CSK640J3 CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 7

Technical content

Features

  • Excellent power dissipation offers better reverse leakage current and thermal resistance
  • Low profile surface mount application in order to optimize board space
  • Metal silicon junction, major carrier conduction
  • 6A total (3A per diode leg)
  • G u a r d r i n g f o r o v e r v o l t a g e p r o t e c t i o n
  • Low power loss, high efficiency
  • High surge capability
  • High current capability, low forward voltage drop
  • Ultra-high speed switching
  • Lead-free parts meet environmental standard MIL-STD-19500 /228 Mechanical Data
  • Case: Molded plastic, TO-252
  • Mounting Position: Any
  • Weight: 0.34 grams approximately
  • Terminals: Pure tin plated, lead-free, solderable per MIL-STD-750 method 2026
  • Epoxy: UL 94V-0 rate flame retardant
  • Polarity : Indicated by diode symbol E q u i v a l e n t C i r c u i t O u t l i n e TO-252AB TO-252AA CSK640J3 A K A A K A

CYStech Electronics Corp. Spec. No. : C468J3 Issued Date : 2009.07.03 Revised Date :2010.07.29 Page No. : 2/7 CSK640J3 CYStek Product Specification Maximum Ratings and Electrical Characteristics (Per Diode Leg) (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.) Parameter Symbol Limits Units Maximum Recurrent peak reverse voltage VRRM 40 V Maximum RMS voltage VRMS 28 V Maximum DC blocking voltage VDC 40 V Maximum instantaneous forward voltage at I F= 3 A VF 0.55 V Per Diode 3 Maximum Average forward rectified current Per Device IF(AV) A 6 Non-repetitive peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 75 A

0.5 Maximum instantaneous reverse current at VR=40V, TA= 25℃

VR=40V, TA= 125℃ mA IR 20 Maximum Thermal Resistance, Junction-to-case RθJC 5 °C/W Maximum Thermal Resistance, Junction-to-ambient RθJA 125 °C/W Storage temperature range Tstg -65 ~ +175 ℃ Operating junction temperature range TJ -55 ~ +125 ℃

Ordering Information

Device Package Shipping Marking TO-252 (Pb-free) 3000 pcs / Tape & Reel CSK640J3 SK640 Recommended soldering footprint

CYStech Electronics Corp. Spec. No. : C468J3 Issued Date : 2009.07.03 Revised Date :2010.07.29 Page No. : 3/7 CSK640J3 CYStek Product Specification Characteristic Curves Forward Current Derating Curve 0 50 100 150 CaseTemperature---T C(℃) Average Forward Current---I F(AV)(A) Maximum Non-Repetitive Forward Surge Current 100 11 0 Number of Cycles at 60Hz Peak Forward Surge Current---IFSM(A) 100 Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method Forward Current vs Forward Voltage 0.01 0.1 Forward Voltage---VF(V) Instantaneous Forward Current---IF(A) Tj=25℃, Pulse width=300μs, 1% Duty cycle Reverse Leakage Current vs Reverse Voltage 0.01 0.1 100 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) Reverse Leakage Current---I R(mA) Tj=75℃ Tj=25°C

CYStech Electronics Corp. Spec. No. : C468J3 Issued Date : 2009.07.03 Revised Date :2010.07.29 Page No. : 4/7 CSK640J3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C468J3 Issued Date : 2009.07.03 Revised Date :2010.07.29 Page No. : 5/7 CSK640J3 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. 100°C 150°C 150°C 200°C Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 60-120 seconds 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max.

CYStech Electronics Corp. Spec. No. : C468J3 Issued Date : 2009.07.03 Revised Date :2010.07.29 Page No. : 6/7 CSK640J3 CYStek Product Specification TO-252AB Dimension 3-Lead TO-252AB Plastic Surface Mount Package CYStek Package Code: J3 Marking: SK640 Style: Pin 1.Anode 2.Common Cathode 3. Anode *: Typical e *0.091 *2.300 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: KFC; pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

CYStech Electronics Corp. Spec. No. : C468J3 Issued Date : 2009.07.03 Revised Date :2010.07.29 Page No. : 7/7 CSK640J3 CYStek Product Specification TO-252AA Dimension Style: Pin 1.Anode 2.Common Cathode 3. Anode 3-Lead TO-252AA Plastic Surface Mount Package CYStek Package Code: J3 Marking: SK640 *: Typical e *0.090 *2.286 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: KFC; pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.