CSTCC

P16E MURATA | Alldatasheet

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Technical content

Cat.No.P16E-22 Ceramic Resonators (CERALOCKr) !Note P16E.pdf Nov.22,2012  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

s All the products in this catalog comply with EU RoHS. s EU RoHS is "the European Directive 2011/65/EU on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment." s For more details, please refer to our website 'Murata's Approach for EU RoHS' (http://www.murata.com/info/rohs.html). P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering. Selection Guide 2 Part Numbering 3 MHz Chip Type -Tight Frequency Tolerance for Automotive- 4 Application Circuits Utilization 6 MHz Chip Type -Standard Frequency Tolerance for Automotive- 7 Application Circuits Utilization 11 Notice for Automotive 12 Packaging for Automotive 17 MHz Chip Type -Tight Frequency Tolerance for General Usage- 19 Application Circuits Utilization 22 MHz Chip Type -Standard Frequency Tolerance for General Usage- 23 Application Circuits Utilization 27 MHz Lead Type -Standard Frequency Tolerance for General Usage- 29 Application Circuits Utilization 31 Notice for General Usage MHz Chip Type 32 MHz Lead Type 37 Packaging for General Usage MHz Chip Type 38 MHz Lead Type 41 CERALOCKr, CERALOCK(R) and "CERALOCK" in this catalog are the trademarks of Murata Manufacturing Co., Ltd. CONTENTS 1

P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Applications

CSTCR_G15L CSTCR_GH5L 4.00–7.99MHz CSTCE_G15L CSTCE_GH5L 8.00–13.99MHz CSTCE_V13L CSTCE_VH3L 14.00–20.00MHz CSTCW_X11 20.01–48.00MHz CSTCG_V 20.00–33.86MHz CSTCC_G 2.00–3.99MHz CSTCR_G 4.00–7.99MHz CSTCE_G 8.00–13.99MHz CSTLS_G 3.40–10.00MHz CSTLS_X 16.00–70.00MHz CSTCR_G15C 4.00–7.99MHz CSTCE_G15C 8.00–13.99MHz CSTCE_V13C 14.00–20.00MHz CSTCE_V 14.00–20.00MHz CSTCW_X 20.01–70.00MHz CSACW_X 20.01–70.00MHz Standard Tolerance Standard Tolerance ConsumerAutomotive Tight Tolerance Tight Tolerance (Two Terminals) Super Small! CSTCC_G_A 2.00–3.99MHz CSTCR_G_B 4.00–7.99MHz CSTCE_G_A 8.00–13.99MHz CSTCE_V_C 14.00–20.00MHz CSTCV_X_Q 20.01–70.00MHz CSACV_X_Q 20.01–70.00MHz (Two Terminals) Notice: "CERALOCKr for consumer" and "CERALOCKr for automotive" is different in the specification of Operating Temperature Range, Environmental Characteristics, Physical Characteristics and so on. Please choose either "for consumer" or "for automotive" according to the required specification. SMD SMD Leaded SMDSMD Selection Guide

P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering. o Part Numbering qProduct ID wFrequency/Capacitance eStructure/Size tDesign oPackaging CERALOCKr (MHz) CS Ceramic Resonators Gpp T/Vpp Xpp A T MHz with No Capacitance Built-in MHz with Built-in Capacitance LS CC CR/CE/CG CV CW Round Lead Type Cap Chip Type Small-cap Chip Type Monolithic Chip Type Small Monolithic Chip Type Thickness Shear mode Thickness Expander mode Thickness Expander mode (3rd overtone) Three-digit alphanumerics express "Individual Specification." Structure/Size -B0 -A0 -R0 -R1 Packaging Product ID Code Code Code iIndividual Specification * Code Frequency/Capacitance Design Individual Specification Code (Part Number) rNominal Center Frequency Expressed by four-digit alphanumerics. The unit is in hertz (Hz). Decimal point is expressed by capital letter "M." With standard products, "iIndividual Specification" and "oPackaging" is omitted. Bulk Radial Taping H0=18mm Plastic Taping ø=180mm Plastic Taping ø=330mm yInitial Frequency Tolerance H Initial Frequency ToleranceCode ±0.5% ±0.3% ±0.2% ±0.1% ±0.07% uLoad Capacity Load CapacityCode 5/6pF 10pF 15pF 22pF 30/33/39pF 47pF e CE w T r 16M0 q CS pp indicates initial frequency tolerance and load capacity. Radial taping is applied to lead type and plastic taping to chip type. i * t V y u o -R0

Ceramic Resonators (CERALOCKr) MHz Chip Type -Tight Frequency Tolerance for Automotive- Chip type CERALOCK(R) with built-in load capacitors provides high accuracy in an extremely small package. MURATA's frequency adjustment and package technology expertise has enabled the development of the chip CERALOCK(R) with built-in load capacitors. This diverse series owes its development to MURATA's original mass production techniques and high reliability, and has achieved importance in the worldwide automotive market. c Features 1. The series are high accuracy resonators whose total tolerance is available for less than ±3,000ppm. 2. The series has high reliability and is available for a wide temperature range. 3. Oscillation circuits do not require external load capacitors. 4. The series is available for a wide frequency range. 5. The resonators are extremely small and have a low profi le. 6. No adjustment is necessary for oscillation circuits. c Applications 1. Cluster panel and Control panel 2. Safety control (Anti-lock Brake System, Electronic Stability Control, Airbag, etc.) 3. Engine ECU, Electronic Power Steering, Immobilizer, etc. 4. Car Air conditioner, Power Window, Remote Keyless Entry system, etc. 5. Intelligent Transportation System (Lane Keeping System, Millimeter wave radar, etc.) 6. Battery control for hybrid cars 4.5±0.1 4.1 max. 0.4 (ref.) 0.4±0.1 0.4±0.1 0.4±0.1 (3) (2) (1) 0.6±0.05 0.4 (ref.) 0.4 (ref.) 0.2±0.2 0.30±0.20 2.0±0.11.1±0.1 1.4 max. ∗: EIAJ Monthly Code (in mm) CSTCR_G15C 4.00-7.99MHz 3.2±0.15 1.3±0.15 0.50 (ref.) 0.50 (ref.) 0.50 (ref.) 3.0 max. 0.10±0.10 0.4±0.1 (1)(2)(3) 0.1±0.1 1.1 max. 0.4±0.10.70±0.10 0.4±0.1 0.4±0.1 (in mm) ∗: EIAJ Monthly CodeCSTCE_G15C 8.00-13.99MHz 3.2±0.15 0.10±0.10 0.1±0.1 1.3±0.15 1.1 max. 0.4±0.1 0.5 (ref.) 0.5 (ref.) 0.9±0.1 3.0 max. 0.4±0.1 (1)(2)(3) 0.4±0.10.4±0.1 0.5 (ref.) (in mm) ∗: EIAJ Monthly Code CSTCE_V13C 14.00-20.00MHz Part Number Oscillating Frequency (MHz) Initial Tolerance Temperature Stability (%) Temperature Range (°C) CSTCR_G15C 4.00 to 7.99 ±0.1% ±0.13 -40 to 125 CSTCE_G15C 8.00 to 13.99 ±0.1% ±0.13 -40 to 125 CSTCE_V13C 14.00 to 20.00 ±0.1% ±0.13 -40 to 125 Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. P16E.pdf Nov.22,2012 !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

1MΩ Rd C1 C2 (1) (3) (2) c Oscillation Frequency Measuring Circuit 2.6 0.4 1.5 1.5 1.10.4 0.41.1 Land Pattern (in mm) c Standard Land Pattern Dimensions 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in mm) CSTCE_G15C 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in mm) -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) +0.2 +0.1 -0.1 -0.2 Temperature (°C) c Oscillation Frequency Temperature Stability CSTCR_G15C -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) Temperature (°C) +0.2 +0.1 -0.1 -0.2 CSTCE_G15C -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) +0.2 +0.1 -0.1 -0.2 Temperature (°C) CSTCE_V13C P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering. CSTCR_G15C (* This Land Pattern is not common to CSTCR_G.) CSTCE_V13C (* This Land Pattern is not common to CSTCE_V.)

