DB62 APEX | Alldatasheet
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Technical content
Table 1. Commutation Table. for the VS supplies (C2 and C12 on the EVAL49 schematic). bypassing and other useful information.
- User Controlled PWM frequency using external potentiom-
be varied from 4 KHz to 118 KHz.
- User Controlled PWM duty cycle using external potenti -
cycle can be varied from 0 % to 98 %. button can be used to run or stop the motor. the MCU is shown in table 1.
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 *OJUJBMJ[BUJPO %JTBCMF 'PSXBSE3FWFSTF :FT /P 4UBSU :FT )BMM4FOTPS *OQVUT $IBOHFE %JSFDUJPO -PBE'PSXBSE5BCMF #FHJOOJOHUP'43 -PBE3FWFSTF5BCMF #FHJOOJOHUP'43 3FBEWBMVFGSPN5BCMF )BMM PGGTFU BOEMPBEUP 07%$0/%SFHJTUFS :FT :FT /P4QFFE 3FGFSFODF $IBOHF :FT 3FDBMDVMBUF 18.%VUZ $ZDMF 3FDBMDVMBUF 18.'SFRVFODZ $ZDMF 'BVMU 'SFRVFODZ 3FGFSFODF $IBOHF Figure 1: Algorithm for Microchip® PIC 18F2331 MCU as implemented for DB62. EVALUATION KIT FOR SA305EXDB62
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com EVALUATION KIT FOR SA305EX DB62 SPECIAL CONSIDERATIONS a) 6 schottky diodes D1-D6 (2 for each output provided with DB62) are recommended for use as external flyback diodes because of superior reverse recovery characteristics. Please note that in the DB62, jumpers are needed in order to con- nect the external schottky diodes (see EVAL49 layout). b) External RC snubber circuits (R13 and C5, R16 and C8, R19 and C10 in EVAL49 schematic) can provide noise immunity especially in high load current scenarios. A 100 V 4.7nF capacitor in series with a 50 ohm 5W resistor (provided with kit) is recommended for the snubber to be connected between each output and PGND. The power dissipated in the snubber components can be estimated by; P = V2 • C • FSW Where P is the power dissipated V is the VS supply voltage C is the snubber capacitor value (15nF) FSW is the switching frequency. GROUNDING CONSIDERATIONS The EVAL49 has three separate ground paths for signal ground (SGND), power ground (PGND) and digital ground (DGND). SGND and PGND are the ground paths for the SA305 while the DGND is for the MCU and related circuitry. These grounds need to be connected on the board by putting a jumper between SGND and DGND and another between PGND and DGND. These jumpers are located in the center of the board on the right of the SA305. Do not connect the grounds at any other points to avoid ground loops and un - wanted voltage drops. PARTS LIST Apex Part # Description, Vendor Qty EVAL49 PC Board, Apex 1 OX7R105KWN 1µF Cap, Novacap 4 MS06 Pin Socket 1 MS11 Socket Strip 1 Bag (Black) 151-203-RC Test Point 3 Mouser (White) 151-201-RC Test Point 5 Mouser 110-13-328-41-001000 DIP28 Socket 1 Mill-Max (White) 571-0600 4mm single PCB socket 16 Deltron (Red) 571-0500 4mm single PCB socket 3 Deltron (Black) 571-0100 4mm single PCB socket 3 Deltron ECG-EVQPAC07K Push Button Switch, 3 Panasonic 3352W-1-102 Potentiometer, 2 Bourns 50SQ100 Schottky Diodes, 6 International Rectifier 140-ESRL100V100 100uF cap, 2 Xicon MCU-305 PIC18F2331-1/SP-ND 1 Microchip CFRN60D1001FRE6 1K Ohm Resistor, 3 (R23,R24.R25) 5% 0.25W RN60D4701FB14 4.7K Ohm Resistor, 4 (R1, R2, R3, R6) 5% 0.25W CFI-4C1R0J 1 Ohm Resistor, 2 (R5, R10) 5% 0.25W RN60D2000FB14 200 Ohm Resistor, 6 (R17, R18, R20, R21, R22, R26) 5% 0.25W WP63GD Green LED's, 5 (D8-D12) WP631D Red LED, (D7) 1 (Optional Components: Refer to SA305U for details) Apex Part # Description, Vendor Qty HWRE06 Includes the following: HS32 Heatsink, 1 Apex CLAMP05 Clip, 1 Apex TW12 Thermal Washer, 1 Box Apex C062K472K2X5CA 4.7 nF Capacitor, 3 Kemet 286-51-RC 50 ohm 5W resistor, 3 Xicon
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 EVALUATION KIT FOR SA305EXDB62 ASSEMBLY Before starting the assembly, please review the special con- siderations section to be able to differentiate between required and recommended components. The assembly instructions below cover all the components in the board irrespective of whether they are required or optional. Use the bread board - ing area for any additional circuitry (example: pull-up for hall sensors) that might be required. 1. Note that each side of the circuit board is identified as either the “component side” or “bottom side.” The component side is labeled on the silk screen side of the board. Cut the MS11 strip into strips of 12 and 11. Discard the remaining small strip of 7. Insert the two strips into the two rows of holes for the DUT from the component side of the PCB. From the bottom side, solder all cage jacks to the circuit board pads. Be sure that the cage jacks are fully seated before soldering. Be careful that the solder does not flow into the cage jack. Remove the plastic carrier strips. 2. From the component side, solder a jumper between SGND and DGND and another between PGND and DGND. 3. From the component side, solder the surface mount capaci- tors, C1, C4, C7 and C11 and resistors R5 and R10. 