CSAC4.00MGC-TC

CSAC4.00MGC-TC MURATA | Alldatasheet

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Technical content

P16E.pdf Jul.15,2011 o Part Numbering !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. qProduct ID wFrequency/Capacitance eStructure/Size tDesign oPackaging CERALOCKr (MHz) C S Ceramic Resonators G pp T/Vpp Xpp A T MHz with No capacitance built-in MHz with Built-in Capacitance LS C C C R /C E/C G C V C W Round Lead Type Cap Chip Type Small-cap Chip Type Monolithic Chip Type Small Monolithic Chip Type Thickness Shear mode Thickness Expander mode Thickness Expander mode (3rd overtone) Three-digit alphanumerics express "Individual Specification". Structure/Size -B 0 -A 0 -R 0 -R 1 Packaging Product ID Code Code Code iIndividual Specification * Code Frequency/Capacitance Design Individual Specification Code (Part N um ber) rNominal Center Frequency Expressed by four-digit alphanumerics. The unit is in hertz (Hz). Decimal point is expressed by capital letter "M ". With standard products, "iIndividual Specification" is omitted. Bulk Radial Taping H0=18mm Plastic Taping ø =180mm Plastic Taping ø =330mm yInitial Frequency Tolerance H DesignCode –0.5% –0.3% –0.2% –0.1% –0.07% uLoad Capacity DesignCode 5/6pF 10pF 15pF 22pF 30/33/39pF 47pF e C E w T r 16M 0 q C S pp indicates initial frequency tolerance and load capacity. Radial taping is applied to lead type and plastic taping to chip type. i * t V y u o -R 0

P16E.pdf Jul.15,2011 !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. Ceramic Resonators (CERALOCKr) MHz Chip Type -Tight Frequency Tolerance for Automotive- 4.5–0.1 4.1 max. 0.4 (ref.) 0.4–0.1 0.4–0.1 0.4–0.1 (3) (2) (1) 0.6–0.05 0.4 (ref.) 0.4 (ref.) 0.2–0.2 0.30–0.20 2.0–0.11.1–0.1 1.4 max. ∗: EIAJ Monthly Code (in mm) CSTCR_G15C 4.00-7.99MHz 3.2–0.15 1.3–0.15 0.50 (ref.) 0.50 (ref.) 0.50 (ref.) 3.0 max. 0.10–0.10 0.4–0.1 (1)(2)(3) 0.1–0.1 1.1 max. 0.4–0.1 0.70–0.10 0.4–0.1 0.4–0.1 (in mm) ∗: EIAJ Monthly Code CSTCE_G15C 8.00-13.99MHz 3.2–0.15 0.10–0.10 0.1–0.1 1.3–0.15 1.1 max. 0.4–0.1 0.5 (ref.) 0.5 (ref.) 0.9–0.1 3.0 max. 0.4–0.1 (1)(2)(3) 0.4–0.10.4–0.1 0.5 (ref.) (in mm) ∗: EIAJ Monthly Code CSTCE_V13C 14.00-20.00MHz Part Number Oscillating Frequency (MHz) Initial Tolerance Temperature Stability (%) Temperature Range (°C) CSTCR_G15C 4.00 to 7.99 –0.1% –0.13 -40 to 125 CSTCE_G15C 8.00 to 13.99 –0.1% –0.13 -40 to 125 CSTCE_V13C 14.00 to 20.00 –0.1% –0.13 -40 to 125 Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use. Chip type CERALOCK(R) with built-in load capacitors provides high accuracy in an extremely small package. MURATA's frequency adjustment and package technology expertise has enabled the development of the chip CERALOCK(R) with built-in load capacitors. This diverse series owes its development to MURATA's original mass production techniques and high reliability, and has achieved importance in the worldwide automotive market. n Features 1. The series are high accuracy resonators whose total tolerance is available for less than +-3,000ppm. 2. The series has high reliability and is available for a wide temperature range. 3. Oscillation circuits do not require external load capacitors. 4. The series is available for a wide frequency range. 5. The resonators are extremely small and have a low profile. 6. No adjustment is necessary for oscillation circuits. n Applications 1. Cluster panel and Control panel 2. Safety control (Anti-lock Brake System, Electronic Stability Control, Airbag, etc.) 3. Engine ECU, Electronic Power Steering, Immobilizer, etc. 4. Car Air conditioner, Power Window, Remote Keyless Entry system, etc. 5. Intelligent Transportation System (Lane Keeping System, Millimeter wave radar, etc.) 6. Battery control for hybrid cars