Application Circuits Utilization 0.1μF 74 72 L IC : TMP92CD54IF Vcc3=3.3V CERALOCKr C1 C2 CERALOCKr: CSTCE10M0G15Cpp-R0 C1=33pF (Typ.) C2=33pF (Typ.) Vcc5=5.0V V2V1 H1: 36, 68, 86 H2: 2, 4, 15, 40, 50, 61, 75 c TMP92CD54IF (Toshiba) 16-bit Microcomputer H 0.1μF

2827 L 26

IC : MB90F387 Vcc=5.0V CERALOCKr C1 C2 CERALOCKr: CSTCE8M00G15Cpp-R0 C1=33pF (Typ.) C2=33pF (Typ.) V2V1 L: 20, 23, 25, 48 c MB90F387 (Fujitsu) 16-bit Microcomputer 59 58 GND EVALUATION BOARD IC : MC68HC908AZ60AVFU Vdd=5.0V CERALOCKr: CSTCE16M0V13Cpp-R0 C1=15pF (Typ.) C2=15pF (Typ.) CERALOCKr C1 C2 V2V1 1MΩ c MC68HC908AZ60AVFU (Freescale) 8-bit Microcomputer H6 0 12 L IC : ST72F561 (HS) Vdd=5.0V H: 9, 25, 41, 57, 58 L: 8, 24, 40, 55, 56 CERALOCKr C1 C2 CERALOCKr: CSTCE8M00G15App-R0 C1=33pF (Typ.) C2=33pF (Typ.) V2V1 c ST72F561 (HS) (ST Microelectronics) 8-bit Microcomputer H1 4 12 13 L 10 4.7μF IC : μPD70F3283YGC Vdd=3.3V 10kΩ H: 1, 5, 9, 34, 70 CERALOCKr C1 C2 CERALOCKr: CSTCE10M0G15Cpp-R0 C1=33pF (Typ.) C2=33pF (Typ.) V2V1 c µPD70F3283YGC (Renesas) 32-bit Microcomputer H1 9 22 20 L IC : M30842MCT-XXXGP (High*) H: 23, 24, 37, 39, 59, 74, 91, 118, 122, 132, 142, 143 110~113, 120, 121, 130, 140CERALOCKr C1 C2 CERALOCKr: CSTCE8M00G15Cpp-R0 C1=33pF (Typ.) C2=33pF (Typ.) V2V1 Vcc=5.0V *High: XIN-XOUT Drive Capacity Select Bit c M30842MCT-XXXGP (Renesas) 16-bit Microcomputer P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Ceramic Resonators (CERALOCKr) MHz Chip Type -Standard Frequency Tolerance for Automotive- Chip type CERALOCK(R) with built-in load capacitors provides high accuracy in an extremely small package. MURATA's frequency adjustment and package technology expertise has enabled the development of the chip CERALOCK(R) with built-in load capacitors. This diverse series owes its development to MURATA's original mass production techniques and high reliability, and has achieved importance in the worldwide automotive market. c Features 1. The series has high reliability and is available for a wide temperature range. 2. Oscillation circuits do not require external load capacitors. 3. The series is available in a wide frequency range. 4. The resonators are extremely small and have a low profi le. 5. No adjustment is necessary for oscillation circuits. c Applications 1. Cluster panel and Control panel 2. Safety control (Anti-lock Brake System, Electronic Stability Control, Airbag, etc.) 3. Engine ECU, Electronic Power Steering, Immobilizer, etc. 4. Car Air conditioner, Power Window, Remote Keyless Entry system, etc. 5. Electronic Toll Collection system, Car Navigation, etc. 0.45 (Ref.) 1.2±0.2 6.6 max. (3) (2) (1) 0.3±0.3 0.5±0.05 7.2±0.2 3.0±0.2t 0.45±0.3 ∗: EIAJ code t : 1.75±0.05 (2.00—2.99MHz) t : 1.55±0.05 (3.00MHz—) 1.4±0.2 1.2±0.2 0.45 (Ref.) 0.45 (Ref.) 2.1 max. (in mm) CSTCC_G_A 2.00-3.99MHz 4.5±0.1 4.1 max. 0.8±0.1 0.8±0.1 0.8±0.1 0.4±0.05 0.2±0.2 0.3±0.2 2.0±0.1 1.4 max. (2) (1)(3) 1.15±0.05 ∗ : EIAJ Monthly Code (in mm) CSTCR_G_B 4.00-7.99MHz 3.2±0.15 1.3±0.15 0.50 (ref.) 0.50 (ref.) 0.50 (ref.) 3.0 max. 0.10±0.10 0.4±0.1 (1)(2)(3) 0.1±0.1 1.1 max. 0.4±0.10.70±0.10 0.4±0.1 0.4±0.1 (in mm) CSTCE_G_A 8.00-13.99MHz 3.2±0.15 0.10±0.10 0.1±0.1 1.3±0.15 1.1 max. 0.4±0.1 0.5 (ref.) 0.5 (ref.) 0.9±0.1 3.0 max. 0.4±0.1 (1)(2)(3) 0.4±0.10.4±0.1 0.5 (ref.) (in mm) ∗: EIAJ Monthly Code CSTCE_V_C 14.00-20.00MHz Continued on the following page. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Continued from the preceding page. M ∗ 3.7±0.2 3.1±0.2 1.3±0.1 (0.5) (3) 0.4±0.2 0.4±0.20.5±0.2 (0.5) (1) (0.5) (2) 1.6±0.2 1.85±0.3 1.6±0.2 Terminals (1) and (3) are interchangeable. Terminal (2) should be soldered only to fix the resonator onto PCB Terminal (2) should be electrically floating so it cannot be connected anywhere. (in mm) Thickness varies with frequency. ∗: EIAJ Monthly Code CSACV_X_Q 20.01-70.00MHz M ∗ 3.7±0.2 3.1±0.2 1.3±0.1 (0.7) (3) 0.4±0.2 0.4±0.20.5±0.2 (0.7) (1) (0.9) (2) 1.6±0.2 1.85±0.3 1.6±0.2 (in mm) Thickness varies with frequency and built-in capacitance. ∗: EIAJ code CSTCV_X_Q 20.01-70.00MHz Part Number Oscillating Frequency (MHz) Initial Tolerance Temperature Stability (%) Temperature Range (°C) CSTCR_G_B 4.00 to 7.99 ±0.5% ±0.15 -40 to 125 CSTCE_G_A 8.00 to 13.99 ±0.5% ±0.2 -40 to 125 CSTCE_V_C 14.00 to 20.00 ±0.5% ±0.15 -40 to 125 CSACV_X_Q 20.01 to 70.00 ±0.5% ±0.3 -40 to 125 CSTCV_X_Q 20.01 to 70.00 ±0.5% ±0.3 -40 to 125 Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. Rf Rd VDD C1 C2 To Frequency Counter (1) (3) (2) c Oscillation Frequency Measuring Circuit CSTCC_G_A VDD Rf To Frequency Counter 5pF 1MΩ Rd C1 C2 (1) (3) (2) VDD Rf CL1 CL2 To Frequency Counter 22μF 0.01μF CSACV_X_Q P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

3.8~4.4 1.2 1.2 2.5 2.5 1.4 1.2 1.2 Land Pattern (in mm) c Standard Land Pattern Dimensions CSTCC_G_A 2.6 1.6 0.8 0.4 1.5 1.5 0.4 0.4 0.8 0.80.70.7 Land Pattern (in mm) CSTCR_G_B 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in mm) CSTCE_G_A 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in mm) 1.6 1.6 1.0 3.1±0.2 1.0 0.50.5 Land Pattern (in mm) CSTCV_X_Q 1.6 1.6 1.0 3.1±0.2 1.0 0.50.5 Land Pattern (in mm) CSACV_X_Q P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering. CSTCE_V_C (* This Land Pattern is not common to CSTCE_V.)