4. From the component side, solder jumpers into place for the following components: R12, R14, R15, R27, R28 and R29. 5. From the component side, solder pin sockets into place for the following components: C5, C8, C10, R8, J1A (2 pin sockets), J1B, J2A, J2B, J3A, J3B and DGND. 6. Study the DIP28 socket and notice the notch on one end. From the component side, insert the socket, making sure that the socket has the same orientation as the silk screen diagram. Solder in the socket from the bottom side. 7. Solder one end of an insulated jumper wire to Pin 11 of the DIP28 socket, and plug the other end into one of the two pin sockets at J1A. 8. From the component side, insert the potentiometers VDUC and VFREQ in the specified orientation and solder from the bottom side. Carefully bend the potentiometers down to a horizontal position. 9. From the component side, insert switches SW1 and SW2 and solder from the bottom side. 10. From the component side, insert White Test Points into TP1, TP2, PWM_HC1, PWM_HB1 and PWM_HA1. Insert Black Test Points into PWM_LC1, PWM_LB1 and PWM_LA1. Solder all test points from the bottom side. 11. From the component side, insert the following components: R1, R2, R3, R6, R7, R11, R17, R20, R26, R22, R21, R18, R23, R24 and R25, and solder from the bottom side. 12. From the component side, insert LED’s D7, D9, D12, D11, D10 and D8 and solder from the bottom side. 13. If Hall Effect Sensor pull-up resistors are necessary, install resistors in bread board to the left of the HALL_A, HALL_B and HALL_C sockets. 14. Install pin socket in bread board directly under DGND pin socket. 15. From the component side, insert the 4MM PCB sockets. Note that there are 4 Black sockets, for SGND, DGND, PGND and OFF. There are 5 Red sockets, for VPWR, VDD2, VDD, FAULT and WARNING. The remaining 10 White sockets are for the remaining Input/Output signals. Solder all sockets from the bottom side. 16. From the component side, insert Schottky diodes D1, D2, D3, D4, D5 and D6. Solder from the bottom side. Do NOT trim off excess lead length at this time. 17. If Hall Sensor pull-up resistors are to be used, at this time, on the bottom side, connect wires from HALL_A, HALL_B, HALL_C and VDD to the appropriate bread-board sockets as determined in Step 13. 18. On the bottom side, connect a wire from OFF PCB connec- tor to pin socket directly under DGND pin socket (installed in Step 14). 19. On the bottom side, connect 16-gauge wire from D4 cath- ode to AOUT PCB connector. Connect another 16-gauge wire from D6 cathode to COUT PCB connector. Connect a third 16-gauge wire from D5 cathode to BOUT PCB connector. Now, trim off the excess lead length from the Schottky diodes. 20. From the component side, insert the snubber resistors, R13, R16 and R19, and solder from the bottom side. Insert snubber capacitors, C5, C8 and C10 into the previously installed pin sockets. 21. From the component side, insert the electrolytic capacitors, C12 and C2, and solder from the bottom side. 22. Install jumper as desired for J3A and/or J3B. Install jumper from J1A to J1B. If desired, jumper J2A and J2B. 23. Using appropriate hardware, install stand-offs at each corner hole. 24. Clip the SA305 into the HS32 heat sink with the CLAMP05 clip. Carefully insert the part with the heat sink into the MS11 sockets. Bolt the heat sink in from the bottom side of the board using the holes provided on the PCB. SOFT-START FEATURE: A soft start algorithm has been developed so that the duty cycle at start-up is low and the motor ramps up to the specified speed reference. The startup duty cycle should be programmed so that the over current limit of the SA305 is not exceeded at start-up. The algorithm enables controlling the rate of acceleration and consequently the maximum current. When the motor is to be reversed the soft-start algorithm is once again initiated, causing the motor to gradually accelerate in the opposite direction. Please refer to application note 45 for details on the soft-start algorithm. FAULT RESET: The SA305 requires an external reset pulse at the disable pin to resume normal operation when the part is in a latched fault condition because of Short-circuit, Over Temperature (>160°C) or Over-Current (>10 A). In the DB62 board, there is a provision to reset the part automatically without human intervention. A jumper needs to be connected between J1A and P11 of MCU as shown in the schematic. When a fault occurs, an interrupt is generated which in turn starts generat- ing pulses at P11 to reset the SA305.
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APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 EVAL49 LAYOUT This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice. DB62U REV B OCTOBER 2006 © 2006 Apex Microtechnology Corp.. 5017*&8 #0550.7*&8 EVALUATION KIT FOR SA305EXDB62