P16E.pdf Jul.15,2011 !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. n Oscillation Frequency Measuring Circuit VD D R f To Frequency C ounter 5pF 1M Ω R d C 1 C 2 (1) (3) (2) n Standard Land Pattern Dimensions CSTCR_G15C (* This Land Pattern is not common to CSTCR_G.) 2.6 0.4 1.5 1.5 1.10.4 0.41.1 Land Pattern (in m m ) CSTCE_G15C 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in m m ) CSTCE_V13C (* This Land Pattern is not common to CSTCE_V.) 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in m m ) n Oscillation Frequency Temperature Stability CSTCR_G15C -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 O scillating Frequency Shift (% ) +0.2 +0.1 -0.1 -0.2 Tem perature (°C ) CSTCE_G15C -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 O scillating Frequency Shift (% ) Tem perature (°C ) +0.2 +0.1 -0.1 -0.2 CSTCE_V13C -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 O scillating Frequency Shift (% ) +0.2 +0.1 -0.1 -0.2 Tem perature (°C )

P16E.pdf Jul.15,2011 A pplication C ircuits U tilization !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. n TMP92CD54IF (Toshiba) 16-bit Microcomputer H 1 0.1µF 74 72 L IC : TM P92C D 54IF Vcc3=3.3V C ER ALO C Kr C 1 C 2 C ER ALO C Kr: C STC E10M 0G 15C pp-R 0 C 1=33pF (Typ.) C 2=33pF (Typ.) H 2 Vcc5=5.0V V2V1 H 1: 36, 68, 86 H 2: 2, 4, 15, 40, 50, 61, 75 n MB90F387 (Fujitsu) 16-bit Microcomputer H 0.1µF

2827 L26

IC : M B90F387 Vcc=5.0V C ER ALO C Kr C 1 C 2 C ER ALO C Kr: C STC E8M 00G 15C pp-R 0 C 1=33pF (Typ.) C 2=33pF (Typ.) V2V1 H : 1, 2, 21, 22, 24 L: 20, 23, 25, 48 n MC68HC908AZ60AVFU (Freescale) 8-bit Microcomputer 59 58 G N D EVALU ATIO N BO AR D IC : M C 68H C 908AZ60AVFU Vdd=5.0V C ER ALO C Kr: C STC E16M 0V13C pp-R 0 C 1=15pF (Typ.) C 2=15pF (Typ.) C ER ALO C Kr C 1 C 2 V2V1 1M Ω n ST72F561 (HS) (ST Microelectronics) 8-bit Microcomputer H 60 1 2 L IC : ST72F561 (H S) Vdd=5.0V H : 9, 25, 41, 57, 58 L: 8, 24, 40, 55, 56 C ER ALO C Kr C 1 C 2 C ER ALO C Kr: C STC E8M 00G 15App-R 0 C 1=33pF (Typ.) C 2=33pF (Typ.) V2V1 n µPD70F3283YGC (Renesas) 32-bit Microcomputer H 14 12 13 L10 4.7µF IC : µPD 70F3283YG C Vdd=3.3V 10kΩ C ER ALO C Kr C 1 C 2 C ER ALO C Kr: C STC E10M 0G 15C pp-R 0 C 1=33pF (Typ.) C 2=33pF (Typ.) V2V1 n M30842MCT-XXXGP (Renesas) 16-bit Microcomputer H 19 22 20 L IC : M 30842M C T-XXXG P (H igh*) H : 23, 24, 37, 39, 59, 74, 91, 118, 122, 132, 142, 143 110~113, 120, 121, 130, 140C ER ALO C Kr C 1 C 2 C ER ALO C Kr: C STC E8M 00G 15C pp-R 0 C 1=33pF (Typ.) C 2=33pF (Typ.) V2V1 Vcc=5.0V *H igh: XIN -XO U T D rive C apacity Select Bit