-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) Temperature (°C) +0.2 +0.1 -0.1 -0.2 c Oscillation Frequency Temperature Stability CSTCC_G_A -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) +0.2 +0.1 -0.1 -0.2 Temperature (°C) CSTCR_G_B -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) Temperature (°C) +0.2 +0.1 -0.1 -0.2 CSTCE_G_A -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) +0.2 +0.1 -0.1 -0.2 Temperature (°C) CSTCE_V_C -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) Temperature (°C) +0.2 +0.1 -0.1 -0.2 CSTCV_X_Q -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) Temperature (°C) +0.2 +0.1 -0.1 -0.2 CSACV_X_Q P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Application Circuits Utilization H 10kΩ L 8 IC : μPD78F9222MC-5A4 Vdd=5.0V H: 5, 20 L: 1 CERALOCKr C1 C2 CERALOCKr: CSTCR6M00G55B-R0 C1=39pF (Typ.) C2=39pF (Typ.) V'dd=7.0V V2V1 c µPD78F9222MC-5A4 (Renesas) 8-bit Microcomputer 23 24 L IC : M30260F8AGP (High*) Vcc=5.0V H: 11, 46, 47, 48 L: 4, 9, 44 *High: XIN-XOUT Drive Capacity Select Bit CERALOCKr C1 C2 CERALOCKr: CSTCE10M0G55A-R0 C1=33pF (Typ.) C2=33pF (Typ.) V2V1 c M30260F8AGP (Renesas) 16-bit Microcomputer H 93 92 L IC : MB90F347D Vcc=5.0V CERALOCKr C1 C2 CERALOCKr: CSTCE8M00G55A-R0 C1=33pF (Typ.) C2=33pF (Typ.) V2V1 H: 15, 32, 65, 90 L: 16, 35, 44, 66, 91 c MB90F347D (Fujitsu) 16-bit Microcomputer 59 58 GND EVALUATION BOARD IC : MC68HC908AZ60AVFU Vdd=5.0V CERALOCKr: CSTCE16M0V53C-R0 C1=15pF (Typ.) C2=15pF (Typ.) CERALOCKr C1 C2 V2V1 1MΩ c MC68HC908AZ60AVFU (Freescale) 8-bit Microcomputer H 42 41 L IC : ST72F324J6T3 (MS) Vdd=5.0V CERALOCKr C1 C2 CERALOCKr: CSTCR4M00G55B-R0 C1=39pF (Typ.) C2=39pF (Typ.) V2V1 H: 13, 21, 32, 43 L: 14, 22, 33, 39, 40 c ST72F324J6T3 (MS) (ST Microelectronics) 8-bit Microcomputer 23 L IC : PIC12F675-I/P(HS) Vdd=5.0V CERALOCKr: CSTCE8M00G52A-R0 C1=10pF (Typ.) C2=10pF (Typ.) CERALOCKr C1 C2 V2V1 1MΩ H H: 1 L: 4, 8 c PIC12F675-I/P (HS) (Microchip) 8-bit Microcomputer P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Please mount component on a circuit board by reflow soldering. Flow soldering is not acceptable. 1. Soldering (1) Reflow soldering Recommendable Flux and Solder If compelled to mount the component by using soldering iron, please do not directly touch the component with the soldering iron. The component terminals or electrical characteristics may be damaged if excessive thermal stress is applied. (2) Soldering with Iron Please make the solder volume less than the height of the substrate to avoid damage to the seal between the metal cap and the substrate. (3) Solder Volume Do not reuse components removed from a circuit board after soldering. (4) Other The component is recommended with placement machines that employ optical placement capabilities. The component may be damaged by excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. (5) Conditions for Placement Machines 150 180 220 245 260 Gradual Cooling Peak Pre-heating (150 to 180°C) Heating (220°C min.) 60 to 120s 30 to 60s Temperature (°C) Flux Solder Please use rosin based flux, not water soluble flux. Recommendable Soldering Profile Pre-heating Heating Peak Temperature 150 to 180°C Please use solder (Sn-3.0Ag-0.5Cu) under the following conditions: Standard thickness of soldering paste: 0.10 to 0.15mm. 220°C min. upper limit: 260°C lower limit: 245°C 60 to 120s 30 to 60s 1s max. 5s max. Temperature shall be measured on the surface of component. Recommendable Soldering with Iron Heating of the soldering iron Watt Shape of the soldering iron 350°C max. 30W max. ø3mm max. 5s max. at one terminal Sn-3.0Ag-0.5Cu Soldering Time Solder Continued on the following page. c Soldering and Mounting (CSTCC/CSTCR/CSTCE_V/CSTCE_G Series) P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm stable electrical characteristics are maintained. 3. Coating Continued from the preceding page. dTV60°C (dT=Component-solvent) *1 ex. If the component is immersed at +90°C into cleaning solvent at +60°C, then dT=30°C. (2) Temperature Difference : dT *1 5 minutes max. by air blow at +80°C max. (4) Drying (a) Total washing time should be within 10 minutes. (b) The component may be damaged if it is washed with chlorine, petroleum, or alkali cleaning solvent. (5) Other (a) Ultrasonic Wash 1 minute max. in above solvent at +60°C max. (Frequency: 28kHz, Output: 20W/l) (b) Immersion Wash 5 minutes max. in above solvent at +60°C max. (c) Shower or Rinse Wash 5 minutes max. in above solvent at +60°C max. (3) Conditions HCFC, Isopropanol, Tap water, Demineralized water, Cleanthrough750H, Pine alpha 100S, Techno care FRW 2. Wash (1) Cleaning Solvents P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Please mount component on a circuit board by reflow soldering. Flow soldering is not acceptable. 1. Soldering (1) Reflow soldering Recommendable Flux and Solder If compelled to mount the component by using soldering iron, please do not directly touch the component with the soldering iron. The component terminals or electrical characteristics may be damaged if excessive thermal stress is applied. (2) Soldering with Iron Do not reuse components removed from a circuit board after soldering. (3) Other The component is recommended with placement machines that employ optical placement capabilities. The component may be damaged by excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. (4) Conditions for Placement Machines 150 180 220 245 260 Gradual Cooling Peak Pre-heating (150 to 180°C) Heating (220°C min.) 60 to 120s 30 to 60s Temperature (°C) Flux Solder Please use rosin based flux, not water soluble flux. Recommendable Soldering Profile Pre-heating Heating Peak Temperature 150 to 180°C Please use solder (Sn-3.0Ag-0.5Cu) under the following conditions: Standard thickness of soldering paste: 0.10 to 0.15mm. 220°C min. upper limit: 260°C lower limit: 245°C 60 to 120s 30 to 60s 1s max. 5s max. Temperature shall be measured on the surface of component. Recommendable Soldering with Iron Heating of the soldering iron Watt Shape of the soldering iron 350°C max. 30W max. ø3mm max. 5s max. at one terminal Sn-3.0Ag-0.5Cu Soldering Time Solder Continued on the following page. HCFC, Isopropanol, Tap water, Demineralized water, Cleanthrough750H, Pine alpha 100S, Techno care FRW 2. Wash (1) Cleaning Solvents dTV60°C (dT=Component-solvent) *1 ex. If the component is immersed at +90°C into cleaning solvent at +60°C, then dT=30°C. (2) Temperature Difference : dT *1 c Soldering and Mounting (CSTCV/CSACV Series) P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm stable electrical characteristics are maintained. 3. Coating Continued from the preceding page. 5 minutes max. by air blow at +80°C max. (4) Drying (a) Total washing time should be within 10 minutes. (b) The component may be damaged if it is washed with chlorine, petroleum, or alkali cleaning solvent. (5) Other (a) Ultrasonic Wash 1 minute max. in above solvent at +60°C max. (Frequency: 28kHz, Output: 20W/l) (b) Immersion Wash 5 minutes max. in above solvent at +60°C max. (c) Shower or Rinse Wash 5 minutes max. in above solvent at +60°C max. (3) Conditions P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

c Storage and Operating Conditions c Rating The component may be damaged if excessive mechanical stress is applied. c Handling "CERALOCK" may stop oscillating or oscillate irregularly under improper circuit conditions. 1. Product Storage Conditions Please store the products in a room where the temperature/humidity is stable, and avoid such places where there are large temperature changes. Please store the products under the following conditions: Temperature: -10 to +40°C Humidity: 15 to 85% R.H. 2. Expiration Date on Storage Expiration date (Shelf life) of the products is six months after delivery under the conditions of a sealed and unopened package. Please use the products within six months after delivery. If you store the products for a long time (more than six months), use carefully because the products may be degraded in solderability and/or rusty. Please confirm solderability and characteristics for the products regularly. 3. Notice on Product Storage (1) Please do not store the products in a chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides and so on), because the characteristics may be reduced in quality, and/or be degraded in the solderability due to the storage in a chemical atmosphere. (2) Please do not put the products directly on the floor without anything under them to avoid damp and/or dusty places. (3) Please do not store the products in places such as: in a damp heated place, in a place where direct sunlight comes in, in a place applying vibrations. (4) Please use the products immediately after the package is opened, because the characteristics may be reduced in quality, and/or be degraded in the solderability due to storage under the poor conditions. (5) Please do not drop the products to avoid cracking of ceramic elements. 4. Other Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm that stable electrical characteristics are maintained. Please be sure to consult with our sales representatives or engineers whenever and prior to using the products. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

