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Technical content
Features
- High acoustic overload point (AOP, 124-dB SPL)
- High signal-to-noise ratio (63-dB SNR)
- Low variation in sensitivity (±1 dB)
- Low current consumption (55 A)
- Analog output
- Bottom-port LGA package
- 1.6- to 3.6-V supply
Description
The CS7331P is a low-profile analog MEMS microphone. It offers miniature dimensions and low-current consumption, making it ideal for always-on, always-listening use in space-constrained applications. The CS7331P incorporates Cirrus Logic ® proprietary CMOS/MEMS membrane technology, offering high reliability and high performance. The CS7331P is designed to withstand the high temperatures associated with automated flow solder assembly processes. The CS7331P is ideally suited to the Cirrus Logic SoundClear™ suite of audio processing algorithms, including speech recognition, voice trigger, and noise cancelation. The CS7331P is available in a 2.5 × 1.6 × 0.9-mm, bottom-port LGA package, with a 0.25-mm port diameter. It is ideal for portable applications such as noise-canceling earbuds, smartphones, wearables, and cameras. Biasing High Performance Amp CMOS ASICMEMS Transducer OUTPUT VDD GND CS7331P
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1 Pin Descriptions
1.1 LGA Pinout
Figure 1-1. Top-Down (Through-Package) View
1.2 Pin Descriptions
A description of each pin on the CS7331P is provided in Table 1-1. Table 1-1. Pin Descriptions Name Pin # I/O Description VDD 1 — Power supply OUTPUT 2 O Microphone analog output signal GND 3 — Ground GND 4 — Can be left floating (recommended), or connected to GND 1 2
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2 Typical Connection Diagram
Figure 2-1. Typical Connection Diagram The recommended connection of a CS7331P silicon microphone is shown in Fig. 2-1. A DC-blocking capacitor is required on the OUTPUT pin. The capacitor must be correctly selected as it affects the cut-off frequency of the output path. A low cut-off frequency is desirable to ensure there is no significant filtering of the audio bandwidth. The 3-dB cut-off frequency of the output path can be calculated using Eq. 2-1, where C is the output capacitance and R is the input resistance of the audio codec. Equation 2-1. Low-Pass Filter Calculation A typical recommended configuration uses a 1-F DC-blocking capacitor and a 20-k codec input impedance, which results in a 3-dB cut-off frequency of 10 Hz or less. Tantalum electrolytic capacitors are particularly suitable for the DC-blocking components as they offer high stability in a small package size. It is also recommended to place a 0.1-F decoupling capacitor close to the VDD pin of the CS7331P.
3 Characteristics and Specifications
Table 3-1. Parameter Definitions Parameter Definition Sensitivity A measure of the microphone output response to the acoustic pressure of a 1-kHz, 94 dB SPL (1 Pa RMS) sine wave. Total harmonic distortion (THD) The ratio of the RMS sum of the har monic distortion products in the specified bandwidth (see note) relative to the RMS amplitude of the fundamental (i.e., test frequency) output. Signal-to-noise ratio (SNR) A measure of the difference in level be tween the output response of a 1-kHz, 94 dB SPL sine wave and the idle noise output. Dynamic Range (DR) The ratio of the 10% THD microphone output level (in response to a sine wave input) and the idle noise output. Note: Unless otherwise specified, all performance measurements are specified with a 20-kHz, low-pass brick-wall filter and, where noted, an A-weighted filter. The low-pass filter removes out-of-band noise. Table 3-2. Recommended Operating Conditions Parameter Symbol Min Typ Max Units Analog supply range VDD 1.6 1.8 3.6 V Ground GND — 0 — V Operating temperature range T A –40 — +85 ºC Audio Codec OUTPUT VDD GND 1 F C INPUT 1.8 V 0.1 F CS7331P 3-dB filter cut-off frequency 1
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Table 3-3. Absolute Maximum Ratings Absolute maximum ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under electrical characteristics at the test conditions specified. Parameter Symbol Min Max Units Supply voltage 1 1.All voltages are measured with respect to GND. VDD –0.3 4.2 V Operating temperature range T A –40 +105 ºC Storage temperature prior to soldering T Stgp —3 0 º C Storage relative humidity prior to soldering RH Stgp —6 0 % Storage temperature after soldering T Stg –40 +105 ºC ESD-sensitive device. The CS7331P is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device. This device is qualified to current JEDEC ESD standards Table 3-4. Acoustic and Electrical Characteristics Test conditions (unless specified otherwise): GND = 0 V; voltages are with respect to ground; performance data taken with VDD = 1.8 V, RL = 10 k, CL = 100 pF, TA = +25ºC, 55 ±15% RH; 1 kHz test signal. Parameter 1 1.All performance measurements are specified with a 20-kHz, low-pass brick-wall filter and, where noted, an A-weighted filter. The