P16E.pdf Jul.15,2011 !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. Ceramic Resonators (CERALOCKr) M H z C hip Type -Standard Frequency Tolerance for A utom otive- 0.45 (R ef.) 1.2±0.2 6.6 m ax. (3) (2) (1) 0.3±0.3 0.5±0.05 7.2±0.2 3.0±0.2t 0.45±0.3 ∗ : EIAJ code t : 1.75–0.05 (2.00— 2.99M H z) t : 1.55–0.05 (3.00M H z— ) 1.4±0.2 1.2±0.2 0.45 (R ef.) 0.45 (R ef.) 2.1 m ax. (in m m ) CSTCC_G_A 2.00-3.99MHz 4.5±0.1 4.1 m ax. 0.8±0.1 0.8±0.1 0.8±0.1 0.4±0.05 0.2±0.2 0.3±0.2 2.0±0.1 1.4 m ax. (2) (1)(3) 1.15±0.05 ∗ : EIAJ M onthly C ode (in m m ) CSTCR_G_B 4.00-7.99MHz 3.2–0.15 1.3–0.15 0.50 (ref.) 0.50 (ref.) 0.50 (ref.) 3.0 m ax. 0.10–0.10 0.4–0.1 (1)(2)(3) 0.1–0.1 1.1 m ax. 0.4–0.1 0.70–0.10 0.4–0.1 0.4–0.1 (in m m ) CSTCE_G_A 8.00-13.99MHz 3.2–0.15 0.10–0.10 0.1–0.1 1.3–0.15 1.1 m ax. 0.4–0.1 0.5 (ref.) 0.5 (ref.) 0.9–0.1 3.0 m ax. 0.4–0.1 (1)(2)(3) 0.4–0.10.4–0.1 0.5 (ref.) (in m m ) ∗: EIAJ M onthly C ode CSTCE_V_C 14.00-20.00MHz M ∗ 3.7–0.2 3.1–0.2 1.3–0.1 (0.5) (3) 0.4–0.2 0.4–0.20.5–0.2 (0.5) (1) (0.5) (2) 1.6–0.2 1.85–0.3 1.6–0.2 Term inals (1) and (3) are interchangeable. Term inal (2) should be soldered only to fix the resonator onto PC B Term inal (2) should be electrically floating so it cannot be connected anyw here. (in m m ) Thickness varies w ith frequency. *: EIAJ M onthly C ode CSACV_X_Q 20.01-70.00MHz Continued on the following page. C hip type C ER ALO C K(R ) w ith built-in load capacitors provides high accuracy in an extrem ely sm all package. M U R ATA's frequency adjustm ent and package technology expertise has enabled the developm ent of the chip C ER ALO C K(R ) w ith built-in load capacitors. This diverse series ow es its developm ent to M U R ATA's original m ass production techniques and high reliability, and has achieved im portance in the w orldw ide autom otive m arket. n Features 1. The series has high reliability and is available for a w ide tem perature range. 2. O scillation circuits do not require external load capacitors. 3. The series is available in a w ide frequency range. 4. The resonators are extrem ely sm all and have a low profile. 5. N o adjustm ent is necessary for oscillation circuits. n Applications 1. C luster panel and C ontrol panel 2. Safety control (Anti-lock Brake System , Electronic Stability C ontrol, Airbag, etc.) 3. Engine EC U , Electronic Pow er Steering, Im m obilizer, etc. 4. C ar Air conditioner, Pow er W indow , R em ote Keyless Entry system , etc. 5. Electronic Toll C ollection system , C ar N avigation, etc.