(in mm) (pcs.) ab CSTCC_G_A CSTCR_G_B CSTCR_G15C CSTCE_G_A CSTCE_G15C CSTCE_V_C CSTCE_V13C CSTCV_X_Q CSACV_X_Q Part Number Plastic Tape ø180mm Plastic Tape ø330mm Bulk Dimensions 2,000 3,000 3,000 3,000 3,000 3,000 3,000 2,000 2,000 6,000 9,000 9,000 9,000 9,000 9,000 9,000 6,000 6,000 500 500 500 500 500 500 500 500 500 a a a b b b b a a Trailer Leader Empty Components Cover Film 2.0±0.5 160-190 13.0 +1.0 –1.5 17.0±1.0 (ø180 ) –1.5 (ø180 )ø13.0±0.2 400-560 Empty 160 min. Trailer 160-190 Empty 160 min. 400-560 Cover Film Leader Empty Components ø13.0±0.2 2.0±0.5 13.0±1.0 c Dimensions of Reel The order quantity should be an integral multiple of the "Minimum Quantity" shown above. +1.0 9.0 c Minimum Quantity (in mm) 4.0±0.1 2.0±0.05 (9.5) 4.0±0.1 ø1.5+0.1 ø1.5+0.1 12.0±0.2 1.25±0.05 (1.85 max.) 2.2±0.1 Direction of Feed (3°) 10° Cover Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. (3)(2)(1) 4.7±0.1 c Dimensions of Taping CSTCR_G15C (in mm) 2.0±0.05 4.0±0.1 (3˚) 3.5±0.05 8.0±0.2 1.75±0.1 0.25±0.05 0.90±0.10 (1.30 max.) 10° (5.2) Cover Film Direction of Feed The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 4.0±0.1 ø1.5 -0.0 +0.1 ø1.0 -0.0 +0.2 1.50 -0.05 +0.10 (3)(2)(1) 3.40 -0.05 +0.10 CSTCE_G15C Continued on the following page. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Continued from the preceding page. Dimensions of Carrier Tape (in mm) 4.0±0.1 Cover Film 4.0±0.1 2.0±0.05 8.0±0.2 ø1.5 +0.1 -0.0 ø1.0 +0.1 -0.0 +0.10 -0.05 3.5±0.05 1.75±0.1 3.45±0.1 Direction of Feed 0.25±0.05 (1.40 max.) 1.10±0.05 (3°) 1.50The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 10° (5.2) (2) (3) (1) c Dimensions of Taping CSTCE_V13C (in mm) 4.0±0.1 2.0±0.05 +0.3 -0.0 ø1.55±0.05 ø1.5 1.75±0.15.5±0.05 12.0±0.2 7.6±0.1 4.0±0.1 (9.5) 3.3±0.1The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. Cover Film 10° (3°) t1 ∗1 t2 ∗2 0.3±0.05 Direction of Feed (3) (1) Frequency Range ∗1, ∗2: Dimensions vary with frequency range of CERALOCKr. 2.00–2.99MHz 3.00–3.99MHz 1.85±0.05 2.45 max. 1.65±0.05 2.25 max. (2) t1 ∗1 t2 ∗2 CSTCC_G_A (in mm) 4.0±0.1 2.0±0.05 (9.5) 4.0±0.1 (3)(2)(1) ø1.5+0.1 ø1.5+0.1 12.0±0.2 5.5±0.05 1.75±0.1 4.7±0.1 2.2±0.1 Direction of Feed (3°) 10° Cover Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 0.3±0.05 1.25±0.05 (1.85 max.) CSTCR_G_B (in mm) 2.0±0.05 4.0±0.1 (3˚) 3.5±0.05 8.0±0.2 1.75±0.1 0.25±0.05 0.90±0.10 (1.30 max.) 10° (5.2) Cover Film Direction of Feed The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 4.0±0.1 ø1.5 -0.0 +0.1 ø1.0 -0.0 +0.2 1.50 -0.05 +0.10 (3)(2)(1) 3.40 -0.05 +0.10 CSTCE_G_A Dimensions of Carrier Tape (in mm) 4.0±0.1 Cover Film 4.0±0.1 2.0±0.05 8.0±0.2 ø1.5 +0.1 -0.0 ø1.0 +0.1 -0.0 +0.10 -0.05 3.5±0.05 1.75±0.1 3.45±0.1 Direction of Feed 0.25±0.05 (1.40 max.) 1.10±0.05 (3°) 1.50The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 10° (5.2) (2) (3) (1) CSTCE_V_C (in mm) Thickness of CERALOCKr ∗1, ∗2: Dimensions vary with product thickness of CERALOCKr. Cover Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. Direction of Feed t1 ∗1 t2 ∗2 1.65±0.1 2.0 max. 1.45±0.1 1.8 max. 1.2±0.1 1.5 max. 4.0±0.1 10° 2.0±0.1 12.0±0.2 5.5±0.1 1.75±0.1 +0.1 –0.0ø1.5 +0.2 –0.0ø1.5 t1 ∗1 t2 ∗2 0.3±0.1 (9.5) (3°) (3)(2)(1) 4.1±0.1 4.0±0.1 +0.1 –0.053.35 CSTCV_X_Q (in mm) Thickness of CERALOCKr ∗1, ∗2: Dimensions vary with product thickness of CERALOCKr. Cover Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. Direction of Feed t1 ∗1 t2 ∗2 1.65±0.1 2.0 max. 1.45±0.1 1.8 max. 1.2±0.1 1.5 max. 4.0±0.1 10° 2.0±0.1 12.0±0.2 5.5±0.1 1.75±0.1 +0.1 –0.0ø1.5 +0.2 –0.0ø1.5 t1 ∗1 t2 ∗2 0.3±0.1 (9.5) (3°) (3)(2)(1) 4.1±0.1 4.0±0.1 +0.1 –0.053.35 CSACV_X_Q P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Ceramic Resonators (CERALOCKr) MHz Chip Type -Tight Frequency Tolerance for General Usage- Chip type CERALOCK(R) with built-in load capacitors provides high accuracy in an extremely small package. MURATA's frequency adjustment and packaging technology expertise has enabled the development of the chip CERALOCK(R) with built-in load capacitors. High-density mounting is made possible by the small package and the elimination of the need for an external load capacitor. c Features 1. Oscillation circuits do not require external load capacitors. 2. Available in a wide frequency range. 3. Extremely small and have a low profi le. 4. No adjustment is necessary for oscillation circuits. c Applications 1. Clock oscillators for USB (Full-speed) controller ICs 2. Audio equipment and musical instruments, etc. 3. Other applications for replacement of Crystal Oscillators 4.5±0.1 4.1 max. 0.4 (ref.) 0.4±0.1 0.4±0.1 0.4±0.1 (3) (2) (1) 0.6±0.05 0.4 (ref.) 0.4 (ref.) 0.2±0.2 0.30±0.20 2.0±0.11.1±0.1 1.4 max. ∗: EIAJ Monthly Code (in mm) 3.2±0.15 1.3±0.15 0.50 (ref.) 0.50 (ref.) 0.50 (ref.) 3.0 max. 0.10±0.10 0.4±0.1 (1)(2)(3) 0.1±0.1 1.1 max. 0.4±0.10.70±0.10 0.4±0.1 0.4±0.1 (in mm) ∗: EIAJ Monthly Code 3.2±0.15 0.10±0.10 0.1±0.1 1.3±0.15 1.1 max. 0.4±0.1 0.5 (ref.) 0.5 (ref.) 0.9±0.1 3.0 max. 0.4±0.1 (1)(2)(3) 0.4±0.10.4±0.1 0.5 (ref.) (in mm) ∗: EIAJ Monthly Code 2.5±0.2 1.4 max. Thickness varies with frequency and built-in capacitance. ∗: EIAJ code 1.0±0.21.0±0.2 1.25±0.2 (0.5) (3) (0.5) (1) (0.5) (2)0.05+0.10 -0.05 0.05+0.10 -0.05 0.4 +0.3 -0.20.4 +0.3 -0.20.4 +0.3 -0.2 2.0±0.2 (in mm) CSTCW_X11 20.01-48.00MHz Part Number Oscillating Frequency (MHz) Initial Tolerance Temperature Stability (%) Temperature Range (°C) CSTCR_G15L 4.00 to 7.99 ±0.1% ±0.08 0 to 70 CSTCR_GH5L 4.00 to 7.99 ±0.07% ±0.08 0 to 70 CSTCE_G15L 8.00 to 13.99 ±0.1% ±0.08 0 to 70 CSTCE_GH5L 8.00 to 13.99 ±0.07% ±0.08 0 to 70 CSTCE_V13L 14.00 to 20.00 ±0.1% ±0.08 0 to 70 CSTCE_VH3L 14.00 to 20.00 ±0.07% ±0.08 0 to 70 CSTCW_X11 20.01 to 48.00 ±0.1% ±0.1 0 to 70 Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering. CSTCR_G15L/CSTCR_GH5L 4.00-7.99MHz CSTCE_G15L/CSTCE_GH5L 8.00-13.99MHz CSTCE_V13L/CSTCE_VH3L 14.00-20.00MHz

1MΩ Rd C1 C2 (1) (3) (2) c Oscillation Frequency Measuring Circuit Rf Rd VDD C1 C2 To Frequency Counter (1) (3) (2) CSTCW_X11 2.6 0.4 1.5 1.5 1.10.4 0.41.1 Land Pattern (in mm) c Standard Land Pattern Dimensions 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in mm) CSTCE_G15L/CSTCE_GH5L 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in mm) 0.5 0.5 0.50.5 1.0 1.0 0.80.8 2.0 0.30.3 0.5 Land Pattern (in mm) CSTCW_X11 P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering. CSTCR_G15L/CSTCR_GH5L/CSTCE_G15L/ CSTCE_GH5L/CSTCE_V13L/CSTCE_VH3L CSTCR_G15L/CSTCR_GH5L (* This Land Pattern is not common to CSTCR_G.) CSTCE_V13L/CSTCE_VH3L (* This Land Pattern is not common to CSTCE_V.)

-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) +0.2 +0.1 -0.1 -0.2 Temperature (°C) c Oscillation Frequency Temperature Stability CSTCR_G15L/CSTCR_GH5L -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) Temperature (°C) +0.2 +0.1 -0.1 -0.2 CSTCE_G15L/CSTCE_GH5L -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) +0.2 +0.1 -0.1 -0.2 Temperature (°C) CSTCE_V13L/CSTCE_VH3L Oscillating Frequency Shift (%) Temperature (°C) -40 -20 0 +20 +40 +60 +80 +100 +0.2 +0.1 -0.1 -0.2 CSTCW_X11 P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Application Circuits Utilization 14 13 GND EVALUATION BOARD IC : M66291GP Vset=3.3V CERALOCKr: CSTCR6M00G15ppp-R0 C1=39pF (Typ.) C2=39pF (Typ.) 220Ω1MΩ CERALOCKr C1 C2 c M66291GP (Renesas) USB Transceiver H8 2 1 8 Fout 23 24 L IC : MN102HF74GHL Vdd=3.3V CERALOCKr C1 C2 CERALOCKr: CSTCE12M0G15Lpp-R0 C1=33pF (Typ.) C2=33pF (Typ.) V2V1 c MN102HF74GHL (Panasonic) 16-bit Microcontroller

67 L L1

IC : LC87F1964A Vdd=5.0V CERALOCKr: CSTCE12M0G15Lpp-R0 C1=33pF (Typ.) C2=33pF (Typ.) HH 1 V2V1 470Ω CERALOCKr C1 C2 H: 8, 19, 39 L: 5, 20, 40 H1: 31, 33 L1: 29, 30, 32, 34~36 10kΩ 10kΩ c LC87F1964A (Sanyo) 8-bit Microcontroller H 30 29 GND IC : TUSB2046B Vcc=3.3V CERALOCKr C1 C2 CERALOCKr: CSTCR6M00G15ppp-R0 C1=39pF (Typ.) C2=39pF (Typ.) V2V1 1MΩ H: 3, 25 L: 7, 28 c TUSB2046B (Texas Instruments) USB 4-port HUB H 48 47 GND EVALUATION BOARD IC : ISP1181BDGG Vset=3.3V CERALOCKr C1 C2 CERALOCKr: CSTCR6M00G15ppp-R0 C1=39pF (Typ.) C2=39pF (Typ.) V2V1 c ISP1181BDGG (Philips) USB Controller P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Ceramic Resonators (CERALOCKr) MHz Chip Type -Standard Frequency Tolerance for General Usage- Chip type CERALOCK(R) with built-in load capacitors provides an extremely small package. MURATA's package technology expertise has enabled the development of the Chip CERALOCK(R) with built-in load capacitors. High-density mounting can be realized because of the small package and the elimination of the need for an external load capacitor. c Features 1. Oscillation circuits do not require external load capacitors. 2. Available in a wide frequency range. 3. Extremely small and have a low profi le. 4. No adjustment is necessary for oscillation circuits. c Applications 1. Clock oscillators for microprocessors 2. Small electronic equipment such as handheld phone, digital video camcorder (DVC), digital still camera (DSC), portable audio player, etc. 3. Storage media and memory (HDD, Optical storage device, FDD, Flash memory card, etc.) 4. Offi ce automation equipment (Mobile PC, Mouse, Keyboard, etc.) 5. Audio-visual applications (TV, DVD-HDD recorder, Audio equipment, Remote control, etc.) 6. Home appliances (Air conditioner, Microwave oven, Refrigerator, Washing machine, etc.) 0.45 (Ref.) 1.2±0.2 6.6 max. (3) (2) (1) 0.3±0.3 0.5±0.05 7.2±0.2 3.0±0.2t 0.45±0.3 ∗: EIAJ code t : 1.75±0.05 (2.00—2.99MHz) t : 1.55±0.05 (3.00MHz—) 1.4±0.2 1.2±0.2 0.45 (Ref.) 0.45 (Ref.) 2.1 max. (in mm) CSTCC_G 2.00-3.99MHz 4.5±0.1 4.1 max. 0.8±0.1 0.8±0.1 0.8±0.1 0.4±0.05 0.2±0.2 0.3±0.2 2.0±0.1 1.4 max. (2) (1)(3) 1.15±0.05 ∗ : EIAJ Monthly Code (in mm) CSTCR_G 4.00-7.99MHz 3.2±0.15 1.3±0.15 0.50 (ref.) 0.50 (ref.) 0.50 (ref.) 3.0 max. 0.10±0.10 0.4±0.1 (1)(2)(3) 0.1±0.1 1.1 max. 0.4±0.10.70±0.10 0.4±0.1 0.4±0.1 (in mm) CSTCE_G/CSTCE_G_Z 8.00-13.99MHz 3.2±0.15 0.10±0.100.1±0.1 1.3±0.15 1.1 max. 0.4±0.1 0.62 (ref.) 0.62 (ref.) 0.9±0.1 3.0 max. (1) (2) (3) 0.45 (ref.) (in mm) CSTCE_V 14.00-20.00MHz 2.0±0.15 1.3±0.150.85±0.1 1.1 max. 0.10±0.10 1.85 max. 0.5±0.1 0.3±0.1 0.5±0.1 (1) (2) (3) (in mm) CSTCG_V 20.00-33.86MHz (Ultra Small) Continued on the following page. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Continued from the preceding page. 2.5±0.2 1.2 max. Thickness varies with frequency. ∗: EIAJ code 0.5±0.2 0.5±0.2 1.0±0.21.0±0.2 1.25±0.2 (0.5) (0.5) 0.05+0.10 -0.050.05+0.10 -0.05 0.4 +0.3 -0.20.4 +0.3 -0.2 2.0±0.2 (in mm) CSACW_X 20.01-70.00MHz 2.5±0.2 1.4 max. Thickness varies with frequency and built-in capacitance. ∗: EIAJ code 1.0±0.21.0±0.2 1.25±0.2 (0.5) (3) (0.5) (1) (0.5) (2)0.05+0.10 -0.05 0.05+0.10 -0.05 0.4 +0.3 -0.20.4 +0.3 -0.20.4 +0.3 -0.2 2.0±0.2 (in mm) CSTCW_X 20.01-70.00MHz Part Number Oscillating Frequency (MHz) Initial Tolerance Temperature Stability (%) Temperature Range (°C) CSTCR_G 4.00 to 7.99 ±0.5% ±0.2 -20 to 80 CSTCE_G 8.00 to 13.99 ±0.5% ±0.2 -20 to 80 CSTCE_G_Z 8.00 to 13.99 ±0.5% ±0.2 -40 to 125 CSTCE_V 14.00 to 20.00 ±0.5% ±0.3 -20 to 80 CSTCG_V 20.00 to 33.86 ±0.5% ±0.3 -20 to 80 CSACW_X 20.01 to 70.00 ±0.5% ±0.2 -20 to 80 CSTCW_X 20.01 to 70.00 ±0.5% ±0.2 -20 to 80 Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. VDD Rf To Frequency Counter 5pF 1MΩ Rd C1 C2 (1) (3) (2) c Oscillation Frequency Measuring Circuit CSTCR_G/CSTCE_G/CSTCE_G_Z/CSTCE_V/CSTCG_V Rf Rd VDD C1 C2 To Frequency Counter (1) (3) (2) CSTCC_G/CSTCW_X Rf Rd VDD CL2CL1 To Frequency counter CSACW_X P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

3.8~4.4 1.2 1.2 2.5 2.5 1.4 1.2 1.2 Land Pattern (in mm) c Standard Land Pattern Dimensions CSTCC_G 2.6 1.6 0.8 0.4 1.5 1.5 0.4 0.4 0.8 0.80.70.7 Land Pattern (in mm) 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in mm) CSTCE_G/CSTCE_G_Z Land Pattern 0.95 0.95 1.6 (in mm) Land Pattern 0.8 0.8 1.6 (in mm) CSTCG_V 0.5 0.5 2.0 0.80.8 2.0 0.30.3 Land Pattern (in mm) CSACW_X 0.5 0.5 0.50.5 1.0 1.0 0.80.8 2.0 0.30.3 0.5 Land Pattern (in mm) CSTCW_X P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering. CSTCR_G (* This Land Pattern is not common to CSTCR_G15C, CSTCR_G15L, CSTCR_GH5L.) CSTCE_V (* This Land Pattern is not common to CSTCE_V13C, CSTCE_V_C, CSTCE_V13L, CSTCE_VH3L.)

Oscillating Frequency Shift (%) Temperature (°C) -40 -20 0 +20 +40 +60 +80 +100 +0.2 +0.1 -0.1 -0.2 c Oscillation Frequency Temperature Stability CSTCC_G -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) +0.2 +0.1 -0.1 -0.2 Temperature (°C) CSTCR_G -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) Temperature (°C) +0.2 +0.1 -0.1 -0.2 CSTCE_G/CSTCE_G_Z -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) +0.2 +0.1 -0.1 -0.2 Temperature (°C) CSTCE_V -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 Oscillating Frequency Shift (%) Temperature (°C) +0.2 +0.1 -0.1 -0.2 CSTCG_V Oscillating Frequency Shift (%) Temperature (°C) -40 -20 0 +20 +40 +60 +80 +100 +0.2 +0.1 -0.1 -0.2 CSACW_X Oscillating Frequency Shift (%) Temperature (°C) -40 -20 0 +20 +40 +60 +80 +100 +0.2 +0.1 -0.1 -0.2 CSTCW_X P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Application Circuits Utilization 11 10 L 12 0.1μF IC : μPD78F0533GB Vdd=5.0V 10kΩ H: 15, 16, 47 L: 9, 13, 14, 48 CERALOCKr C1 C2 CERALOCKr: CSTCR4M00G55-R0 C1=39pF (Typ.) C2=39pF (Typ.) V2V1 c µPD78F0533GB (Renesas) 8-bit Microcomputer A14 A15 GND EVALUATION BOARD IC : TMP19A43FDXBG Vcc=1.5V Xin: A14 Xout: A15 CERALOCKr C1 C2 CERALOCKr: CSTCE10M0G52-R0 C1=10pF (Typ.) C2=10pF (Typ.) Vcc'=2.5V Vcc''=3.3V V2V1 c TMP19A43FDXBG (Toshiba) 32-bit Microcomputer H 14 13 L V dd2 10μF IC : MN103SFC2D Vdd=5.0V H: 9, 17, 34 L: 7, 15, 36 V dd2: 16, 38 CERALOCKr C1 C2 CERALOCKr: CSTCR5M00G55Z-R0 C1=39pF (Typ.) C2=39pF (Typ.) V2V1 c MN103SFC2D (Panasonic) 32-bit Microcomputer H 56 55 L IC : MB95F128H Vcc=5.0V H: 3, 28, 51, 79 L: 4, 29, 54, 57 CERALOCKrC1 C2 CERALOCKr: CSTCE8M00G52-R0 C1=10pF (Typ.) C2=10pF (Typ.) V2V1 c MB95F128H (Fujitsu) 8-bit Microcomputer H 16 15 GND EVALUATION BOARD IC : PIC16F716-I/SO(HS) Vdd=5.0V CERALOCKr C1 C2 CERALOCKr: CSTCE12M0G52-R0 C1=10pF (Typ.) C2=10pF (Typ.) V2V1 1MΩ c PIC16F716-I/SO (Microchip) 8-bit Microcomputer H 11 10 L 6 0.1μF IC : HD64F36077GH Vcc=5.0V H: 3, 7, 12 L: 8, 9 CERALOCKr C1 C2 CERALOCKr: CSTCE8M00G52-R0 C1=10pF (Typ.) C2=10pF (Typ.) V2V1 c HD64F36077GH (Renesas) 16-bit Microcomputer Continued on the following page. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Application Circuits Utilization Continued from the preceding page. H1 4 12 13 L 10 IC : μPD70F3215HYGC Vdd=5.0V H: 1, 5, 9, 34, 70 CERALOCKr C1 C2 CERALOCKr: CSTCR5M00G55-R0 C1=39pF (Typ.) C2=39pF (Typ.) V2V1 10μF c µPD70F3215HYGC (Renesas) 32-bit Microcomputer H 24 23 L IC : ATmega128 Vcc=5.0V H: 21, 52, 64 L: 22, 53, 63 CERALOCKrC1 C2 CERALOCKr: CSTCE8M00G52-R0 C1=10pF (Typ.) C2=10pF (Typ.) V2V1 c ATmega128 (Atmel) 8-bit Microcomputer H1 8 15 14 L IC : ST7FLITE29F2B6 Vdd=5.0V H: 17 L: 16 CERALOCKr C1 C2 CERALOCKr: CSTCE16M0V53-R0 C1=15pF (Typ.) C2=15pF (Typ.) V2V1 c ST7FLITE29F2B6 (ST Microelectronics) 8-bit Microcomputer 58 57 L IC : TMS320F2810PBKA Vdd1=1.8V CERALOCKr: CSTCE15M0V53-R0 C1=15pF (Typ.) C2=15pF (Typ.) Vdd2=3.3V H1 H2 V2V1 100Ω CERALOCKr C1 C2 100, 102, 110, 114 H2: 1, 13, 14, 25, 49, 52, 83, 104, 118 88, 95, 103, 109, 115, 117, 128 c TMS320F2810PBKA (Texas Instruments) 32-bit Microcomputer P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Ceramic Resonators (CERALOCKr) MHz Lead Type -Standard Frequency Tolerance for General Usage- MURATA's ceramic resonator, CERALOCK(R) with built-in load capacitors, has been widely applied as the most suitable component for clock oscillators in a broad range of microprocessors. The CSTLS series can be used in the design of oscillation circuits not requiring external load capacitors, enabling both high-density mounting and cost reduction. c Features 1. Oscillation circuits do not require external load capacitors. There is some variation in built-in capacitance values applicable to various ICs. 2. Stable over a wide temperature range. 3. Compact, lightweight and exhibit superior shock resistance performance. 4. Enable the design of oscillator circuits requiring no adjustment. 5. Cost-effective and reliable availability c Applications 1. DTMF generators 2. Clock oscillators for microcomputers 3. Remote control units 4. Automated offi ce equipment ∗∗∗ ∗∗∗ : Weekly Date Code (in mm) 8.0±1.0 3.0±1.0 5.5±0.53.5±0.3 ø0.48±0.05 2.5±0.22.5±0.2 0.7 (Ref.) 0.7 (Ref.)7.0 (Ref.) (3) (2) (1) CSTLS_G 3.40-10.00MHz 5.5±1.0 2.5±0.2 2.5±0.2 (in mm) T ∗1 T ∗1 (3) (2) (1) ∗ : EIAJ Monthly Code CSTLS_X 16.00-70.00MHz Part Number Oscillating Frequency (MHz) Initial Tolerance Temperature Stability (%) Temperature Range (°C) CSTLS_X 16.00 to 70.00 ±0.5% ±0.2 -20 to 80 Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page. Rf Rd VDD C1 C2 To Frequency Counter (1) (3) (2) c Oscillation Frequency Measuring Circuit CSTLS_G/CSTLS_X P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Oscillating Frequency Shift (%) Temperature (°C) –40 +0.50 +0.25 –0.25 –0.50 0 40 80 120 c Oscillation Frequency Temperature Stability CSTLS_G Temperature (°C) Oscillating Frequency Shift (%) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –50 –30 –10 10 30 50 70 90 110 130 CSTLS_X P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Application Circuits Utilization H2 5 28 29 L M38235G6HP Vcc=5.0V H: 71 L: 30, 73 CERALOCKr C1 C2 CERALOCKr: CSTLS8M00G53-B0 C1=15pF (Typ.) C2=15pF (Typ.) V2V1 c M38235G6HP (Renesas) 8-bit Microcomputer

