep grinding water and cleaning water + 0 - 2 ℃ above room temperature (fluctuations within 1 ℃ over one hour).
  • Keep spindle cooling water temperature between 20 - 25 ℃ (fluctuations within 2 ℃ over an hour).
  • The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation open ing, heat generation equipment or oil mist generating parts.
  • This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing an d drainage treatments. * All the pressures are described using gauge pressure. * The above specifications may change due to technical modifications. Please confirm when placing your order. * For further information please contact your local sales representatives. DFG8540 Unit DFG8540 DFG8560 - φ 8" (φ 4"/5"/6"/8") φ 300 （φ 200/φ 300） mm φ 200(φ 8") Diamond wheel φ 300 Diamond wheel kW 4.2 4.8 min-1 1,000 ～ 7,000 1,000 ～ 4,000 Thickness variation within one wafer µm 1.5 or less (with dedicated chuck table) 3.0 or less （with dedicated chuck table, φ 300mm wafer） Thickness variation between wafers µm Finished surface roughness µm mm 1,200 × 2,670 × 1,800 1,400 × 3,322 × 1,800 kg Approx.3,100 Approx.4,000 In-feed grinding with wafer Rotation Spindle Rated output Rated torque range Griding wheels Grinding Accuracy ±3.0 or lessBG Ry 0.13(with #2000 finish) Ry 0.15(with #1400 finish) Specification Wafer diameter Grinding method Machine weight Machine dimensions(W×D×H) www.disco.co.jp 2017.12