D2300 MICRO-ELECTRONICS | Alldatasheet
Document overview
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Technical content
Features
n Integrated optical isolator n SONET/SDH compatible up to OC-48/STM-16 n High-performance, distributed-feedback (DFB) laser n High optical power available n Industry-standard, 14-pin butterfly package n Characterized at 2.488 Gbits/s (NRZ) n Wide operating case temperature range: –40 C to +80 C n InGaAs, PIN photodetector back-facet monitor n Low threshold current n High reliability n Qualified to meet the intent of Telcordia Technolo- gies * 468 Telcordia Technologies is a trademark of Bell Communications Research, Inc.
Applications
n Telecommunications: — SONET/SDH — Long reach — Interexchange n Digital video D2300
22 Lucent Technologies Inc. Data Sheet February 2000Isolated DFB Laser Module 1.3 m m D2300-Type Digital
Description
The D2300-Type Digital Isolated DFB Laser Module contains an internally cooled, InGaAsP , distributed- feedback (DFB) laser designed for 1.3 m m applications. The laser is designed to be used in OC-12/STM-4 (622 Mbits/s) and OC-48/STM-16 (2.488 Gbits/s) for long- reach and extended-reach applications. The device is available with an average output power of 0 dBm (3 dBm peak), which meets the SONET/SDH standard. Controlled Feedback The module contains an internal optical isolator that suppresses optical feedback in laser-based, fiber-optic systems. Light reflected back to the laser is attenuated a minimum of 30 dB. Controlled Temperature An integral thermoelectric cooler (TEC) provides stable thermal characteristics. The TEC allows for heating and cooling of the laser chip to maintain a temperature of C for case temperatures from –40 C to +80 The laser temperature is monitored by the internal ther- mistor, which can be used with external circuitry to con- trol the laser chip temperature. Controlled Power An internal, InGaAs, PIN photodiode functions as the back-facet monitor. The photodiode monitors emission from the rear facet of the laser and, when used in con- junction with control circuitry, can control optical power launched into the fiber. Normally, this configuration is used in a feedback arrangement to maintain the aver- age laser output power. Standard Package The laser module is fabricated in a 14-pin, hermetic, metal/ceramic butterfly package. The package also incorporates a bias tee that separates the dc-bias path from the RF input. The RF input has a nominal 25 W impedance. The laser module is equipped with a sin- gle-mode fiber. The pigtail has an 8 m m core and 125 m m cladding with a 900 m m tight buffer coating. Lucent Technologies Microelectronics Group optoelec- tronic components are qualified to rigorous internal standards that are consistent with Telcordia Technolo- gies TR-NWT -000468. All design and manufacturing operations are ISO * 9001 certified. The module is fully qualified for central office applications. ISO is a registered trademark of The International Organization for Standardization. Pin Information * A positive current through the thermoelectric heat pump cools the laser. †Both leads should be grounded for optimum performance. Top view. Figure 1. Circuit Schematic
1 Thermistor
2 Thermistor
3 Laser dc Bias (cathode) (–)
4 Back-facet Monitor Anode (–)
5 Back-facet Monitor Cathode (+)
6 Thermoelectric Cooler (+)*
7 Thermoelectric Cooler (–)*
8 Case Ground
9 Case Ground
10 Case Ground
11 Laser Anode
12 RF Laser Input Cathode (–)
13 Laser Anode
14 Case Ground
extended periods can adversely affect device reliability.
- Does not apply to shipping container.
- All remaining connections
Reverse the order for the proper turn-off sequence. JEDEC Publication No. 108-A (Dec. susceptibility testing and protection-design evaluation. The minimum fiber bend radius is 1.18 in. (30 mm).
- Place the bottom flange of the module on a flat heat
- Mount four #2-56 screws with Fillister heads
1 in.-lb. of torque to the screws. Note: Dimensions are in inches and (millimeters). Figure 2. Fillister Head Screw
- Standard operating condition is 5.0 V reverse bias.
Table 1. Electrical Characteristics (at 25 Table 2. Optical Characteristics (at 25
Lucent Technologies Inc. 5 Data Sheet February 2000 Isolated DFB Laser Module 1.3 mm D2300-Type Digital Outline Diagram 1-520.g 0.700 (17.78) 1.180 (29.97) HEAT SINK 0.215 (5.45) 0.056 (1.42) 0.030 (0.75) 0.575 (14.61) 2.03 (51.6) 39.37 (1000.00) MIN 0.10 (2.5) 0.260 (6.60) 0.215 (5.47) REF 0.365 (9.27) MAX 0.863 (21.91) 0.036 (0.91) PIN 1 0.078 (1.98) 0.213 (5.40) TY P 0.100 (2.54) TYP 0.105 (2.67) DIA TYP (4) PLACES 1.025 (26.04) 0.020 (0.51) TYP0.508 – 0.008 (12.90 – 0.2) STRAIN RELIEF PIN 14 0.350 (8.89) 0.500 (12.70) 0.605 (15.37) MAX TRADEMARK, CODE, LASER SERIAL NUMBER, AND DATE CODE IN APPROX. AREA SHOWN 0.200 (5.08) 0.10 – 0.002 (0.25 – 0.064)
6 Lucent Technologies Inc. Data Sheet February 2000Isolated DFB Laser Module 1.3 mm D2300-Type Digital Class IIIb Laser Product FDA/CDRH Class IIIb laser product. All versions are Class IIIb laser products per CDRH, 21 CFR 1040 Laser Safety requirements. All versions are Class IIIb laser products per IEC * 60825-1:1993. The device has been certi- fied with the FDA under accession number 8720010. This product complies with 21 CFR 1040.10 and 1040.11. 8 mm/125 mm single-mode fiber pigtail with 900 mm tight buffer jacket and connector Wavelength = 1.3 mm Maximum power = 10 mW Because of size constraints, labeling is not affixed to the module but is contained in the shipping carton. Product is not shipped with power supply. Caution: Use of controls, adjustments, and procedures other than those specified herein may result in hazardous laser radiation exposure. * IEC is a registered trademark of The International Electrotechnical Commission. 10 mW 1.3 mm
Lucent Technologies Inc. 7 Data Sheet February 2000 Isolated DFB Laser Module 1.3 mm D2300-Type Digital
Ordering Information
- Other connector options are available.
Table 3. Ordering Information
For additional information, contact your Microelectronics Group Account Manager or the following: INTERNET: http://www.lucent.com/micro, or for Optoelectronics information, http://www.lucent.com/micro/opto E-MAIL: docmaster@micro.lucent.com N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103 1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106) ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256 Tel. (65) 778 8833, FAX (65) 777 7495 CHINA: Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F , Zao Fong Universe Building, 1800 Zhong Shan Xi Road, Shanghai 200233 P . R. China Tel. (86) 21 6440 0468, ext. 316, FAX (86) 21 6440 0652 JAPAN: Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700 EUROPE: Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 7000 582 368, FAX (44) 1189 328 148 Technical Inquiries:OPTOELECTRONICS MARKETING: (44) 1344 865 900 (Ascot UK) Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. Copyright © 2000 Lucent Technologies Inc. All Rights Reserved February 2000 DS00-167OPTO (Replaces MN97068-5)