DAG810 DISCO | Alldatasheet
Document overview
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Technical content
Single-axis automatic grinder The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. Small footprint − 1.02 ㎡ Machine dimensions: 600 (W) x 1,700 (D) x 1,780 (H) mm Precision grinding The newly developed high-rigidity, low-vibration spindle achieves superior grinding results and is capable of in-feed grinding and creep feed grinding (user-specified specification). Unlimited materials Process hard or brittle substrates of various diameters with ease. The DAG810 is also the choice for processing a wide variety of electronic components. DAG810 Automatic grinding for research and production Automatic Surface Grinder Easy operation The LCD touch screen graphical user interface makes operation both intuitive and easy. Special options for a variety of needs Can be equipped with either one or two probe-height gauges (option) In-feed grinding for workpieces up to ø300 mm (option) 8" frame grinding (option) Creep-feed grinding for workpieces up to ø200 mm in diameter (user- specified specification) High-precision applications Processes silicon and compound semiconductors for analysis. Grinds resin for CSP and WL-CSP Performs copper-post exposure and other metal applications Improves the planarity of lithium tantalate and lithium niobate Processes green ceramics and sapphire (small diameter) LCD touch screen
2019.4 *A special jig is required for ring frame grinding Environmental conditions
- Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃ ).
- Keep grinding water + 0 - 2 ℃ above room temperature (fluctuations within 1 ℃ over one hour).
- Keep spindle cooling water temperature between 20 - 25 ℃ (fluctuations within 2 ℃ over an hour).
- The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation openin g, heat generation equipment or oil mist generating parts.
- This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments. * All the pressures are described using gauge pressure. * The above specifications may change due to technical modifications. Please confirm when placing your order. * For further information please contact your local sales representatives. * When you use it anything other than the deionized water, please contact your local representatives. www.disco.co.jp Automatic Surface Grinder DAG810 Unit with universal chuck table use) - Anomalous In-feed grinding with wafer rotation mm Φ200 Diamond Wheel Output kW 4.2 Rated torque N・m 5.9 Revolution speed range min-1 1,000 - 7,000 Thickness variation within one workpiece µm Less than 1.5 (with dedicated chuck table) Finished surface roughness µm Ry 0.13 (with #2000 finish) Ry 0.15 (with #1400 finish) mm 600 × 1,700 × 1,780 kg Approx.1,300 Specification Wafer Diameter Grinding Method Grinding Accuracy Grinding Wheels Spindle Machine weight Machine dimensions(W×D×H) Unit with universal chuck table use) - Anomalous In-feed grinding with wafer rotation mm Φ200 Diamond Wheel Output kW 4.2 Rated torque N・m 5.9 Revolution speed range min-1 1,000 - 7,000 Thickness variation within one workpiece µm Less than 1.5 (with dedicated chuck table) Finished surface roughness µm Ry 0.13 (with #2000 finish) Ry 0.15 (with #1400 finish) mm 600 × 1,700 × 1,780 kg Approx.1,300 Specification Wafer Diameter Grinding Method Grinding Accuracy Grinding Wheels Spindle Machine weight Machine dimensions(W×D×H)