CMBD2004XN3 CYSTEKEC | Alldatasheet

Document overview

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Technical content

Features

  • Fast switching speed
  • Low forward voltage drop
  • Small plastic SMD package Mechanical Data
  • Case : SOT-23, molded plastic
  • Terminals : Solderable per MIL-STD-202 Method 208
  • Weight : 0.008 grams(approx.) Pinning Outline Description Pin CMBD2004 CMBD2004A CMBD2004C CMBD2004S

1 A K1 A1 A1

2 NC K2 A2 K2

3 K A1,A2 K1,K2 K1,A1

(1) CMBD2004 (3)CMBD2004C (2)CMBD2004A (4)CMBD2004S Diode configuration and symbol Marking: Type Marking Code CMBD2004 N3 D53 CMBD2004AN3 DB8 CMBD2004CN3 DB7 CMBD2004SN3 DB6

CYStech Electronics Corp. Spec. No. : C335N3 Issued Date : 2003.05.30 Revised Date : Page No. : 2/4 CMBD2004/A/C/SN3 CYStek Product Specification Absolute Maximum Ratings(Ta=25℃, unless otherwise specified)

  • Maximum Temperatures
  • Maximum Power Dissipation
  • Maximum V oltages and Currents Note : Parts mounted on FR-4 board. For double diodes, Ptot is the total power dissipation of both diodes. Characteristics (Ta=25°C) Characteristic Symbol Condition Min. Max. Unit Reverse Breakdown V oltage V BR I R=100µA 300 - V VF(1) I F=20mA - 870 mV Forward V oltage (Note) VF(2) I F=100mA - 1000 mV IR(1) VR=240V ,Tj=25℃ - 100 nA Reverse Leakage Current (Note) IR(2) VR=240V ,Tj=150℃ 100 µA Diode Capacitance C D V R=0V , f=1MHz - 5 pF Reverse Recovery Time t rr IF=IR=30mA RL=100Ω measured at IR=3mA - 50 ns Notes: Pulse test, tp=380µs, duty cycle<2%.

CYStech Electronics Corp. Spec. No. : C335N3 Issued Date : 2003.05.30 Revised Date : Page No. : 3/4 CMBD2004/A/C/SN3 CYStek Product Specification Characteristic Curves Forward Characteristics 0.01 0.1 100 1000 012 Instantaneous Forward Voltage---V F(V) Instantaneous Forward Current---I F(mA) Reverse Leakage Current vs Junction Temperature 0.01 0.1 100 0 100 200 Junction Temperature---Tj(℃) Reverse Leakage Current---I R(μA) Power Derating Curve 100 150 200 250 300 350 400 0 50 100 150 200 Ambient Temperature---T A(℃) Power Dissipation---PD(mW)

CYStech Electronics Corp. Spec. No. : C335N3 Issued Date : 2003.05.30 Revised Date : Page No. : 4/4 CMBD2004/A/C/SN3 CYStek Product Specification SOT-23 Dimension

  • CMBD2004 N3 : Single Diode (Marking Code D53)
  • CMBD2004AN3 : Common Anode. (Marking Code DB8)
  • CMBD2004CN3 : Common Cathode. (Marking Code DB7)
  • CMBD2004SN3 : Series Connected. (Marking Code DB6) *: Typical H 0.0005 0.0040 0.013 0.10 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:
  • Lead: 42 Alloy; solder plating
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. H JKD A L GV C B S Marking: L4_ Diagram: 3-Lead SOT-23 Plastic Surface Mounted Package. CYStek Package Code: N3 DXX