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Reliable separation of small die wafers The DDS2010 offers an integrated expansion and breaking solution to achieve high-yield and high-throughput die singulation of wafers processed using stealth dicing (SD)*. *Stealth dicing is a processing method that focuses a laser within the workpiece to form a modified layer, after which a tape expander is used to separate the die. This processing method is effective in achieving street reduction for small die or rectangular-shaped die such as RFID ICs and line sensors. High throughput Scan breaking can be performed at a set speed for the stable separation of any die size. This is faster than 3-point breaking which requires the breaking bar to stop at each line. DDS2010 Automatic Die Separator High yield and high throughput separation of small die processed with stealth dicing Tape expansion and scan breaking  The scan breaking bar ensures 100% singulation of unseparated die after tape expansion.  After separation, the wafer is transferred to a tape frame matching the size of the wafer being processed while maintaining the space between the die. Processing time halved ウェーハ バキュームバキューム R形状に沿わせて スキャン スキャニングバー ダイシングテープ 【スキャンブレーキング】 バキュームにより、ウェーハをR形状に沿わせて折り曲げるこ とで分割する 約53% 短 縮 Wafer: ø8” x 0.1 mm thick Die size: 0.5 mm² Process time per wafer 100 200 300 400 500 600 700 800 3-point breaking unit DDS2010 Time (s) -53% Process flow Wafer mounting Wafer loading Manual Automatic alignment θ alignment Expansion Scan breaking Transfer to a smaller frame Expansion maintained Unloading Manual Unseparated die Ø300 mm tape frame Ø8” Ø300 mm tape frame The workpiece is mounted to a larger tape frame The workpiece is transferred to a tape frame matching the wafer size while maintaining expansion Scan breaking The wafer is bent downward using vacuum suction, which causes the die to separate Wafer Scanning along the rounded edgeVacuum Dicing tape Scanning bar Note: These are DISCO measurements and sample process times. These results cannot be guaranteed for all conditions

www.disco.co.jp Automatic Die Separator DDS2010 2014.11 No pattern side protective film required during breaking Stealth Dicing Front side: Pattern side Bottom side: Backside No pattern side protective film required Front side: Pattern side Separation side: Backside Reduced die damage during expansion Space between die reduces the chance of impact Step 1: Expansion Step 2: CH1 & CH2 breaking No breakage from impact between die specification Environmental conditions

  • Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃).
  • Keep cutting water and cooling water at the same (within ±1 ℃ fluctuations) temperature as the room.
  • Use water that has a specific electric conductivity greater than 1µS for cutting.
  • The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening , heat generation equipment or oil mist generating parts.
  • This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments. * All the pressures are described using gauge pressures. * The above specifications may change due to technical modifications. Please confirm when placing your order. * For further information please contact your local sales representatives Unit mm φ8" mm 0.1 ～0.5(narrow side) mm ±2.5 deg ±3° mm 718×897×1608 (including status indicator) kg Approx.450 Specification Workpiece size Dice size Wafer mounting accuracy X/Y direction (frame mount) Wafer mounting accuracy θ direction (frame mount) Machine dimensions (W×D×H) Machine weight