CSMC30XSC CYSTEKEC | Alldatasheet

Document overview

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Technical content

Features

  • For surface mounted applications.
  • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
  • Glass passivated junction
  • High surge capability
  • High temperature soldering: 250°C/10 seconds at terminals
  • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data
  • Case: Molded plastic, SMC/JEDEC DO-214AB.
  • Terminals: Solder plated, solderable per MIL-STD-750 method 2026
  • Polarity: Indicated by cathode band.
  • Mounting Position : Any.
  • Weight: 0.195 gram, 0.00585 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Type Parameter Symbol CSMC 301 CSMC 302 CSMC 303 CSMC 304 CSMC 305 CSMC 306 CSMC 307 Units Repetitive peak reverse voltage V RRM 50 100 200 400 600 800 1000 V Maximum RMS voltage V RMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage V R 50 100 200 400 600 800 1000 V Maximum instantaneous forward voltage, IF=3A (Note 1) VF 1.1 V Average forward rectified current I O 3 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 100 A Maximum DC reverse current VR=VRRM,TA=25℃(Note 1) VR=VRRM,TA=125℃(Note 1) IR 250 µA µA Maximum thermal resistance, Junction to ambient (Note 2) Rth,JA 47 (typ) ℃/W Diode junction capacitance @ f=1MHz and applied 4VDC reverse voltage CJ 40(typ) pF Storage temperature Tstg -55 ~ +150 ℃ Operating temperature T J -55 ~ +150 ℃ Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle 2 .Mounted on PCB with 30mm² (0.013mm thickness) copper pad area.

CYStech Electronics Corp. Spec. No. : C344SC Issued Date : 2003.10.29 Revised Date : Page No. : 2/3 CSMC30XSC CYStek Product Specification Characteristic Curves Forward Current Derating Curve 0.5 1.5 2.5 3.5 0 20 40 60 80 100 120 140 160 Ambient Temperature---T A(℃) Average Forward Current---I O(A) Single Phase, Half Wave 60Hz, Resistive or Inductive Load Forward Current vs Forward Voltage 0.01 0.1 100 Forward Voltage---V F(V) Forward Current---I F(A) Tj=25℃ Pulse Width=300μs Duty Cycle=1% Maximum Non-Repetitive Forward Surge Current 100 150 200 250 1 10 100 Numbers of Cycles at 60Hz Peak Forward Surge Current--- IFSM(A) Tj=25℃, 8.3ms Single Half Sine Wave, JEDEC method Junction Capacitance vs Reverse Voltage 100 120 0.01 0.1 1 10 100 Reverse Voltage---V R(V) Junction Capacitance---C J(pF) Reverse Leakage Current vs Reverse Voltage 0.01 0.1 100 0 2 04 06 08 0 1 0 0 1 2 0 1 4 0 Percentage of Rated Peak Reverse Voltage---(%) Reverse Leakage Current---(A) Tj = 100℃ Tj = 25℃

CYStech Electronics Corp. Spec. No. : C344SC Issued Date : 2003.10.29 Revised Date : Page No. : 3/3 CSMC30XSC CYStek Product Specification SMC/DO-214AB Dimension *:Typical C 0.012(typ) 0.3(typ) G 0.032(typ) 0.8(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : 42 Alloy ; solder plating
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SMC/DO-214AB Plastic Surface Mounted Package CYStek Package Code: SC Marking Code: Device CSMC 301 CSMC 302 CSMC 303 CSMC 304 Code A31 A32 A33 A34 Device CSMC 305 CSMC 306 CSMC 307 Code A35 A36 A37