CMT03-120-RA-10 SUPERWORLD | Alldatasheet

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  1. PART NO. EXPRESSION : 2. CONFIGURATION & DIMENSIONS : 3. SCHEMATIC : PG. 1 Unit:m/m SUPERWORLD ELECTRONICS (S) PTE LTD A SUPERWORLD ELECTRONICS (S) PTE LTD 26.03.2014 Common mode filter (RoHS Compliant) CMT03 SERIES 0.85±0.05 (c)(b) (f) (e) C M T 0 3 - 9 0 0 - R A - 〖〖 (a) (d) (b) Dimension code (c) Impedance code : 900 = 90Ω (a) Series code (d) R : Reel (e) Current code (f) 10 : RoHS Compliant 11~99 : Internal controlled number NOTE : Specifications subject to change without notice. Please check our website for latest information. B 0.65±0.05 C 0.4±0.05 P 0.50±0.1 0.27±0.1 0.2 E 0.25~0.35 FG H 1 2 4. GENERAL SPECIFICATION : a) Storage Temp. : -40°C to +85°C b) Operating Temp. : -40°C to +85°C (Including self-generated heat) G EF H +0.05 -0. 1 CA B P

PG. 2 5. ELECTRICAL CHARACTERISTICS : CMT03-120-RA-□ □ Part Number Impedance ( Ω ) ( MHz ) Frequency Test SUPERWORLD ELECTRONICS (S) PTE LTDSUPERWORLD ELECTRONICS (S) PTE LTD Common mode filter (RoHS Compliant) Rated Voltage (Vdc) Max. 12±5Ω 100 130 2.5 Insulation ( MΩ ) Min. Resistance 100 DC Resistance Max. ( Ω ) Rated Current (mA) Max. 51 0 0 100 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 CMT03-470-RA-□ □ 47±20% 100 5.0 51 0 0 100 CMT03-900-RA-□ □ 90 ±20% 100 6.551 00100 CMT03 SERIES

FREQUENCY(MHz) 100 1000 10000IMPE DANCE(Ohm) MCF0806NF2-9 00T01 Common Mode Diff er en t ial Mod e 1 1 0 100 1000 10000 FREQUENCY(MHz) 100 1000 10000IMPEDANCE(Ohm) MCF0806NF2-4 70T01 Common Mode Dif fer en ti al Mode 1 1 0 100 1000 10000 FREQUENCY(MHz) 100 1000 10000IMPE DANCE( Ohm) MCF0806NF2-330T01 Common Mode Dif ferential Mode 1 1 0 100 1000 10000 FR EQ UENCY(MH z) 100 1000 10000IMPE DANCE(Ohm) MCF0806NF2-1 20T01 Co mmon Mo de Dif ferential Mode PG. 3 6. CHARACTERISTICS CURVES : SUPERWORLD ELECTRONICS (S) PTE LTDSUPERWORLD ELECTRONICS (S) PTE LTD Common mode filter (RoHS Compliant) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 CMT03-120-RA CMT03-330-RA CMT03-470-RA CMT03-900-RA CMT03 SERIES

PG. 4 SUPERWORLD ELECTRONICS (S) PTE LTD 7. RELIABILITY AND TEST CONDITION Solderability Vibration Reliability Test Test sample shall be immersed into molten solder under the conditions shown in Table 3 after Table 2 in Table 2. Within the specified tolerance PERFORMANCE Electrical Characteristics Test Rated Current DC Resistance Insulation Resistance Impedance (Z) ITEM Measuring equipment:4291A or its equivalent Measuring points: (1) to (3) or (2) to (4) Measuring jig: 16192A (or its equivalent) TEST CONDITION visually checked. Resist ance t o Test sample shall be immersed into molten solder after immersed into flux and preheated under the conditions shown in Table 4. After this, test samples shall be taken out and Rated Current < 1A ΔT 20 Max℃ Measuring Current: DC Current Measuring voltage: Rated voltage The speed for immersion and taking out shall be 25 mm/s. immersed into flux. After this, test samples shall be taken out and Table 3 test shall be conducted under the c onditions shown Test sample shall be soldered to test board and the Soldering Heat measured after kept at room temperature for 2 to 3 Table 4 Per table 1. Per table 1. Measuring points: (1) to (2) or (3) to (4) Appearance Commom Impedance c hange rate Insulation resist ance 100MΩ min Within±15% No remarkable Defect Vibraiton frequency Overall amplitude 1 cycle Time 10Hz to 55Hz range X Y Z 15min.(10 →55→10Hz) 1.52mm 3 hours each Test Cycles:12 Solder temperature Immersion time 245°C±3°C 4s±1s hours.(Note 1) The speed for immersion and taking out shall be 25mm/s. Preheating Resist ance t o Soldering Heat Immersion time 10s±0.5s 260°C±5°C 150°C, 3min. More than 95% of terminal electr ode shall be covered with fresh solder. Common mode filter (RoHS Compliant) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 Table 1 CMT03 SERIES

