DD412GR-3A

DD412GR-3A SEOUL | Alldatasheet

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www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Seoul semiconductor Customer Drawn by Checked by Approved by Approved by SPECIFICATION [DD412Bx-xx]

Description

www.seoulsemicon.com2 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Enabling mobile flash with high flux Flash LED DD412GR-3A

• 1-chip in one package
• SMT solderability
• Own patent reserved
• RoHS Compliant
• Low Thermal Resistance
• Pb-free Reflow Soldering application
• 2.04mm x 1.64mm x 0.74mm
• White colored SMT package
• Camera cell phones
• PDA’s
• Digital still cameras RoHS HF

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Table of Contents Index

• Product Brief
• Table of Contents
• Performance Characteristics
• Characteristic Diagram
• Reliability Test
• Color Bin Structure
• Mechanical Dimension
• Material Structure
• Packaging Information
• Reflow Soldering Characteristics
• Handling of Silicone Resin for LEDs
• Precaution For Use
• Company Information

Table 2. Electro Optical Characteristics (Ta = 25ºC) (2) Фv is total luminous flux output as measured with an integrating sphere. (3) 21/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. (1) Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. (3) Maximum peak forward current depends on junction temperature. Table 1. Absolute Maximum Ratings (Ta = 25ºC)

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Characteristic Diagram Product Data Sheet Fig 1. Color Spectrum, Ta = 25℃, IF = 1000mA, RH30% Fig 2. Radiant pattern, Ta = 25℃ -80 -60 -40 -20 0 20 40 60 80 0.0 0.2 0.4 0.6 0.8 1.0 X-axis Y-axis Relative Intensity [a.u.] Angle [degree] 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 Relative Intensity [a.u.] Wavelength [nm]

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Characteristic Diagram Product Data Sheet Fig 3. Forward Voltage vs. Forward Current , Ta = 25℃ Fig 4. Forward Current vs. Relative Luminous Intensity, Ta = 25℃ 200 400 600 800 1000 Forward Current [mA] Forward Voltage [V] 0 200 400 600 800 1000 0.0 0.2 0.4 0.6 0.8 1.0 Relative Intensity [a.u.] Forward Current [mA]

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Characteristic Diagram Product Data Sheet Fig 5. Forward Current vs. CIE X, Y Shift, Ta = 25℃ Fig 6. Color Coordinate vs. Ambient Temperature, IF =300mA 0.346 0.348 0.350 0.352 0.354 0.356 0.358 0.360 0.362 0.364 50℃ 85℃ 25℃ -30℃ Color coordinate y Color coordinate x 0.350 0.352 0.354 0.356 0.358 0.360 0.362 0.364 0.366 0.368 0.370 1000mA 800mA 500mA 300mA 100mA Color coordinate y Color coordinate x

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Characteristic Diagram Product Data Sheet Fig 7. Forward Voltage vs. Ambient Temperature, IF =300mA Fig 8. Relative Luminosity vs. Ambient Temperature, IF =300mA Forward Current vs. Ambient Temperature 20 30 40 50 60 70 80 90 0.95 0.96 0.97 0.98 0.99 1.00 1.01 VF/VF@25℃ [a.u.] Ambient Temperature [℃] 20 30 40 50 60 70 80 90 0.90 0.92 0.94 0.96 0.98 1.00IV/IV@25℃ [a.u.] Ambient Temperature [℃]

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Characteristic Diagram Product Data Sheet Fig 9. Maximum Forward Current vs. Junction Temperature Fig 10. Allowable Forward Current vs. Duty Ratio, Ta = 25℃, Tw=0.2s 0 200 400 600 800 1000 100 Peak Forward Current [mA] Duty Ratio [%] 0 20 40 60 80 100 200 400 600 800 1000 DC Pulse Maximum Forward Current [mA] Junction Temperature [degree]

Table 3. TEST ITEMS AND RESULTS Table 4. Criteria for Judging the Damage

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Color Bin Structure CIE Chromaticity Diagram * Measurement Uncertainty of the Color Coordinates is ±0.01 RANK x1 y1 x2 y2 x3 y3 x4 y4 B 0.3261 0.3632 0.3324 0.3694 0.3323 0.3021 0.3282 0.2979 C 0.3324 0.3694 0.3396 0.3766 0.3368 0.3070 0.3323 0.3021 0.325 0.330 0.335 0.340 0.30 0.32 0.34 0.36 0.38 CB 5250K 5500K 5750K Cy Cx

Table 5. Bin Code description

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Mechanical Dimensions PKG Outline dimension [Recommend solder pad pattern] ( Tolerance: ±0.1, Unit: mm ) MDAABB ※ Marking Code M : Year + Month Code D : Day Code AA : SSC Internal Code BB : SSC Internal Code [Inner Circuit]

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Material Structure ② ③④⑤ No. LIST MATERIAL ① FRAME Ceramic ② LED CHIP GaN On SAPPHIRE ③ WIRE GOLD WIRE ④ ENCAPSULATION SILICONE ⑤ PHOSPHOR - ⑥ ZENER DIODE Si

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Packaging & Label Information ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 180 ±0.2 Label 2 ±0.2 60 +0.2 11.4 9 ±0.3

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box

Table 4. Part Numbering System : X1X2X3 - X4X5 - X6X7 - X8X9

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Reflow Soldering Characteristics (3) Hand Soldering conditions Not more than 3 seconds @MAX 350C, under Soldering iron. In case that the soldered products are reused in soldering process, we don’t guarantee the products. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C1~5 C / sec. ooo o1~5 C / sec. Lead-frame Solder (1) Lead Solder (2) Lead-Free Solder Lead Free Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max.

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) Avoid leaving fingerprints on silicone resin parts.

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Precaution for Use Product Data Sheet (1) Storage conditions Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption. a. Keep it at a temperature in the range from 5C to 30C and at a humidity of less than 50% RH. The product should be kept within a year. (2) After opening the package . When soldering, this could result in a decrease of the photoelectric effect or light intensity. a. Soldering should be done right after mounting the product. b. Keep the temperature in the range from 5C to 30C and the humidity at less than 60%. Soldering should be done within 28 days after opening the desiccant package. If the product has been exposed for more than 28 days after opening the package or the indicating color of the desiccator changes, the product must be baked at a temperature between 65 ±5C for less than 24 hours. An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry atmosphere. Stored at a humidity of less than 10% RH. (3) Precautions for use Any external mechanical force or excessive vibration should not be applied to the product during cooling after soldering, and it is preferable to avoid rapid cooling. The product should not be mounted on a distorted part of PCB. Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and surge damage, and all devices and equipments must be grounded to the earth. (4) Miscellaneous Radiation resistance is not considered. When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used and IPA(Isopropyl Alcohol) must be used. When using the product, operating current should be settled in consideration of the maximum ambient temperature. Its appearance or specification for improvement is subject to change without notice.

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Precaution for Use (5) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment)

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device

www.seoulsemicon.com Product Data Sheet 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Rev1.0, November 28 2019 DD412Bx-xx –Flash LED Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice.