CEM3252 CET-MOS | Alldatasheet
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Technical content
N-Channel Enhancement Mode Field Effect Transistor CEM3252
FEATURES
30V, 7.5A, RDS(ON) = 28mW @VGS = 10V. RDS(ON) = 40mW @VGS = 4.5V. Super high dense cell design for extremely low RDS(ON). High power and current handing capability. Surface mount Package. ABSOLUTE MAXIMUM RATINGS TA = 25 C unless otherwise noted Parameter Symbol Limit Units Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous Drain Current-Pulsed a Maximum Power Dissipation VDS VGS ID PD IDM 2.5 7.5 ±20 V W A A V SO-8 Lead free product is acquired. http://www.cet-mos.com D D D D S S S G 1 2 3 4 8 7 6 5 Operating and Store Temperature Range TJ,Tstg -55 to 150 C Thermal Characteristics Thermal Resistance, Junction-to-Ambient b Parameter Symbol Limit Units C/W50RqJA Thermal Resistance, Junction-to-Case C/W25RqJC Details are subject to change without notice . Rev 3. 2011.Sep
Electrical Characteristics TA = 25 C unless otherwise noted Parameter Symbol Min Units Off Characteristics Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Body Leakage Current, Forward Gate Threshold Voltage Static Drain-Source On-Resistance BVDSS IDSS IGSSR IGSSF 2822 1.0 3.0 -100 100 mW V nA nA µA V Gate Body Leakage Current, Reverse On Characteristics Dynamic Characteristics d Input Capacitance Reverse Transfer Capacitance Output Capacitance Switching Characteristics d Turn-On Delay Time Turn-Off Fall Time Turn-Off Delay Time Turn-On Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Drain-Source Diode Characteristics and Maximun Ratings Drain-Source Diode Forward Current b Drain-Source Diode Forward Voltage c Test Condition VGS = 0V, ID = 250µA VGS(th) RDS(on) Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS VSD Typ Max VDS = 30V, VGS = 0V VGS = 20V, VDS = 0V VGS = -20V, VDS = 0V VGS = VDS, ID = 250µA VGS = 10V, ID = 7A VGS = 4.5V, ID = 3.5A VDD = 15V, ID = 7A, VGS = 10V, RGEN = 3W VDS = 15V, ID = 7A, VGS = 10V VDS = 15V, VGS = 0V, f = 1.0 MHz VGS = 0V, IS = 2.3A 575 135 105 13.8 1.4 3.2 2.3 1.2 4030 mW pF pF pF ns ns ns ns nC nC nC A V CEM3252 e.RqJA is the sum of junction-to-case-ambient thermal resistance where the case tmermal reference is defined as the solder mounting surface of the drain pins. RqJc is guaranteed by design while RqJA is determined by the user's board design 1. 50CW when mounted on a 1in 2 pad of 2 oz copper 2. 105CW when mounted on a 0.4in 2 pad of 2 oz copper 3. 125CW when mounted on a minimun pad Scale 1 : 1 on letter size paper f.Pulse Test : Pluse Width < 300us,Duty cycle <2% Notes : a.Repetitive Rating : Pulse width limited by maximum junction temperature. b.Surface Mounted on FR4 Board, t < 10 sec. c.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%. d.Guaranteed by design, not subject to production testing.