PG. 5 SUPERWORLD ELECTRONICS (S) PTE LTD 7. RELIABILITY AND TEST CONDITION Resistance to Humidity Thermal Shock temperature of 40°C±2°C and relative humidity of 90% to 95% for 500+24/-0 hours. Test board shall be kept in a thermo hygrostat at Ste p Normal temp -40±2 30±3 30±3 Temperature (°C) Times (min.) them measurement shall be conducted.(Note 1) temperature with a normal humidity for 2 to 2 hours After the test, keep the test sample at a normal PERFORMANCE Reliability Test ITEM TEST CONDITION High Temperature Load temperature of 85°C±2°C for 500+24/-0 hours while supplying (1) to (2) and (3) - (4) with rated current. then measurement shall be conducted.(Note 1) Life Test Table 5 High Temperature Bending Str ength Test board shall be kept in an atmos phere with temperature of 85°C±2°C for 500+24/-0 hours. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, Test board shall be kept in a thermostatic oven with After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours After the test, keep the test sample at a normal +8 5±2 4~5 44 ~ 5 Normal temp repeated 5 times. Steps 1 to 4 shown in Table 5 as one cycle shall be them measurement shall be conducted.(Note 1) temperature with a normal humidity for 2 to 3 hours, Life Test then measurement shall be conducted.(Note 1) Warp : 1mm(03) Testing board : Glass epoxy-resin substrate Thickness : 1. 6mm Per table 1. Per table 1. Per table 1. Per table 1. Appearance: No mechanical dam age. supplying (1) to (3) and (2) - (4) with rated Voltage Common mode filter (RoHS Compliant) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 CMT03 SERIES

PG. 6 8-2.2 Soldering Iron : 8-2.1 Lead Free Solder Re-flow : cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a) Preheat circuit and products to 150°C. b) 350°C tip temperature (max) c) Never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. Note : 8-2. Soldering e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 4-5 secs. d) 1.0mm tip diameter (max) Preheating TP(260°C /40s m ax . ) 60~180s 480s max. Reflow times: 3 times max TEMPERATURE ° C 150 200 217 Time(sec.) Wi thin4~5s Gradual CoolingOver 60s. Iron Soldering times :1 times max cooling 60~150s 20~40s Soldering Natural cooling TEMPERATURE ° C 150 350 Preheating Soldering Natural Re-flow soldering temperatures below 240 degrees, there will be unwitting risk If Use Wave soldering is there will be some risk. Note. 8. SOLDERIND AND MOUNTING : 8-1. Recommended PC Board Pattern mechanical stress when warping the board. the mechanical stress to prevent failure. Products shall be positioned in the sideway direction against PC board should be designed so that products can prevent damage from Fig.1 Fig.2 Common mode filter (RoHS Compliant) SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 0.25~0.35 0.25~0.35 0.5 0.25~0.35 CMT03 SERIES

PG. 7 may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume Figure 4 Recommendable Upper limit t 8-3. Solder Volume Minimum fillet height = soldering thickness + 25% product height Common mode filter (RoHS Compliant) SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 CMT03 SERIES

PG. 8 9-1. Reel Dimension 21±0.8 ØB(mm) 50 Min.178±2.0 ØA(mm) 13±0.2 ØC(mm) ØD(mm) 9. PACKAGING INFORMATION : D1:1±0.1 9-3. Packaging Quantity F:3.5±0.05 P2:2±0.05 P E:1.75±0.1 Po:4±0.1 Si ze W:8.0±0.1 Bo Section A- A KoAoA t A D:1.5+0.1 Ko(mm)Bo(mm) Ao(mm) P(mm) t(mm) Chip Size Chip / Reel Inner Box Middle Box Carton 9-2. Tape Dimension / 8mm(black anti-static electricity carrier tape) 500000 250000 10000 50000 Seri e s Common mode filter (RoHS Compliant) 2.0±0.5 E( mm) 10±1.5 W(mm) 2.5 Max. t(mm) 1.0 R(mm) SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 CMT03 SERIES

PG. 9 Base tape 9-4. Tearing Off Force Top cover tape 165° to 180° F The force for tearing off cover tape is 15 to 85 grams in the arrow direction under the following conditions. Tearing SpeedRoom HumidityRoom Temp. (°C) 5~35 (%) 45~85 Room atm 860~1060 (hPa) 300 (mm/min) Application Notice a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) Recommended products should be used within 12 months from the time of delivery. a) Temperature and humidity conditions: Less than 40°C and 60% RH. 2. Transportation : 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : Common mode filter (RoHS Compliant) SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.03.2014 CMT03 SERIES