DF005S FUJI | Alldatasheet
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1 AMP SURFACE MOUNT GLASS
i FEATURES | , e Rating to 1000V PRV ¢ Surge overload rating to 45 Amperes peak e Ideal for printed circuit board iI , ‘i : : 5 a Outline Drawin e Reliable low cost construction utilizing molded 9g plastic technique results in inexpensive product 3100.9) © UL recognized: File #E106441 DF-S B eee *. . . a = e UL recognized 94V-O plastic material ell CEE 250) . W A 003 (.076) i Mechanical Data U U L “0 tien sa) © Case: Molded plastic (045 (1.14) 333 18.8) e Leads: Tin plated copper ) sea Leads solderable per MIL-STD-202, “oS ety Method 208 rr H A | ¢ Polarity: Symbols molded on body [205 52) a 195 (6.0) © Weight: 0.02 ounce, 0.38 grams Dimensions in inches and (millimeters) i Maximum Ratings & Characteristics © Ratings at 25° C ambient temperature unless otherwise specified © Single phase, half wave, 60Hz, resistive or inductive load © For capacitive load, derate current by 20% | Maximum Recurrent Peak Reverse Voltage [|'Varm | 50 | 100 |" 200 |” 400 |" 600 {goo | 1000 | V_ | | MaximumRMS Voltage | Ves | 35 | 70 | 140 | 280 | 420 | 560 | 700 | Vv | | Maximum DC Blocking Voltage | Voc =| 50 | 100 | 200 | 400 | 600 | 800 | 1000 | Vv | Maximum Average Forward @ Ta=40°C lay Output Current bed | Peak Forward Surge Current | 8.3 ms Single Half-Sine-Wave A ‘Superimposed On Rated Load |_Maximum DC Forward Voltage AT 1.0A DC | Maximum DC Reverse Current @ Ta=25°C WA At Rated DC Blocking Voltage @ Ta= 125°C | | PtRatingfor Fusing (t<8.3ms) tt | | Typical Thermal Resistance perElement [| Cy |B Typical Thermal Resistance [Rue [cr | [Storage Temperature Range «de | SSCS TOTO SSSCSCSC*~C~‘*dC “CS Collmer Semiconductor, Inc.