26 H' H 2

67 L L'

10kF2.2kF IC : LC87F5G32A Vdd=5.0V 10kΩ 10kΩ 100pF 47000pF510Ω H: 8, 19, 39 L: 5, 20, 40 H': 29, 31, 35 L': 30, 32~34, 36 CERALOCKr C1 C2 CERALOCKr: CSTLS5M00G53-B0 C1=15pF (Typ.) C2=15pF (Typ.) V2V1 c LC87F5G32A (Sanyo) 8-bit Microcomputer P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Notice for General Usage -MHz Chip Type- Please mount component on a circuit board by reflow soldering. Flow soldering is not acceptable. 1. Soldering (1) Reflow soldering Recommendable Flux and Solder If compelled to mount the component by using soldering iron, please do not directly touch the component with the soldering iron. The component terminals or electrical characteristics may be damaged if excessive thermal stress is applied. (2) Soldering with Iron Please make the solder volume less than the height of the substrate to avoid damage to the seal between the metal cap and the substrate. (3) Solder Volume Do not reuse components removed from a circuit board after soldering. (4) Other The component is recommended with placement machines that employ optical placement capabilities. The component may be damaged by excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. (5) Conditions for Placement Machines 150 180 220 245 260 Gradual Cooling Peak Pre-heating (150 to 180°C) Heating (220°C min.) 60 to 120s 30 to 60s Temperature (°C) Flux Solder Please use rosin based flux, not water soluble flux. Recommendable Soldering Profile Pre-heating Heating Peak Temperature 150 to 180°C Please use solder (Sn-3.0Ag-0.5Cu) under the following conditions: Standard thickness of soldering paste: 0.10 to 0.15mm. 220°C min. upper limit: 260°C lower limit: 245°C 60 to 120s 30 to 60s 1s max. 5s max. Temperature shall be measured on the surface of component. Recommendable Soldering with Iron Heating of the soldering iron Watt Shape of the soldering iron 350°C max. 30W max. ø3mm max. 5s max. at one terminal Sn-3.0Ag-0.5Cu Soldering Time Solder Continued on the following page. c Soldering and Mounting (CSTCC Series) P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Notice for General Usage -MHz Chip Type- Conformal coating of the component is acceptable. However, the resin material, curing temperature, and other process conditions should be evaluated to confirm stable electrical characteristics are maintained. 3. Coating Continued from the preceding page. dTV60°C (dT=Component-solvent) *1 ex. If the component is immersed at +90°C into cleaning solvent at +60°C, then dT=30°C. (2) Temperature Difference : dT *1 5 minutes max. by air blowing at +80°C max. (4) Drying (a) Total washing time should be within 10 minutes. (b) The component may be damaged if it is washed with chlorine, petroleum, or alkali cleaning solvent. (5) Other (a) Ultrasonic Wash 1 minute max. in above solvent at +60°C max. (Frequency: 28kHz, Output: 20W/l) (b) Immersion Wash 5 minutes max. in above solvent at +60°C max. (c) Shower or Rinse Wash 5 minutes max. in above solvent at +60°C max. (3) Conditions HCFC, Isopropanol, Tap water, Demineralized water, Cleanthrough750H, Pine alpha 100S, Techno care FRW 2. Wash (1) Cleaning Solvents Some series do not withstand washing. Please check the list at right before use. CSTCC (2.00 to 3.49MHz) CSTCC (3.50 to 3.99MHz) Series Wash Not Available Available P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Notice for General Usage -MHz Chip Type- Please mount component on a circuit board by reflow soldering. Flow soldering is not acceptable. 1. Soldering Conformal coating or washing of the component is not acceptable, because it is not hermetically sealed. Please contact us if you need a washable component. 2. Washing / Coating (1) Reflow soldering Recommendable Flux and Solder If compelled to mount the component by using soldering iron, please do not directly touch the component with the soldering iron. The component terminals or electrical characteristics may be damaged if excessive thermal stress is applied. (2) Soldering with Iron Please make the solder volume less than the height of the substrate to avoid damage to the seal between the metal cap and the substrate. (3) Solder Volume Do not reuse components removed from a circuit board after soldering. (4) Other The component is recommended with placement machines that employ optical placement capabilities. The component may be damaged by excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. (5) Conditions for Placement Machines 150 180 220 245 260 Gradual Cooling Peak Pre-heating (150 to 180°C) Heating (220°C min.) 60 to 120s 30 to 60s Temperature (°C) Flux Solder Please use rosin based flux, not water soluble flux. Recommendable Soldering Profile Pre-heating Heating Peak Temperature 150 to 180°C Please use solder (Sn-3.0Ag-0.5Cu) under the following conditions: Standard thickness of soldering paste: 0.10 to 0.15mm. 220°C min. upper limit: 260°C lower limit: 245°C 60 to 120s 30 to 60s 1s max. 5s max. Temperature shall be measured on the surface of component. Recommendable Soldering with Iron Heating of the soldering iron Watt Shape of the soldering iron 350°C max. 30W max. ø3mm max. 5s max. at one terminal Sn-3.0Ag-0.5Cu Soldering Time Solder c Soldering and Mounting (CSTCR/CSTCE_V/CSTCG/CSTCE_G Series) Continued on the following page. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Notice for General Usage -MHz Chip Type- Continued from the preceding page. Please mount component on a circuit board by reflow soldering. Flow soldering is not acceptable. 1. Soldering Conformal coating or washing of the component is not acceptable, because it is not hermetically sealed. Please contact us if you need a washable component. 2. Washing / Coating (1) Reflow soldering Recommendable Flux and Solder If compelled to mount the component by using soldering iron, please do not directly touch the component with the soldering iron. The component terminals or electrical characteristics may be damaged if excessive thermal stress is applied. (2) Soldering with Iron Do not reuse components removed from a circuit board after soldering. (3) Other The component is recommended with placement machines that employ optical placement capabilities. The component may be damaged by excessive mechanical force. Please make sure that you have evaluated by using placement machines before going into mass production. Do not use placement machines that utilize mechanical positioning. Please contact Murata for details beforehand. (4) Conditions for Placement Machines 150 180 220 245 260 Gradual Cooling Peak Pre-heating (150 to 180°C) Heating (220°C min.) 60 to 120s 30 to 60s Temperature (°C) Flux Solder Please use rosin based flux, not water soluble flux. Recommendable Soldering Profile Pre-heating Heating Peak Temperature 150 to 180°C Please use solder (Sn-3.0Ag-0.5Cu) under the following conditions: Standard thickness of soldering paste: 0.10 to 0.15mm. 220°C min. upper limit: 260°C lower limit: 245°C 60 to 120s 30 to 60s 1s max. 5s max. Temperature shall be measured on the surface of component. Recommendable Soldering with Iron Heating of the soldering iron Watt Shape of the soldering iron 350°C max. 30W max. ø3mm max. 5s max. at one terminal Sn-3.0Ag-0.5Cu Soldering Time Solder c Soldering and Mounting (CSACW/CSTCW Series) P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Notice for General Usage -MHz Chip Type- c Storage and Operating Conditions c Rating The component may be damaged if excessive mechanical stress is applied. c Handling "CERALOCK" may stop oscillating or oscillate irregularly under improper circuit conditions. 1. Product Storage Conditions Please store the products in a room where the temperature/humidity is stable, and avoid such places where there are large temperature changes. Please store the products under the following conditions: Temperature: -10 to +40°C Humidity: 15 to 85% R.H. 2. Expiration Date on Storage Expiration date (Shelf life) of the products is six months after delivery under the conditions of a sealed and unopened package. Please use the products within six months after delivery. If you store the products for a long time (more than six months), use carefully because the products may be degraded in solderability and/or rusty. Please confirm solderability and characteristics for the products regularly. 3. Notice on Product Storage (1) Please do not store the products in a chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides and so on), because the characteristics may be reduced in quality, and/or be degraded in the solderability due to the storage in a chemical atmosphere. (2) Please do not put the products directly on the floor without anything under them to avoid damp and/or dusty places. (3) Please do not store the products in places such as: in a damp heated place, in a place where direct sunlight comes in, in a place applying vibrations. (4) Please use the products immediately after the package is opened, because the characteristics may be reduced in quality, and/or be degraded in the solderability due to storage under the poor conditions. (5) Please do not drop the products to avoid cracking of ceramic elements. 4. Other Conformal coating or washing of the component is not acceptable because it is not hermetically sealed. Please be sure to consult with our sales representatives or engineers whenever and prior to using the products. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Notice for General Usage -MHz Lead Type- c Soldering and Mounting The component cannot withstand washing. Please do not apply excessive mechanical stress to the component and lead terminals during soldering. c Storage and Operating Conditions c Rating The component may be damaged if excessive mechanical stress is applied. c Handling "CERALOCK" may stop oscillating or oscillate irregularly under improper circuit conditions. 1. Product Storage Conditions Please store the products in a room where the temperature/humidity is stable, and avoid such places where there are large temperature changes. Please store the products under the following conditions: Temperature: -10 to +40°C Humidity: 15 to 85% R.H. 2. Expiration Date on Storage Expiration date (Shelf life) of the products is six months after delivery under the conditions of a sealed and unopened package. Please use the products within six months after delivery. If you store the products for a long time (more than six months), use carefully because the products may be degraded in solderability and/or rusty. Please confirm solderability and characteristics for the products regularly. 3. Notice on Product Storage (1) Please do not store the products in a chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides and so on), because the characteristics may be reduced in quality, and/or be degraded in the solderability due to the storage in a chemical atmosphere. (2) Please do not put the products directly on the floor without anything under them to avoid damp and/or dusty places. (3) Please do not store the products in places such as: in a damp heated place, in a place where direct sunlight comes in, in a place applying vibrations. (4) Please use the products immediately after the package is opened, because the characteristics may be reduced in quality, and/or be degraded in the solderability due to storage under the poor conditions. (5) Please do not drop the products to avoid cracking of ceramic elements. 4. Other Conformal coating or washing of the component is not acceptable because it is not hermetically sealed. Please be sure to consult with our sales representatives or engineers whenever and prior to using the products. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Packaging for General Usage -MHz Chip Type- (in mm) ab CSTCC_G CSTCR_G CSTCR_G15L CSTCR_GH5L CSTCE_G CSTCE_G15L CSTCE_GH5L CSTCE_V CSTCE_V13L CSTCE_VH3L CSTCG_V CSTCW_X CSTCW_X11 CSACW_X Part Number Plastic Tape ø180mm Plastic Tape ø330mm Bulk Dimensions 2,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 6,000 9,000 9,000 9,000 9,000 9,000 9,000 9,000 9,000 9,000 9,000 9,000 9,000 9,000 500 500 500 500 500 500 500 500 500 500 500 500 500 500 a a a b b b b b b b b b b b (ø180 ) 17.0±1.0 ø13.0±0.2 2.0±0.5 160-190 Trailer Leader Empty 400-560 Cover Film Components Trailer 160-190 Empty 160 min. Empty 160 min. 400-560 Cover Film Leader Empty Components ø13.0±0.2 2.0±0.5 +1.0 –09.0 13.0±1.0 (pcs.) Dimensions of Reel The order quantity should be an integral multiple of the "Minimum Quantity" shown above. 13.0 +1.0 –1.5 (ø180 )0 –1.5 c Minimum Quantity (in mm) 4.0±0.1 2.0±0.05 (9.5) 4.0±0.1 ø1.5+0.1 ø1.5+0.1 12.0±0.2 1.25±0.05 (1.85 max.) 2.2±0.1 Direction of Feed (3°) 10° Cover Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. (3)(2)(1) 4.7±0.1 c Dimensions of Taping CSTCR_G15L/CSTCR_GH5L (in mm) 2.0±0.05 4.0±0.1 (3˚) 3.5±0.05 8.0±0.2 1.75±0.1 0.25±0.05 0.90±0.10 (1.30 max.) 10° (5.2) Cover Film Direction of Feed The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 4.0±0.1 ø1.5 -0.0 +0.1 ø1.0 -0.0 +0.2 1.50 -0.05 +0.10 (3)(2)(1) 3.40 -0.05 +0.10 CSTCE_G15L/CSTCE_GH5L Continued on the following page. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Packaging for General Usage -MHz Chip Type- Continued from the preceding page. Dimensions of Carrier Tape (in mm) 4.0±0.1 Cover Film 4.0±0.1 2.0±0.05 8.0±0.2 ø1.5 +0.1 -0.0 ø1.0 +0.1 -0.0 +0.10 -0.05 3.5±0.05 1.75±0.1 3.45±0.1 Direction of Feed 0.25±0.05 (1.40 max.) 1.10±0.05 (3°) 1.50The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 10° (5.2) (2) (3) (1) c Dimensions of Taping CSTCE_V13L/CSTCE_VH3L (in mm) Thickness of CERALOCKr ∗1, ∗2: Dimensions vary with product thickness of CERALOCKr. t1 ∗1 t2 ∗2 1.48±0.1 2.1 max. 1.30±0.1 1.9 max. 1.12±0.1 1.7 max. 4.0±0.1 3.5±0.1 1.75±0.1 (1) (3) 8.0±0.2 (5.5) 2.0±0.1 (3°) 10° Cover Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. +0.1 -0.0ø1.5 +0.2 -0.0ø1.0 Direction of Feed 2.8±0.1 4.0±0.1 2.3±0.1 t1 ∗1 t2 ∗2 0.2±0.1 (2) CSTCW_X11 (in mm) 4.0±0.1 2.0±0.05 +0.3 -0.0 ø1.55±0.05 ø1.5 1.75±0.15.5±0.05 12.0±0.2 7.6±0.1 4.0±0.1 (9.5) 3.3±0.1The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. Cover Film 10° (3°) t1 ∗1 t2 ∗2 0.3±0.05 Direction of Feed (3) (1) Frequency Range ∗1, ∗2: Dimensions vary with frequency range of CERALOCKr. 2.00–2.99MHz 3.00–3.99MHz 1.85±0.05 2.45 max. 1.65±0.05 2.25 max. (2) t1 ∗1 t2 ∗2 CSTCC_G (in mm) 4.0±0.1 2.0±0.05 (9.5) 4.0±0.1 (3)(2)(1) ø1.5+0.1 ø1.5+0.1 12.0±0.2 5.5±0.05 1.75±0.1 4.7±0.1 2.2±0.1 Direction of Feed (3°) 10° Cover Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 0.3±0.05 1.25±0.05 (1.85 max.) CSTCR_G (in mm) 2.0±0.05 4.0±0.1 (3˚) 3.5±0.05 8.0±0.2 1.75±0.1 0.25±0.05 0.90±0.10 (1.30 max.) 10° (5.2) Cover Film Direction of Feed The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 4.0±0.1 ø1.5 -0.0 +0.1 ø1.0 -0.0 +0.2 1.50 -0.05 +0.10 (3)(2)(1) 3.40 -0.05 +0.10 CSTCE_G Dimensions of Carrier Tape (in mm) 4.0±0.1 Cover Film 4.0±0.1 2.0±0.05 8.0±0.2 ø1.5 +0.1 -0.0 ø1.0 +0.1 -0.0 +0.10 -0.05 3.5±0.05 1.75±0.1 3.45±0.1 Direction of Feed 0.25±0.05 (1.40 max.) 1.10±0.05 (3°) 1.50The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 10° (5.2) (2) (3) (1) CSTCE_V (in mm) 4.0±0.1 Cover Film 4.0±0.1 2.0±0.05 8.0±0.2 ø1.5 +0.1 -0.0 ø1.0 +0.1 -0.0 3.5±0.05 1.75±0.1 2.2±0.05 Direction of Feed 0.25±0.05 (1.30 max.) 1.00±0.05 (3°) 1.50±0.1The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. 10° (5.2) (2) (3) (1) CSTCG_V (in mm) Thickness of CERALOCKr ∗1, ∗2: Dimensions vary with product thickness of CERALOCKr. t1 ∗1 t2 ∗2 1.48±0.1 2.1 max. 1.30±0.1 1.9 max. 1.12±0.1 1.7 max. 4.0±0.1 3.5±0.1 1.75±0.1 8.0±0.2 (5.5) 2.0±0.1 (3°) 10° Cover Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. +0.1 -0.0ø1.5 +0.2 -0.0ø1.0 Direction of Feed 4.0±0.1 2.3±0.1 2.8±0.1 t1 ∗1 t2 ∗2 0.2±0.1 CSACW_X Continued on the following page. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Packaging for General Usage -MHz Chip Type- Continued from the preceding page. (in mm) Thickness of CERALOCKr ∗1, ∗2: Dimensions vary with product thickness of CERALOCKr. t1 ∗1 t2 ∗2 1.48±0.1 2.1 max. 1.30±0.1 1.9 max. 1.12±0.1 1.7 max. 4.0±0.1 3.5±0.1 1.75±0.1 (1) (3) 8.0±0.2 (5.5) 2.0±0.1 (3°) 10° Cover Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300mm/min. +0.1 -0.0ø1.5 +0.2 -0.0ø1.0 Direction of Feed 2.8±0.1 4.0±0.1 2.3±0.1 t1 ∗1 t2 ∗2 0.2±0.1 (2) c Dimensions of Taping CSTCW_X P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Packaging for General Usage -MHz Lead Type- Part Number Ammo Pack (pcs.)The order quantity should be an integral multiple of the "Minimum Quantity" shown above. Bulk 500 500 CSTLS_G (3.40 to 10.0MHz) 2,000 CSTLS_X (16.00 to 70.00MHz) 2,000 c Minimum Quantity (in mm) Width of diameter Height of resonator Dimensions of terminal Lead length under the hold down tape Pitch of component Pitch of sprocket hole Length from sprocket hole center to lead Length from sprocket hole center to component center Lead spacing (I) Lead spacing (II) Slant forward or backward Width of carrier tape Width of hold down tape Position of sprocket hole Gap of hold down tape and carrier tape Distance between the center of sprocket hole and lead stopper Total height of resonator Diameter of sprocket hole Total tape thickness Body tilt Item Code Dimensions Tolerance Remarks D A d P dh W t dS 8.0 5.5 ø0.48 5.0 min. 12.7 12.7 3.85 6.35 2.5 2.5 18.0 6.0 min. 9.0 18.0 23.5 ø4.0 0.6 ±1.0 ±0.5 ±0.05 ±0.5 ±0.2 ±0.5 ±0.5 ±0.2 ±0.2 ±1.0 ±0.5 ±0.5 ±0.5 ±1.0 ±0.2 ±0.2 ±1.0 Tolerance for Pitches 10xP 0=127±1 1mm max. Hold down tape does not exceed the carrier tape. W0.5 D A P dS W tP0 P1 F1 F2 Direction of Feed dh dh d c Tape Dimensions of CSTLS_G Continued on the following page. P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

