LNK302_V01 POWERINT | Alldatasheet

Document overview

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Technical content

www.power.com December 2021 Lowest Component Count, Energy-Efficient Off-Line Switcher IC This Product is Covered by Patents and/or Pending Patent Applications. Output Current Table 1 Product4

230 VAC ±15% 85-265 VAC

LNK302P/G/D 63 mA 80 mA 63 mA 80 mA LNK304P/G/D 120 mA 170 mA 120 mA 170 mA LNK305P/G/D 175 mA 280 mA 175 mA 280 mA LNK306P/G/D 225 mA 360 mA 225 mA 360 mA Table 1. Output Current Table.

  1. Typical output current in a non-isolated buck converter. Output power capability

conduction mode (DCM) operation.

  1. Mostly discontinuous conduction mode.
  2. Continuous conduction mode.
  3. Packages: P: DIP-8B, G: SMD-8B, D: SO-8C.
  • Lowest cost and component count buck converter solution
  • Fully integrated auto-restart for short-circuit and open loop fault protection – saves external component costs
  • LNK302 uses a simplified controller without auto-restart for very low system cost
  • 66 kHz operation with accurate current limit – allows low cost off-the-shelf 1 mH inductor for up to 120 mA output current
  • Tight tolerances and negligible temperature variation
  • High breakdown voltage of 700 V provides excellent input surge withstand
  • Frequency jittering dramatically reduces EMI (~10 dB)
  • Minimizes EMI filter cost
  • High thermal shutdown temperature (+135 °C minimum) Much Higher Performance Over Discrete Buck and Passive Solutions
  • Supports buck, buck-boost and flyback topologies
  • System level thermal overload, output short-circuit and open control loop protection
  • Excellent line and load regulation even with typical configuration
  • High bandwidth provides fast turn-on with no overshoot
  • Current limit operation rejects line ripple
  • Universal input voltage range (85 VAC to 265 VAC)
  • Built-in current limit and hysteretic thermal protection
  • Higher efficiency than passive solutions
  • Higher power factor than capacitor-fed solutions
  • Entirely manufacturable in SMD EcoSmart ™– Extremely Energy Efficient
  • Consumes typically only 50/80 mW in self-powered buck topology at 115/230 VAC input with no-load (opto feedback)
  • Consumes typically only 7/12 mW in flyback topology with external bias at 115/230 VAC input with no-load
  • Meets California Energy Commission (CEC), Energy Star, and EU requirements

Applications

  • Appliances and timers
  • LED drivers and industrial controls

Description

LinkSwitch™-TN is specifically designed to replace all linear and capacitor-fed (cap dropper) non-isolated power supplies in the under 360 mA output current range at equal system cost while offering much higher performance and energy efficiency. LinkSwitch-TN devices integrate a 700 V power MOSFET, oscillator, simple On/Off control scheme, a high-voltage switched current source, frequency jittering, cycle-by-cycle current limit Figure 1. Typical Buck Converter Application (See Application Examples Section for Other Circuit Configurations). buck-boost converters, if required.

Rev. P 12/21 LNK302/304-306 www.power.com Figure 2a. Functional Block Diagram (LNK302). PI-3904-032213 CLOCK JITTER OSCILLATOR 5.8 V 4.85 V SOURCE (S) S R Q DCMAX BYPASS (BP) - VILIMIT LEADING EDGE BLANKING THERMAL SHUTDOWN DRAIN (D) REGULATOR 5.8 V BYPASS PIN UNDERVOLTAGE CURRENT LIMIT COMPARATOR FEEDBACK (FB) Q 6.3 V

1.65 V -VT

5.8 V 4.85 V SOURCE (S) S R Q DCMAX BYPASS (BP) FAULT PRESENT - VILIMIT LEADING EDGE BLANKING THERMAL SHUTDOWN DRAIN (D) BYPASS PIN UNDERVOLTAGE CURRENT LIMIT COMPARATOR FEEDBACK (FB) Q 6.3 V RESET AUTO- RESTART COUNTER 5.8 V Figure 2b. Functional Block Diagram (LNK304-306).

current for both start-up and steady-state operation. internally generated 5.8 V supply. current greater than 49 mA is delivered into this pin. ground reference for the BYPASS and FEEDBACK pins. indicates the beginning of each cycle. illustrates the frequency jitter of the LinkSwitch-TN. pin voltage or current during the remainder of the cycle are ignored. frequency decoupling and energy storage. the no-load consumption to about 50 mW. MOSFET when the BYPASS pin voltage drops below 4.85 V. back to 5.8 V to enable (turn-on) the power MOSFET. The thermal shutdown circuitry senses the die temperature. The threshold is set at 142 °C typical with a 75 °C hysteresis. die temperature falls by 75 °C, at which point it is re-enabled. The current limit circuit senses the current in the power MOSFET. power MOSFET is turned off for the remainder of that cycle. Figure 3. Pin Configuration.

power MOSFET until the fault condition is removed.

12 V, 120 mA non-isolated power supply used in appliance

control such as rice cookers, dishwashers or other white goods. heating controllers, where a non-isolated supply is acceptable. capacitor than the value of the capacitor itself. power to approximately 6% of the maximum overload power. load is required, then this value should be reduced to 2.4 k Ω. Figure 4. Frequency Jitter. Figure 5. Universal Input, 12 V, 120 mA Constant Voltage Power Supply Using LinkSwitch-TN.

Table 2. Common Circuit Configurations Using LinkSwitch-TN. (continued on next page)

  1. Output referenced to input
  2. Positive output (VO) with respect to -VIN
  3. Low cost direct feedback (±10% typ.)
  4. Requires an output load to maintain regulation
  5. Output referenced to input
  6. Positive output (VO) with respect to -VIN
  7. Minimum no-load consumption
  8. Output referenced to input
  9. Negative output (VO) with respect to +VIN
  10. Output referenced to input
  11. Negative output (VO) with respect to +VIN
  12. Step up/down – VO > VIN or VO < VIN
  13. Low cost direct feedback (±10% typ.)
  14. Fail-safe – output is not subjected to input
  15. Ideal for driving LEDs – better accuracy and
  16. Requires an output load to maintain regulation

Rev. P 12/21 LNK302/304-306 www.power.com Table 2 (cont). Common Circuit Configurations Using LinkSwitch-TN. Topology Basic Circuit Schematic Key Features Low-Side Buck-Boost – Optocoupler Feedback 1. Output referenced to input 2. Positive output (VO) with respect to +VIN 3. Step up/down – VO > VIN or VO < VIN 4. Optocoupler feedback - Accuracy only limited by reference choice - Low cost non-safety rated optocoupler - No pre-load required 5. Fail-safe – output is not subjected to input voltage if the internal power MOSFET fails 6. Minimum no-load consumption LinkSwitch-TN PI-3756-041509 BP FB DS VOVIN Component Selection Referring to Figure 5, the following considerations may be helpful in selecting components for a LinkSwitch-TN design. Freewheeling Diode D1 Diode D1 should be an ultrafast type. For MDCM, reverse recovery time tRR ≤75 ns should be used at a temperature of 70 °C or below. Slower diodes are not acceptable, as continuous mode operation will always occur during startup, causing high leading edge current spikes, terminating the switching cycle prematurely, and preventing the output from reaching regulation. If the ambient temperature is above 70 °C then a diode with tRR ≤35 ns should be used. For CCM an ultrafast diode with reverse recovery time tRR ≤35 ns should be used. A slower diode may cause excessive leading edge current spikes, terminating the switching cycle prematurely and preventing full power delivery. Fast and slow diodes should never be used as the large reverse recovery currents can cause excessive power dissipation in the diode and/or exceed the maximum drain current specification of LinkSwitch-TN. Feedback Diode D2 Diode D2 can be a low-cost slow diode such as the 1N400X series, however it should be specified as a glass passivated type to guarantee a specified reverse recovery time. To a first order, the forward drops of D1 and D2 should match. Inductor L1 Choose any standard off-the-shelf inductor that meets the design requirements. A “drum” or “dog bone” “I” core inductor is recommended with a single ferrite element due to its low cost and very low audible noise properties. The typical inductance value and RMS current rating can be obtained from the LinkSwitch-TN design spreadsheet available within the PI Expert design suite from Power Integrations. Choose L1 greater than or equal to the typical calculated inductance with RMS current rating greater than or equal to calculated RMS inductor current. Capacitor C2 The primary function of capacitor C2 is to smooth the inductor current. The actual output ripple voltage is a function of this capacitor’s ESR. To a first order, the ESR of this capacitor should not exceed the rated ripple voltage divided by the typical current limit of the chosen LinkSwitch-TN. Feedback Resistors R1 and R3 The values of the resistors in the resistor divider formed by R1 and R3 are selected to maintain 1.65 V at the FEEDBACK pin. It is recommended that R3 be chosen as a standard 1% resistor of 2 kΩ. This ensures good noise immunity by biasing the feedback network with a current of approximately 0.8 mA. Feedback Capacitor C3 Capacitor C3 can be a low cost general purpose capacitor. It provides a “sample and hold” function, charging to the output voltage during the off time of LinkSwitch-TN. Its value should be 10 mF to 22 mF; smaller values cause poorer regulation at light load conditions. Pre-Load Resistor R4 In high-side, direct feedback designs where the minimum load is <3 mA, a pre-load resistor is required to maintain output regulation. This ensures sufficient inductor energy to pull the inductor side of the feedback capacitor C3 to input return via D2. The value of R4 should be selected to give a minimum output load of 3 mA. In designs with an optocoupler the Zener or reference bias current provides a 1 mA to 2 mA minimum load, preventing “pulse bunching” and increased output ripple at zero load. LinkSwitch-TN Layout Considerations In the buck or buck-boost converter configuration, since the SOURCE pins in LinkSwitch-TN are switching nodes, the copper area connected to SOURCE should be minimized to minimize EMI within the thermal constraints of the design. In the boost configuration, since the SOURCE pins are tied to DC return, the copper area connected to SOURCE can be maximized to improve heat sinking. The loop formed between the LinkSwitch-TN, inductor (L1), freewheeling diode (D1), and output capacitor (C2) should be kept as small as possible. The BYPASS pin capacitor C1 (Figure 6) should be located physically close to the SOURCE (S) and BYPASS (BP) pins. To minimize direct coupling from switching nodes, the LinkSwitch-TN should be placed away

Rev. P 12/21 LNK302/304-306 www.power.com from AC input lines. It may be advantageous to place capacitors C4 and C5 in-between LinkSwitch-TN and the AC input. The second rectifier diode D4 is optional, but may be included for better EMI performance and higher line surge withstand capability. Quick Design Checklist As with any power supply design, all LinkSwitch-TN designs should be verified for proper functionality on the bench. The following minimum tests are recommended: 1. Adequate DC rail voltage – check that the minimum DC input voltage does not fall below 70 VDC at maximum load, minimum input voltage. 2. Correct Diode Selection – UF400x series diodes are recom- mended only for designs that operate in MDCM at an ambient of 70 °C or below. For designs operating in continuous conduction mode (CCM) and/or higher ambients, then a diode with a reverse recovery time of 35 ns or better, such as the BYV26C, is recommended. 3. Maximum drain current – verify that the peak drain current is below the data sheet peak drain specification under worst- case conditions of highest line voltage, maximum overload (just prior to auto-restart) and highest ambient temperature. 4. Thermal check – at maximum output power, minimum input voltage and maximum ambient temperature, verify that the LinkSwitch-TN SOURCE pin temperature is 100 °C or below. This figure ensures adequate margin due to variations in RDS(ON) from part to part. A battery powered thermocouple meter is recommended to make measurements when the SOURCE pins are a switching node. Alternatively, the ambient temperature may be raised to indicate margin to thermal shutdown. In a LinkSwitch-TN design using a buck or buck-boost converter topology, the SOURCE pin is a switching node. Oscilloscope measurements should therefore be made with probe grounded to a DC voltage, such as primary return or DC input rail, and not to the SOURCE pins. The power supply input must always be supplied from an isolated source (e.g. via an isolation transformer).

