CFT732-S SEOUL | Alldatasheet

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Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Specification CFT732-S Preliminary CUSTOMER ApprovalApprovalDrawn SSC

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) CFT732-S CFT732-S FeaturesDescription

  • Pb-free Reflow Soldering application
  • RoHS Compliant
  • 6 -Pin
  • White colored SMT package and diffused (milky color)
  • Suitable for all SMT assembly methods
  • ESD-withstand voltage : up to 1 kV (MIL-STD-883D)
  • High Reliability (silicone resin) This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS.

Applications

  • Indoor and outdoor displays
  • LCD Backlights etc.
  • R G B – displays
  • Automotive
  • Signage and Channel letter
  • Indicator

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 2. Absolute maximum ratings (Ta=25ºC) 252*3 100 Yellow ºC-40 ~ +100TstgStorage Temperature ºC-40 ~ +85ToprOperating Temperature 263*4 mW 114*3120*381*3 PdPower Dissipation V5VRReverse Voltage (per die) mA100100100IFMForward Peak Surge Current *2 mA303030IFForward Current BlueGreenRed Unit Value SymbolParameter *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 3. Electric & Optical characteristics (Ta=25ºC) lm/W -0.015- IF =20mA (per chip)ηop Red Optical Efficiency -0.01-Yellow -0.19-Green -0.006-Blue lm -1.7- IF =20mA (per chip)ΦV Red Luminance Flux *1 -1.0-Yellow -3.0-Green -0.9-Blue -23-Blue 465460455Blue -453- -400- Blue Blue deg.-110-IF =20mA (per die)2θ½R, G, B, YViewing Angle *3 -33-Green -14-Yellow nm -15- IF =20mA (per chip)∆λ Red Spectral Bandwidth 535527520Green 596590586Yellow nm 625623620 IF =20mA (per chip)λd Red Dominant Wavelength -518-Green -590-Yellow nm -632- IF =20mA (per chip)λP Red Peak Wavelength -1200-Green -370-Yellow mcd -700- IF =20mA (per chip)IV Red Luminance Intensity *1 µA1--VR=10V (per die)IRR, Y, G, BReverse Current 3.53.23.0G, B V 2.52.21.8IF =20mA (per chip)VF R, Y Forward Voltage UnitMaxTypMinConditionSymbolParameter *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 Please refer to CIE 1931 chromaticity diagram *3 2 ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 4. Optical characteristics Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) 10 0 Ye llo w50 Forward Current IFP [mA] F o rw ar d V o lta g e V F [ V ] Bl u e Gr e e n Re d Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 0 204 06 0 80 100 120 RED BLUE GREEN yellow Relative Luminosity (a.u.) Forward Current IFP [mA]

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 4. Optical characteristics Forward Current Derating Curve : 1 Chip on 0 204 0 608 0 100 Forward Current IF[mA] Red, Yellow, Green, Blue Ambient Temperature Ta[ o Forward Current Derating Curve : 4 Chip on 0 204 0 608 0 100 Forward Current IF[mA] Red, Yellow, Green, Blue Ambient Temperature Ta[ o

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 4. Optical characteristics Spectrum 400 500 600 700 0.0 0.2 0.4 0.6 0.8 1.0 RED YELLOW GREEN BLUE Intensity Irel [a.u.] Wavelength λ[nm] 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 Intensity Irel [a.u.] Wavelength λ[nm] (TA=25℃, IF=20mA) (TA=25℃, IF=20mA/chip)

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 4. Optical characteristics Radiation Diagram (Ta=25 OC ) 120 150 180 y-axis x-axis

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 5. Color & Binning (Standard Binning) 21BA YXYXYXYXYXYX BlueGreenYellowRed 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515 520525 530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620630 830 Yellow BA Blue Red y x Green

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 5. Color & Binning (Special Binning ) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 y x - Color Rank : a, b, c, d, e, f, g, h (8 BIN) - 9 Bin, Total Cell Size = x 0.088 , y 0.091 - 1 Bin, Cell Size = x 0.0341 , y 0.0217 -I F Condition => 10mA for Red / 20mA for Yellow / 20mA for Green / 20mA for Blue - Color Coordinates (typ.): x 0.237 , y 0.217 ◈ Target of Color : Bluish White (Cool White)

