CSH210R TRIQUINT | Alldatasheet

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Technical content

For further information, please visit www.triquint.com pg. 1/7 Ver 5; December 16th, 2003 Features:

  • SPDT Switch for mobile communications: o Insertion Loss: 0.4 dB @ 2.0 GHz o Isolation: 20 dB @ 2.0 GHz o VSWR: 1.3:1 o P0.1dB: +26 dBm
  • RF-frequency range DC – 2.5 GHz
  • No supply voltage
  • Positive control voltage
  • Small SC-70 plastic package General Purpose SPDT Switch Description: CSH210R is a general purpose single-pole, double-throw switch device designed fo r mobile communications applications such as cellular and PCS mobile phones, ISM bands, GPS receivers, L-band satellite terminals, WLAN and pagers. The device is based on pHEMT technology and exhibits very low insertion loss and high intermodulation performance. The CSH210R does not need a supply voltage and switching is accomplished with a positive control voltage. The device exhibits excellent VSWRs and isolation and is useable from DC to 2.5 GHz. Applications:
  • General Purpose SPDT
  • Antenna Diversity Switching
  • TX-RX Switching
  • Mobile Phones
  • ISM and WLAN
  • L-Band Satellite Terminals Package Outline: SC-70 Pin Configuration: 1: RF1 Port 2: GND 3: RF2 Port 4: Control V2 5: RF Common 6: Control V1

Maximum Ratings: Parameter Sy mbol Value Un min max Control Voltage Range Vcntrl -5 5 V RF Input Power Pin W Junction Temperature @ 30dbm input and 25°C Tj 50 °C Storage Temperature Tstg - 55 150 °C 3 2 it Exceeding any one or combination of these max ratings may cause permanent damage Parameter Symbol Test Condition min typ max Unit Insertion Loss RFC-RF1, RFC- RF2 ILRF 0.5-1.0GHz 1.0-2.0GHz 0.3 0.4 0.45 0.6 dB Isolation RF1-RF2 ISOL 0.5-1.0GHz 1.0-2.0GHz dB VSWR* (all ports) VSWR DC-2.5GHz 1.3:1 Gate Leakage IL 0.1 mA Trise /Tfall (10% RF to 90%RF) 10 nS Ton /Toff (50% CNTRL - 90%/10%RF) 20 nS Output Power for 0.1 dB compression P0.1dB DC-2.5GHz 26 dBm Output Power for 1 dB compression P1 DC-2.5GHz 30 dBm Intermodulation Intercept Point IP3 Pin=25dBm Freq.=1.0GHz 56 dBm *VSWR defined for insertion loss state only ** Performance optimized for 800 MHz to 2GHz operation with 100pF external blocking capacitors in all RF paths Parameter min typ m ax Unit Logic Level Low (State 0) 0 - 0.2 V Locig Level High (State 1) 2.5 - 5 V For further information, please visit www.triquint.com pg. 2/7 Ver 5; December 16th, 2003

PIN Assignments & Functional Block Diagram RFC RF1 RF2 GND *External DC blocking capacitors required; 100pF on pins 1,3 & 5. Pin Assignments: Truth Table: PIN Symbol Abbreviation Description

1 RF OUTPUT 1 RF1 RF OUTPUT

2 GND GND Circuit common and DC return

3 RF OUTPUT 2 RF2 RF OUTPUT

4 V_CONTROL 2 V2 RF OUTPUT 2 control

5 RF COMMON RFC Common RF port

6 V_CONTROL 1 V1 RF OUTPUT 1 control

0V 3V RFC – RF1 3V 0V RFC – RF2 For further information, please visit www.triquint.com pg. 3/7 Ver 5; December 16th, 2003

Typical Performance: (All Ports connected to 50ohms, Pin=0dBm, Vcntrl=3V unless otherwise specified, 100pF blocking capacitors) Optimized performance can be achieved <0.5GHz by increasing blocking capacitor to >100pF Optimized performance can be achieved >2.0GHz by decreasing blocking capacitor to <100pF Insertion Loss Versus Frequency -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0.5 1 1.5 2 2.5 Frequency (GHz) Insertion Loss (dB) Isolation versus Frequency -50 -40 -30 -20 -10 0 0.5 1 1.5 2 2.5 Frequency (GHz) Isolation (dB) Insertion Loss versus Frequency and Temperature -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 00 .5 11 .5 22 .5 Frequency (GHz) Insertion Los s (dB) -3 0 d egC +25 degC +85 degC Input VSWR versus Frequency -50 -40 -30 -20 -10 00 .5 1 1.5 22 .5 Frequency (GHz) WR VS Insertion Loss Versus Input Power -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 15 20 25 30 Input Power (dBm) Insertion Loss (dB) For further information, please visit www.triquint.com pg. 4/7 Ver 5; December 16th, 2003

Applications Information: Package Outline – SC-70 Recommended SC-70 Solder Footprint For further information, please visit www.triquint.com pg. 5/7 Ver 5; December 16th, 2003

Board Size 0.75” x 1.75” Board Thickness 0.047”, Board Material FR4 Multi-Layer DC connector (AMP 5 pin ) RFC RF1 RF2 SMA RF connector, 3 places (Johnson Components 142-0711-881)* *(All Ports connected to 50ohms, Pin=0dBm, Vcntrl=3V unless otherwise specified, 100pF blocking capacitors) Optimized performance can be achieved <0.5GHz by increasing blocking capacitor to >100pF Optimized performance can be achieved >2.0GHz by decreasing blocking capacitor to <100pF 100pF 0402 SMT capacitor, 3 places (Murata GRP1555C7H100JZ01 or equivalent ) 210R 210R For further information, please visit www.triquint.com pg. 6/7 Ver 5; December 16th, 2003

For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Tel: (503) 615-9000 Email: info_wireless@tqs.com Fax: (503) 615-8902 For technical questions and additional information on specific applications: Email: info_wireless@tqs.com The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright © 2003 TriQuint Semiconductor, Inc. All rights reserved. Revision 5-, December 16, 2003 Part Marking: Part Orientation on Reel: Ordering Information: Type Marking Package CSH210R 10R SC-70 ESD: Electrostatic discharge sensitive device: Observe handling Precautions! For additional information and latest specifications, see our website: www.triquint.com pg. 7/7