low-pass filter removes out-of-band noise. Min Typ Max Units Directivity Omnidirectional — Polarity Positive sound pressure Positive output voltage — Sensitivity –39 –38 –37 dBV Acoustic overload THD < 10% — 124 — dB SPL THD 94 dB SPL 114 dB SPL 120 dB SPL 0.04 0.3 SNR A-weighted — 63 — dB DR A-weighted — 93 — dB Acoustic noise floor A-weighted — 31 — dB SPL Electrical noise floor A-weighted — –101 — dBV PSRR (with respect to VDD) 217 Hz sine wave, 100 mV (peak-peak) — 62 — dB PSR (with respect to VDD) 217 Hz squa re wave, 100 mV (peak-peak) — –88 — dBV Frequency response –3 dB low frequency +3 dB high frequency Hz kHz Frequency response flatness 200 Hz–7 kHz –1 — +1 dB Part-to-part phase matching 80–100 Hz 200 Hz ±10 Current consumption —5 56 0 A Output DC impedance — 200 400
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4 Typical Performance
Test conditions (unless specified otherwise): VDD = 1.8 V, GND = 0 V, RL = 10 k, CL = 100 pF; 1 kHz test signal. Figure 4-1. Sensitivity vs. Audio Frequency (20 Hz–20 kHz) Figure 4-2. Sensitivit y vs. Ultrasonic Frequency (20 kHz–100 kHz) Figure 4-3. Phase Response vs. Frequency (20 Hz–10 kHz) Figure 4-4. THD (%) vs. Input Sound Pressure Level (dB SPL) -15.0 -14.0 -13.0 -12.0 -11.0 -10.0 -9.0 -8.0 -7.0 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 10 100 1000 10000 100000 Sensitivity (dB) wrt. Sensitivity @ 1kHz Frequency (Hz) -15.0 -14.0 -13.0 -12.0 -11.0 -10.0 -9.0 -8.0 -7.0 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 20000 30000 40000 50000 60000 70000 80000 90000 100000 Sensitivity (dB) wrt. Sensitivity @ 1kHz Frequency (Hz) -20.0 -10.0 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 100.0 10 100 1000 10000 Phase (o) Frequency (Hz) 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 THD (%) Input Sound Pressure Level (dB SPL)
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5 Applications Information
Cirrus Logic provides a range of audio codecs incorporating an analog microphone input interface. These codecs support direct connections to silicon microphones such as the CS7331P. Further information on Cirrus Logic audio codecs is provided in the respective product data sheet, which is available from the Cirrus Logic website.
5.1 Important Assembly Guidelines
- Do not put a vacuum over the port hole of the micro phone. Placing a vacuum over the port hole can damage the device.
- Do not board wash the microphone after a reflow process. Board washing and the associated cleaning agents can damage the device.
- Do not expose to ultrasonic cleaning methods.
- Do not use a vapor phase reflow proc ess. The vapor can damage the device.
- Please refer to application note WAN0273 MEMS Mic Assembly and Handling Guidelines for further assembly and handling guidelines. Figure 4-5. PSRR (dB) vs. Frequency (100 Hz–10 kHz) Figure 4-6. Sensitivity vs. Supply Voltage Figure 4-7. Current Consumption vs. Supply Voltage 40.0 42.0 44.0 46.0 48.0 50.0 52.0 54.0 56.0 58.0 60.0 62.0 64.0 66.0 68.0 70.0 100 1000 10000 PSRR (dB) Frequency (Hz) -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 Sensitivity (dB) wrt. Sensitivity @ 1.8V Supply Voltage (V) Current Consumption (uA) Supply Voltage(V)
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5.2 PCB Land Pattern and Paste Stencil
The recommended PCB Land Pattern and Paste Stencil Pattern for the CS7331P microphone are shown in Fig. 5-1 and Fig. 5-2 respectively. Note that no connection to Pin 4 should be made on the PCB. To avoid accidental connection to Pin 4, it is recommended to ensure there are no exposed tracks, vias, or copper areas beneath Pin 4. See also application note WAN0284 General Design Considerations for MEMS Microphones for further details of PCB footprint design. Full definition of the package dimensions is provided in Section 6. The recommended PCB Land Pattern is shown in Fig. 5-1. Figure 5-1. PCB Land Pattern, Top View The recommended PCB Paste Stencil Pattern is shown in Fig. 5-2. Figure 5-2. PCB Paste Stencil, Top View
6 Package Dimensions
7 Ordering Information
8 References
- WAN0273 MEMS Mic Assembly and Handling Guidelines
- WAN0284 General Design Considerations for MEMS Microphones
9 Revision History
Table 7-1. Ordering Information Product Description Package Halogen Free Pb Free Grade Temperature Range Container Order # CS7331P Miniature Bottom Port Analog MEMS Microphone LGA Yes Yes Commercial –40 to +85°C Tape and Reel 1 1.Reel quantity = 6,000 units. CS7331P-CAZR Table 9-1. Revision History Revision Changes MAR ‘17
- Current consumption and sensitivity performance plots added ( Fig. 4-6, Fig. 4-7). (0.600) (1.500) 1.600 1.340 (2.240)2.500 0.900 (0.230) (R0.200) (0.720) 0.440 2X (0.470) 0.830 0.800 0.250 0.050 ( 0.650) ( 1.150) (R0.150) 0.756 0.260 2X 1.340 2X (0.440) 0.100 C
0.150 CAB
Unless otherwise specified, dimensions/tolerances are in millimeters and tolerance is 0.100 Pick Area Side View Bottom View A B C
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