Rev. P 12/21 LNK302/304-306 www.power.com Absolute Maximum Ratings(1,5) Notes: 1. All voltages referenced to SOURCE, TA = 25 °C. 2. The higher peak DRAIN current is allowed if the DRAIN to SOURCE voltage does not exceed 400 V. 3. Normally limited by internal circuitry. 4. 1/16 in. from case for 5 seconds. 5. Maximum ratings specified may be applied, one at a time, without causing permanent damage to the product. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect product reliability. Thermal Resistance Thermal Resistance: P or G Package: D Package: Notes: 1. Measured on pin 2 (SOURCE) close to plastic interface. 2. Measured on pin 8 (SOURCE) close to plastic interface. Parameter Symbol Conditions SOURCE = 0 V; TJ = -40 to 125 °C See Figure 7 (Unless Otherwise Specified) Min Typ Max Units Control Functions Output Frequency fOSC TJ = 25 °C Average 62 66 70 kHz Peak-Peak Jitter 4 Maximum Duty Cycle DCMAX S2 Open 66 69 72 % FEEDBACK Pin Turnoff Threshold Current IFB TJ = 25 °C 30 49 68 mA FEEDBACK Pin Voltage at Turnoff Threshold VFB 1.54 1.65 1.76 V DRAIN Pin Supply Current IS1 VFB ≥2 V (MOSFET Not Switching) See Note A 160 220 mA IS2 FEEDBACK Open (MOSFET Switching) See Notes A, B LNK302/304 200 260 mALNK305 220 280 LNK306 250 310 BYPASS Pin Charge Current ICH1 VBP = 0 V TJ = 25 °C mA ICH2 VBP = 4 V TJ = 25 °C

Rev. P 12/21 LNK302/304-306 www.power.com Parameter Symbol Conditions SOURCE = 0 V; TJ = -40 to 125 °C See Figure 7 (Unless Otherwise Specified) Min Typ Max Units Control Functions (cont.) BYPASS Pin Voltage VBP 5.55 5.8 6.10 V BYPASS Pin Voltage Hysteresis VBPH 0.8 0.95 1.2 V BYPASS Pin Supply Current IBPSC See Note D 68 mA Circuit Protection Current Limit ILIMIT (See Note E) di/dt = 55 mA/ms TJ = 25 °C LNK302 126 136 146 mA di/dt = 250 mA/ms TJ = 25 °C 145 165 185 di/dt = 65 mA/ms TJ = 25 °C LNK304 240 257 275 di/dt = 415 mA/ms TJ = 25 °C 271 308 345 di/dt = 75 mA/ms TJ = 25 °C LNK305 350 375 401 di/dt = 500 mA/ms TJ = 25 °C 396 450 504 di/dt = 95 mA/ms TJ = 25 °C LNK306 450 482 515 di/dt = 610 mA/ms TJ = 25 °C 508 578 647 Minimum On Time tON(MIN) LNK302/304 280 360 475 nsLNK305 360 460 610 LNK306 400 500 675 Leading Edge Blanking Time tLEB TJ = 25 °C See Note F 170 215 ns Thermal Shutdown Temperature TSD 135 142 150 °C Thermal Shutdown Hysteresis TSHD See Note G 75 °C