Packaging for General Usage -MHz Lead Type- Continued from the preceding page. (in mm) Width of diameter Height of resonator Dimensions of terminal Lead length under the hold down tape Pitch of component Pitch of sprocket hole Length from sprocket hole center to lead Length from sprocket hole center to component center Lead spacing (I) Lead spacing (II) Slant forward or backward Width of carrier tape Width of hold down tape Position of sprocket hole Gap of hold down tape and carrier tape Distance between the center of sprocket hole and lead stopper Total height of resonator Diameter of sprocket hole Total tape thickness Body tilt Item Code Dimensions Tolerance Remarks D A d P dh W t dS 5.5 6.5 ø0.48 5.0 min. 12.7 12.7 3.85 6.35 2.5 2.5 18.0 6.0 min. 9.0 18.0 24.5 ø4.0 0.6 ±1.0 ±0.5 ±0.05 ±0.5 ±0.2 ±0.5 ±0.5 ±0.2 ±0.2 ±1.0 ±0.5 ±0.5 ±0.5 ±1.0 ±0.2 ±0.2 ±1.0 Tolerance for Pitches 10xP 0=127±1 1mm max. Hold down tape does not exceed the carrier tape. W0.5 Y0.0 D dS d P2 P A P0 t F1 F2 W dh dh Direction of Feed c Tape Dimensions of CSTLS_X P16E.pdf Nov.22,2012 !Note  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.

!Note P16E.pdf Nov.22,2012  Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.  This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.