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 6. Colors of CFT732-S (Standard Color) Color NameSymbol Bulish White Greenish Blue Purple Greenish Yellow Bulish White Purpleish Blue Yellowish Green Bluish Green Redish Orange Violet Greenish Yellow Yellow Blue Green Red 0.227 0.281 RGBY15 0.212 0.188 GBY14 0.132 0.304 RBY13 0.485 0.466 RGY12 0.210 0.258 RGB11 0.084 0.193 BY10 0.625 0.289 GY9 0.190 0.150 GB8 0.340 0.660 RY7 0.102 0.279 RB6 0.496 0.445 RG5 0.437 0.562 Y4 0.040 0.146 B3 0.712 0.164 G2 0.300 0.700 R1 YX Color Coordinate(Typ.)Color (20mA per Chip) Step

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 6. Colors of CFT732-S (Standard Color) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515 520 525 530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620 630 830 14 15 y x

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 6. Colors of CFT732-S (Special Color ) 202020100.218 0.243 UndefinedBulish White1 076200.427 0.547 2000KCandle Light5 21420200.412 0.449 2800KWarm White4 42015200.387 0.385 4000KNatural White3 102020150.298 0.303 7400KPure White2 202020200.22560.277828000KBalance White0 BGYRYX Balance Current IFbal[mA] Color Coordinates (Typ.)CCTFull White ColorStep 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 BLUISH 7400K 4000K 2800K 2000K Balance white y x

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 7.Outline Dimension * MATERIALS Circuit Diagram Recommended Solder Pad Anode Green Cathode Anode Blue Cathode Yellow Cathode Red Cathode ( Tolerance: ±0.2, Unit: mm ) 6 54 321 Package Outlines Package Marking Front View Right View Rear View Ag Plating Copper AlloyElectrodes Silicone Resin (Diffused) Encapsulating Resin Heat-Resistant PolymerPackage MATERIALSPARTS

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 8. Recommend Circuit Circuit Diagram Anode Green Cathode Anode Blue Cathode Yellow Cathode Red Cathode Circuit (Led Dot Matrix - Dynamic Drive) Anode Green Cathode Anode Blue Cathode Yellow Cathode Red Cathode Anode Green Cathode Anode Blue Cathode Yellow Cathode Red Cathode Anode Green Cathode Anode Blue Cathode Yellow Cathode Red Cathode Anode Green Cathode Anode Blue Cathode Yellow Cathode Red Cathode S1 S2 S3 S4 Scan Line Data Line 1 2 3 6 5 4

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 9. Packing Package Marking ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 700pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00)

  • Reel Packing Structure ca b

1 SIDE

SIZE (mm) Outer Box Structure Material : Paper(SW3B(B)) TYPE a b c HUMIDITY INDICATOR Aluminum Vinyl Bag Reel DESI PAK RANK: PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX XXX XXXXXX SEOUL SEMICONDUCTOR CO., LTD. RANK: PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX XXX XXXXXX SEOUL SEMICONDUCTOR CO., LTD. RANK: PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX XXX XXXXXX SEOUL SEMICONDUCTOR CO., LTD. RoHS

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 10. Lot Number The lot number is composed of the following characters; CFT –First Part Name ○ – Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ – Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) # ~# – The number of the internal quality control PART NUMBER : CFT732-S XXX LOT NUMBER : CFT80426 01 512 SEOUL SEMICONDUCTOR CO., LTD. QUANTITY : 700

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 11. Soldering 10 sec. Max.Soldering time Condition 240℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 120~150℃Pre-heat Lead Solder 10 sec. Max.Soldering time Condition 260℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 150~200℃Pre-heat Lead Free Solder 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C1~5 C / sec. ooo o1~5 C / sec. Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. (1) Lead Solder (2) Lead-Free Solder Lead-frame Solder (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 12. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 13. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.