Rev. P 12/21 LNK302/304-306 www.power.com Parameter Symbol Conditions SOURCE = 0 V; TJ = -40 to 125 °C See Figure 7 (Unless Otherwise Specified) Min Typ Max Units Output ON-State Resistance RDS(ON) LNK302 ID = 13 mA TJ = 25 °C 48 55.2 Ω TJ = 100 °C 76 88.4 LNK304 ID = 25 mA TJ = 25 °C 24 27.6 TJ = 100 °C 38 44.2 LNK305 ID = 35 mA TJ = 25 °C 12 13.8 TJ = 100 °C 19 22.1 LNK306 ID = 45 mA TJ = 25 °C 7 8.1 TJ = 100 °C 11 12.9 OFF-State Drain Leakage Current IDSS VBP = 6.2 V, VFB ≥2 V, VDS = 560 V, TJ = 25 °C LNK302/304 50 mALNK305 70 LNK306 90 Breakdown Voltage BVDSS VBP = 6.2 V, VFB ≥2 V, TJ = 25 °C 700 V Rise Time tR Measured in a Typical Buck Converter Application 50 ns Fall Time tF 50 ns DRAIN Pin Supply Voltage 50 V Output Enable Delay tEN See Figure 9 10 ms Output Disable Setup Time tDST 0.5 ms Auto-Restart ON-Time tAR TJ = 25 °C See Note H LNK302 Not Applicable ms LNK304-306 50 Auto-Restart Duty Cycle DCAR LNK302 Not Applicable LNK304-306 6 Notes: A. Total current consumption is the sum of IS1 and IDSS when FEEDBACK pin voltage is ≥2 V (MOSFET not switching) and the sum of IS2 and IDSS when FEEDBACK pin is shorted to SOURCE (MOSFET switching). B. Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at the DRAIN. An alternative is to measure the BYPASS pin current at 6 V. C. See Typical Performance Characteristics section Figure 14 for BYPASS pin start-up charging waveform. D. This current is only intended to supply an optional optocoupler connected between the BYPASS and FEEDBACK pins and not any other external circuitry. E. For current limit at other di/dt values, refer to Figure 13. F. This parameter is guaranteed by design. G. This parameter is derived from characterization. H. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to frequency).

50 V50 V

Figure 7. LinkSwitch-TN General Test Circuit. Figure 8. LinkSwitch-TN Duty Cycle Measurement. Figure 9. LinkSwitch-TN Output Enable Timing.

Figure 16. COSS vs. Drain Voltage.

  • LinkSwitch Product Family
  • TN Series Number
  • Package Identifier G Plastic Surface Mount DIP P Plastic DIP D Plastic SO-8C
  • Package Material N RoHS Compliant and Halogen Free G RoHS Compliant and Halogen Free (Not Recommended for New Designs)
  • Tape & Reel and Other Options Blank Standard Configurations TL Tape and Reel, 1 k pcs minimum for G Package. 2.5 k pcs for D Package. Not available for P Package.LNK 304 G N - TL

Rev. P 12/21 LNK302/304-306 www.power.com Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP) package with .300 inch row spacing. 2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 4. Pin locations start with Pin 1, and continue counter-clock-wise to Pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin 1. Pin 6 is omitted. 5. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 6. Lead width measured at package body. 7. Lead spacing measured with the leads constrained to be perpendicular to plane T. .008 (.20) .015 (.38) .300 (7.62) BSC (NOTE 7) .300 (7.62) .390 (9.91) P08B PI-2551b-092920 .125 (3.18) .145 (3.68) .057 (1.45) .068 (1.73) .118 (3.00) .140 (3.56) .015 (.38) MINIMUM .048 (1.22) .068 (1.73) .100 (2.54) BSC .014 (.36) .022 (.56) SEATING PLANE -T- T E D S .010 (.25) M⊕ (NOTE 6) .356 (9.05) .387 (9.83) .240 (6.10) .260 (6.60) -E- Pin 1 -D- MINIMUM .30 in [7.62 mm] .30 in [7.62 mm] 0.200 in [5.08 mm] ∅.03 in [0.86 mm] .06 in [1.41 mm] .10 in [2.54 mm] Typ ∅.06 in [1.41 mm] PDIP-8B (P Package)