P16E.pdf Jul.15,2011 !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. Continued from the preceding page. M ∗ 3.7–0.2 3.1–0.2 1.3–0.1 (0.7) (3) 0.4–0.2 0.4–0.20.5–0.2 (0.7) (1) (0.9) (2) 1.6–0.2 1.85–0.3 1.6–0.2 (in m m ) Thickness varies w ith frequency and built-in capacitance. *: EIAJ code CSTCV_X_Q 20.01-70.00MHz Part Number Oscillating Frequency (MHz) Initial Tolerance Temperature Stability (%) Temperature Range (°C) C STC C _G _A 2.00 to 3.99 –0.5% –0.4 C STC R _G _B 4.00 to 7.99 –0.5% –0.15 -40 to 125 C STC E_G _A 8.00 to 13.99 –0.5% –0.2 -40 to 125 C STC E_V_C 14.00 to 20.00 –0.5% –0.15 -40 to 125 C SA C V_X_Q 20.01 to 70.00 –0.5% –0.3 -40 to 125 C STC V_X_Q 20.01 to 70.00 –0.5% –0.3 -40 to 125 Irregular or stop oscillation m ay occur under unm atched circuit conditions. Please check the actual conditions prior to use. n Oscillation Frequency Measuring Circuit CSTCC_G_A R f R d VD D C 1 C 2 To Frequency C ounter (1) (3) (2) VD D R f To Frequency C ounter 5pF 1M Ω R d C 1 C 2 (1) (3) (2) CSACV_X_Q VD D R f C L1 C L2 To Frequency C ounter 22µF 0.01µF

P16E.pdf Jul.15,2011 !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. n Standard Land Pattern Dimensions CSTCC_G_A 3.8~4.4 1.2 1.2 2.5 2.5 1.4 1.2 1.2 Land Pattern (in m m ) CSTCR_G_B 2.6 1.6 0.8 0.4 1.5 1.5 0.4 0.4 0.8 0.80.70.7 Land Pattern (in m m ) CSTCE_G_A 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in m m ) CSTCE_V_C (* This Land Pattern is not common to CSTCE_V.) 0.4 1.90 ~ 2.10 0.4 0.40.8 Land Pattern 0.8 1.2 1.2 (in m m ) CSTCV_X_Q 1.6 1.6 1.0 3.1–0.2 1.0 0.50.5 Land Pattern (in m m ) CSACV_X_Q 1.6 1.6 1.0 3.1–0.2 1.0 0.50.5 Land Pattern (in m m )

P16E.pdf Jul.15,2011 !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. n Oscillation Frequency Temperature Stability CSTCC_G_A -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 O scillating Frequency Shift (% ) Tem perature (°C ) +0.2 +0.1 -0.1 -0.2 CSTCR_G_B -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 O scillating Frequency Shift (% ) +0.2 +0.1 -0.1 -0.2 Tem perature (°C ) CSTCE_G_A -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 O scillating Frequency Shift (% ) Tem perature (°C ) +0.2 +0.1 -0.1 -0.2 CSTCE_V_C -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 O scillating Frequency Shift (% ) +0.2 +0.1 -0.1 -0.2 Tem perature (°C ) CSTCV_X_Q -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 O scillating Frequency Shift (% ) Tem perature (°C ) +0.2 +0.1 -0.1 -0.2 CSACV_X_Q -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 O scillating Frequency Shift (% ) Tem perature (°C ) +0.2 +0.1 -0.1 -0.2

P16E.pdf Jul.15,2011 A pplication C ircuits U tilization !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. n µPD78F9222MC-5A4 (Renesas) 8-bit Microcomputer H 2 3 10kΩ IC : µPD 78F9222M C -5A4 Vdd=5.0V H : 5, 20 L: 1 C ER ALO C Kr C 1 C 2 C ER ALO C Kr: C STC R 6M 00G 55B-R 0 C 1=39pF (Typ.) C 2=39pF (Typ.) V'dd=7.0V V2V1 n M30260F8AGP (Renesas) 16-bit Microcomputer H 7 23 24 L IC : M 30260F8AG P (H igh*) Vcc=5.0V H : 11, 46, 47, 48 L: 4, 9, 44 *H igh: XIN -XO U T D rive C apacity Select Bit C ER ALO C Kr C 1 C 2 C ER ALO C Kr: C STC E10M 0G 55A-R 0 C 1=33pF (Typ.) C 2=33pF (Typ.) V2V1 n MB90F347D (Fujitsu) 16-bit Microcomputer H 93 92 L IC : M B90F347D Vcc=5.0V C ER ALO C Kr C 1 C 2 C ER ALO C Kr: C STC E8M 00G 55A-R 0 C 1=33pF (Typ.) C 2=33pF (Typ.) V2V1 H : 15, 32, 65, 90 L: 16, 35, 44, 66, 91 n MC68HC908AZ60AVFU (Freescale) 8-bit Microcomputer 59 58 G N D EVALU ATIO N BO AR D IC : M C 68H C 908AZ60AVFU Vdd=5.0V C ER ALO C Kr: C STC E16M 0V53C -R 0 C 1=15pF (Typ.) C 2=15pF (Typ.) C ER ALO C Kr C 1 C 2 V2V1 1M Ω n ST72F324J6T3 (MS) (ST Microelectronics) 8-bit Microcomputer H 42 41 L IC : ST72F324J6T3 (M S) Vdd=5.0V C ER ALO C Kr C 1 C 2 C ER ALO C Kr: C STC R 4M 00G 55B-R 0 C 1=39pF (Typ.) C 2=39pF (Typ.) V2V1 H : 13, 21, 32, 43 L: 14, 22, 33, 39, 40 n PIC12F675-I/P (HS) (Microchip) 8-bit Microcomputer 2 3 L IC : PIC 12F675-I/P(H S) Vdd=5.0V C ER ALO C Kr: C STC E8M 00G 52A-R 0 C 1=10pF (Typ.) C 2=10pF (Typ.) C ER ALO C Kr C 1 C 2 V2V1 1M Ω H H : 1 L: 4, 8

P16E.pdf Jul.15,2011 Please m ount com ponent on a circuit board by re-flow soldering. Flow soldering is not acceptable. 1. Soldering (1) R e-flow soldering R ecom m endable Flux and Solder Be com pelled to m ount com ponent by using soldering iron, please do not directly touch the com ponent w ith soldering iron. The term inals of com ponent or electrical characteristics m ay be dam aged if excess therm al stress is applied. (2) Soldering w ith Iron Please m ake the solder volum e less than the height of the substrate. W hen exceeding the substrate, the dam age of adhesive for sealing betw een the m etal cap and the substrate m ay occur. (3) Solder Volum e D o not reuse rem oved com ponent from a circuit board after soldering. (4) etc. The com ponent is recom m ended w ith placem ent m achines w ith em ploy optical placem ent capabilities. The com ponent m ight be resulted in dam age by excessive m echanical force. Please m ake sure that you have evaluated by using placem ent m achines before going into m ass production. D o not use placem ent m achines w hich utilize m echanical positioning. Please contact M urata for details beforehand. (5) C ondition for Placem ent M achines 150 180 220 245 260 G radual C ooling Peak Pre-heating (150 to 180°C ) H eating (220°C m in.) 60 to 120s 30 to 60s Tem perature (°C ) Flux Solder Please use rosin based flux, but do not use water soluble flux. R ecom m endable Soldering Profile Pre-heating Heating Peak Temperature 150 to 180°C Please use solder (Sn-3.0Ag-0.5Cu) under the following condition. Standard thickness of soldering paste: 0.10 to 0.15mm 220°C min. upper limit: 260°C lower limit: 245°C 60 to 120s 30 to 60s 1s max. 5s max. Tem perature shall be m easured on the surface of com ponent. R ecom m endable Soldering w ith Iron Heating of the soldering iron Watt Shape of the soldering iron 350°C max. 30W max. ø 3mm max. 5s max. at one terminal Sn-3.0Ag-0.5Cu Soldering Time Solder Continued on the following page. H C FC , Isopropanol, Tap w ater, D em ineralized w ater, C leanthrough750H , Pine alpha 100S, Techno care FR W 2. Wash (1) C leaning Solvents n Soldering and Mounting (CSTCC/CSTCR/CSTCE_V/CSTCE_G Series) N otice for A utom otive !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

P16E.pdf Jul.15,2011 C onform al coating of the com ponent is acceptable. H ow ever, the resin m aterial, curing tem perature, and other process conditions should be evaluated to confirm stable electrical characteristics are m aintained. 3. Coating Continued from the preceding page. dTV60°C (dT=C om ponent-solvent) *1 ex. In case the com ponent at +90°C im m erses into cleaning solvent at +60°C , then dT=30°C . (2) Tem perature D ifference : dT *1 5 m inutes m ax. by air blow at +80°C m ax. (4) D rying (a) Total w ashing tim e should be w ithin 10 m inutes. (b) The com ponent m ay be dam aged if it is w ashed w ith chlorine, petroleum , or alkali cleaning solvent. (5) O thers (a) U ltrasonic W ash 1 m inute m ax. in above solvent at +60°C m ax. (Frequency: 28kH z, O utput: 20W /l) (b) Im m ersion W ash 5 m inutes m ax. in above solvent at +60°C m ax. (c) Show er or R inse W ash 5 m inutes m ax. in above solvent at +60°C m ax. (3) C onditions N otice for A utom otive !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

P16E.pdf Jul.15,2011 Please m ount com ponent on a circuit board by re-flow soldering. Flow soldering is not acceptable. 1. Soldering (1) R e-flow soldering R ecom m endable Flux and Solder Be com pelled to m ount com ponent by using soldering iron, please do not directly touch the com ponent w ith soldering iron. The term inals of com ponent or electrical characteristics m ay be dam aged if excess therm al stress is applied. (2) Soldering w ith Iron D o not reuse rem oved com ponent from a circuit board after soldering. (3) etc. The com ponent is recom m ended w ith placem ent m achines w ith em ploy optical placem ent capabilities. The com ponent m ight be resulted in dam age by excessive m echanical force. Please m ake sure that you have evaluated by using placem ent m achines before going into m ass production. D o not use placem ent m achines w hich utilize m echanical positioning. Please contact M urata for details beforehand. (4) C ondition for Placem ent M achines 150 180 220 245 260 G radual C ooling Peak Pre-heating (150 to 180°C ) H eating (220°C m in.) 60 to 120s 30 to 60s Tem perature (°C ) Flux Solder Please use rosin based flux, but do not use water soluble flux. R ecom m endable Soldering Profile Pre-heating Heating Peak Temperature 150 to 180°C Please use solder (Sn-3.0Ag-0.5Cu) under the following condition. Standard thickness of soldering paste: 0.10 to 0.15mm 220°C min. upper limit: 260°C lower limit: 245°C 60 to 120s 30 to 60s 1s max. 5s max. Tem perature shall be m easured on the surface of com ponent. R ecom m endable Soldering w ith Iron Heating of the soldering iron Watt Shape of the soldering iron 350°C max. 30W max. ø 3mm max. 5s max. at one terminal Sn-3.0Ag-0.5Cu Soldering Time Solder Continued on the following page. H C FC , Isopropanol, Tap w ater, D em ineralized w ater, C leanthrough750H , Pine alpha 100S, Techno care FR W 2. Wash (1) C leaning Solvents dTV60°C (dT=C om ponent-solvent) *1 ex. In case the com ponent at +90°C im m erses into cleaning solvent at +60°C , then dT=30°C . (2) Tem perature D ifference : dT *1 n Soldering and Mounting (CSTCV/CSACV Series) N otice for A utom otive !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

P16E.pdf Jul.15,2011 C onform al coating of the com ponent is acceptable. H ow ever, the resin m aterial, curing tem perature, and other process conditions should be evaluated to confirm stable electrical characteristics are m aintained. 3. Coating Continued from the preceding page. 5 m inutes m ax. by air blow at +80°C m ax. (4) D rying (a) Total w ashing tim e should be w ithin 10 m inutes. (b) The com ponent m ay be dam aged if it is w ashed w ith chlorine, petroleum , or alkali cleaning solvent. (5) O thers (a) U ltrasonic W ash 1 m inute m ax. in above solvent at +60°C m ax. (Frequency: 28kH z, O utput: 20W /l) (b) Im m ersion W ash 5 m inutes m ax. in above solvent at +60°C m ax. (c) Show er or R inse W ash 5 m inutes m ax. in above solvent at +60°C m ax. (3) C onditions N otice for A utom otive !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

P16E.pdf Jul.15,2011 N otice for A utom otive !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. n Storage and Operating Conditions n Rating The com ponent m ay be dam aged if excessive m echanical stress is applied. n Handling "C ER ALO C K" m ay stop oscillating or oscillate irregularly under im proper circuit conditions. 1. Product Storage C ondition Please store the products in a room w here the tem perature/hum idity is stable, and avoid such places w here there are large tem perature changes. Please store the products under the follow ing conditions: Tem perature: -10 to + 40 degrees C H um idity: 15 to 85% R .H . 2. Expiration D ate on Storage Expiration date (Shelf life) of the products is six m onths after delivery under the conditions of a sealed and unopened package. Please use the products w ithin six m onths after delivery. If you store the products for a long tim e (m ore than six m onths), use carefully because the products m ay be degraded in solderability and/or rusty. Please confirm solderability and characteristics for the products regularly. 3. N otice on Product Storage (1) Please do not store the products in a chem ical atm osphere (Acids, Alkali, Bases, O rganic gas, Sulfides and so on), because the characteristics m ay be reduced in quality, and/or be degraded in the solderability due to the storage in a chem ical atm osphere. (2) Please do not put the products directly on the floor w ithout anything under them to avoid dam p and/or dusty places. (3) Please do not store the products in places such as: in a dam p heated place, in a place w here direct sunlight com es in, in a place applying vibrations. (4) Please use the products im m ediately after the package is opened, because the characteristics m ay be reduced in quality, and/or be degraded in the solderability due to storage under the poor conditions. (5) Please do not drop the products to avoid cracking of ceram ic elem ents. 4. O thers C onform al coating of the com ponent is acceptable. H ow ever, the resin m aterial, curing tem perature, and other process conditions should be evaluated to confirm that stable electrical characteristics are m aintained. Please be sure to consult w ith our sales representatives or engineers w henever and prior to using the products.

P16E.pdf Jul.15,2011 Packaging for A utom otive !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. n Minimum Quantity (in m m ) (pcs.) a b C STC C _G _A C STC R _G _B C STC R _G 15C C STC E_G _A C STC E_G 15C C STC E_V_C C STC E_V13C C STC V_X_Q C SA C V_X_Q Part Number Plastic Tape ø 180mm Plastic Tape ø 330mm Bulk Dimensions 2,000 3,000 3,000 3,000 3,000 3,000 3,000 2,000 2,000 6,000 9,000 9,000 9,000 9,000 9,000 9,000 6,000 6,000 500 500 500 500 500 500 500 500 500 a a a b b b b a a Trailer Leader Em pty C om ponents C over Film 2.0–0.5 160-190 13.0 +1.0 –1.5 17.0–1.0 (ø180 ) –1.5(ø180 ) ø13.0±0.2 400-560 Em pty 160 m in. Trailer 160-190 Em pty 160 m in. 400-560 C over Film Leader Em pty C om ponents ø13.0–0.2 2.0–0.5 13.0–1.0 c Dimensions of Reel The order quantity should be an integral multiple of the "Minimum Quantity" shown above. +1.0 09.0 n Dimensions of Taping CSTCR_G15C (in m m ) 4.0–0.1 2.0–0.05 (9.5) 4.0–0.1 ø1.5+0.1 ø1.5+0.1 12.0–0.2 1.25–0.05 (1.85 m ax.) 2.2–0.1 D irection of Feed (3˚) 10˚ C over Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300m m /m in. (3)(2)(1) 4.7–0.1 CSTCE_G15C (in m m ) 2.0–0.05 4.0–0.1 (3˚) 3.5–0.05 8.0–0.2 1.75–0.1 0.25–0.05 0.90–0.10 (1.30 m ax.) 10° (5.2) C over Film D irection of Feed The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300m m /m in. 4.0–0.1 ø1.5 -0.0 +0.1 ø1.0 -0.0 +0.2 1.50 -0.05 +0.10 (3)(2)(1) 3.40 -0.05 +0.10 Continued on the following page.

P16E.pdf Jul.15,2011 Packaging for A utom otive !N ote • Please read rating and !C AU TIO N (for storage, operating, rating, soldering, m ounting and handling) in this catalog to prevent sm oking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. Continued from the preceding page. n Dimensions of Taping CSTCE_V13C D im ensions of C arrier Tape (in m m ) 4.0–0.1 C over Film 4.0–0.1 2.0–0.05 8.0–0.2 ø1.5 +0.1 -0.0 ø1.0 +0.1 -0.0 +0.10 -0.05 3.5–0.05 1.75–0.1 3.45–0.1 D irection of Feed 0.25–0.05 (1.40 m ax.) 1.10–0.05(3˚) 1.50The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300m m /m in. 10˚ (5.2) (2)(3) (1) CSTCC_G_A (in m m ) 4.0–0.1 2.0–0.05 +0.3 -0.0 ø1.55–0.05 ø1.5 1.75–0.15.5–0.05 12.0–0.2 7.6–0.1 4.0–0.1 (9.5) 3.3–0.1The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300m m /m in. C over Film 10˚ (3˚) t1 ∗1 t2 ∗2 0.3–0.05 D irection of Feed (3) (1) Frequency R ange ∗1, ∗2: D im ensions vary w ith frequency range of C ER ALO C Kr. 2.00–2.99M H z 3.00–3.99M H z 1.85–0.05 2.45 m ax. 1.65–0.05 2.25 m ax. (2) t1 ∗1 t2 ∗2 CSTCR_G_B (in m m ) 4.0–0.1 2.0–0.05 (9.5) 4.0–0.1 (3)(2)(1) ø1.5+0.1 ø1.5+0.1 12.0–0.2 5.5–0.05 1.75–0.1 4.7–0.1 2.2–0.1 D irection of Feed (3˚) 10˚ C over Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300m m /m in. 0.3–0.05 1.25–0.05 (1.85 m ax.) CSTCE_G_A (in m m ) 2.0–0.05 4.0–0.1 (3˚) 3.5–0.05 8.0–0.2 1.75–0.1 0.25–0.05 0.90–0.10 (1.30 m ax.) 10° (5.2) C over Film D irection of Feed The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300m m /m in. 4.0–0.1 ø1.5 -0.0 +0.1 ø1.0 -0.0 +0.2 1.50 -0.05 +0.10 (3)(2)(1) 3.40 -0.05 +0.10 CSTCE_V_C D im ensions of C arrier Tape (in m m ) 4.0–0.1 C over Film 4.0–0.1 2.0–0.05 8.0–0.2 ø1.5 +0.1 -0.0 ø1.0 +0.1 -0.0 +0.10 -0.05 3.5–0.05 1.75–0.1 3.45–0.1 D irection of Feed 0.25–0.05 (1.40 m ax.) 1.10–0.05(3˚) 1.50The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300m m /m in. 10˚ (5.2) (2)(3) (1) CSTCV_X_Q (in m m ) Thickness of C ER ALO C Kr ∗1, ∗2: D im ensions vary w ith product thickness of C ER ALO C Kr. C over Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300m m /m in. D irection of Feed t1 ∗1 t2 ∗2 1.65–0.1 2.0 m ax. 1.45–0.1 1.8 m ax. 1.2–0.1 1.5 m ax. 4.0–0.1 10° 2.0–0.1 12.0–0.2 5.5–0.1 1.75–0.1 +0.1 –0.0ø1.5 +0.2 –0.0ø1.5 t1 ∗1 t2 ∗2 0.3–0.1 (9.5) (3˚) (3)(2)(1) 4.1–0.1 4.0–0.1 +0.1 –0.053.35 CSACV_X_Q (in m m ) Thickness of C ER ALO C Kr ∗1, ∗2: D im ensions vary w ith product thickness of C ER ALO C Kr. C over Film The cover film peel strength force 0.1 to 0.7N The cover film peel speed 300m m /m in. D irection of Feed t1 ∗1 t2 ∗2 1.65–0.1 2.0 m ax. 1.45–0.1 1.8 m ax. 1.2–0.1 1.5 m ax. 4.0–0.1 10° 2.0–0.1 12.0–0.2 5.5–0.1 1.75–0.1 +0.1 –0.0ø1.5 +0.2 –0.0ø1.5 t1 ∗1 t2 ∗2 0.3–0.1 (9.5) (3˚) (3)(2)(1) 4.1–0.1 4.0–0.1 +0.1 –0.053.35

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.P16E.pdf Jul.15,2011