DF005M FUJI | Alldatasheet
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1 AMP GLASS PASSIVATED SILICON
¢ Surge overload rating to 45 Amperes peak e Ideal for printed circuit board W . . : . an Outline Drawin e Reliable low cost construction utilizing molded g plastic technique results in inexpensive product . . 393 (8.5) © UL recognized: File #E106441 FM >/f jE eeeo e UL recognized 94V-O plastic material 102, (2.6) 063 (1.6) 095 (2.4) i T ri 173 (44) I Mechanical Data “ore Catt “305 29 — feria) © Case: Molded Plastic meee e Leads: Tin plated copper _ 1 as = = + = e Leads solderable per MIL-STD-202, 255 (6.5) 1310 af ] 350 (8.9) Method 208 A ~|) 4 . a ¢ Polarity: Symbols molded on body — ¢ Weight: 0.02 ounce, 0.38 grams Dimensions in inches and (millimeters, i Maximum Ratings & Characteristics © Ratings at 25° C ambient temperature unless otherwise specified © Single phase, half wave, 60Hz, resistive or inductive load © For capacitive load, derate current by 20% | Tp roost] Dror | Droz | DFoaM | DFOeM | DFOSM | DFIOM | Units | |" Maximum Recurrent Peak Reverse Voltage VarM 50 | 100 | 200 | 400 | 600 | 800 | 1000 Maximum RMS input Voltage Vews | 35 Waximum DC Blocking Voltage [Voc | 50| 100_| 200 | ~400_[ 600 | 800 Maximum Average Forward @TA=40°C] | ay 10 Output Current | Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave Irs 50 A Superimposed On Rated Load _ Maximum OC Forward Voltage 14 v Maximum DC Reverse Current At Rated@ Ta= 25°C] |, 10 - wa | DC Blocking Voltag @ Ta = 125°C | 500 __ nA | I? t Rating for Fusing (t < 8.3ms) | Ft 10.4 AS | Typical Junction Capacitance per element Ce 25 pF Typical Thermal Resistance Rina 40 0 750 : “5510+150_ Collmer Semiconductor, Inc.