Rev. P 12/21 LNK302/304-306 www.power.com SMD-8B (G Package) PI-2546a-092920 .004 (.10) .012 (.30) .036 (0.91) .044 (1.12) .004 (.10) 0 - ° 8° .356 (9.05) .387 (9.83) .032 (.81) .043 (1.09) .125 (3.18) .145 (3.68) -D- Notes: 1. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 2. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 3. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. Pin 6 is omitted. 4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 5. Lead width measured at package body. 6. D and E are referenced datums on the package body. .057 (1.45) .068 (1.73) (NOTE 5) E S .100 (2.54) (BSC) .388 (9.86) .137 (3.48) MINIMUM .260 (6.60) .010 (.25) -E- Pin 1 D S .004 (.10)⊕ G08B .420 .046 .060 .060 .046 .080Pin 1 .086 .186 .286 Solder Pad Dimensions

Rev. P 12/21 LNK302/304-306 www.power.com PI-4526-040110D07C 3.90 (0.154) BSC Notes: 1. JEDEC reference: MS-012. 2. Package outline exclusive of mold flash and metal burr. 3. Package outline inclusive of plating thickness. 4. Datums A and B to be determined at datum plane H. 5. Controlling dimensions are in millimeters. Inch dimensions are shown in parenthesis. Angles in degrees. 0.20 (0.008) C 1 4 2 6.00 (0.236) BSC D 4.90 (0.193) BSC 0.10 (0.004) C D 0.10 (0.004) C 2X A-B 1.27 (0.050) BSC 0.25 (0.010) M C A-B D 0.25 (0.010) 0.10 (0.004) (0.049 - 0.065) 1.25 - 1.65 1.75 (0.069) 1.35 (0.053) 0.10 (0.004) C C H o 1.27 (0.050) 0.40 (0.016) GAUGE PLANE 0 - 8 BSC SEATING PLANE 0.25 (0.010) 0.17 (0.007) DETAIL A DETAIL A C SEATING PLANE Pin 1 ID + + 4.90 (0.193) 2.00 (0.079) Reference Solder Pad Dimensions SO-8C (D Package)

Rev. P 12/21 LNK302/304-306 www.power.com Revision Notes Date C Release data sheet. 03/03 D Corrected Minimum On-Time. 01/04 E Added LNK302. 08/04 F Added lead-free ordering information. 12/04 G Minor error corrections. Renamed Feedback Pin Voltage Parameter to Feedback Pin Voltage at Turnoff Threshold and removed condition. 03/05 H Added SO-8C package. 12/06 I Updated Part Ordering Information section with Halogen Free. 11/08 J Updated Key Features column in Table 2. Updated style of data sheet. 06/13 K Corrected unit for BYPASS Pin Supply Current at IBPSC. Updated with new Brand Style Logo. 06/15 L Corrected ILIMIT Condition value from millisecond to microsecond on page 10. 02/16 M Updated PDIP-8B (P Package) and SMD-8B (G Package) per PCN-16232. 08/16 N Updated N Package Material description in Part Ordering Information table on page 14. 01/19 O Updated package drawings PDIP-8B and SMD-8B. 09/20 P Updated Lead Finish description in Part Ordering Information table. 12/21

For the latest updates, visit our website: www.power.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. Patent Information The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one Power Integrations patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set forth at www.power.com/ip.htm. Life Support Policy POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Power Integrations, the Power Integrations logo, CAPZero, ChiPhy, CHY, DPA-Switch, EcoSmart, E-Shield, eSIP, eSOP, HiperPLC, HiperPFS, HiperTFS, InnoSwitch, Innovation in Power Conversion, InSOP, LinkSwitch, LinkZero, LYTSwitch, SENZero, TinySwitch, TOPSwitch, PI, PI Expert, PowiGaN, SCALE, SCALE-1, SCALE-2, SCALE-3 and SCALE-iDriver, are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©2021, Power Integrations, Inc. World Headquarters

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