CEP03N100 CET-MOS | Alldatasheet
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N-Channel Enhancement Mode Field Effect Transistor
FEATURES
Super high dense cell design for extremely low RDS(ON). High power and current handing capability. ABSOLUTE MAXIMUM RATINGS Tc = 25 C unless otherwise noted Parameter Symbol Limit Units Drain-Source Voltage Gate-Source Voltage Drain Current-Pulsed a Maximum Power Dissipation @ TC = 25 C - Derate above 25 C VDS VGS ID PD IDM e 1000 1.1 166 13.2 3.3 ±30 V W A A V W/ C S G D G S D CEB SERIES TO-263(DD-PAK) S D G CEP SERIES TO-220 CEF SERIES TO-220F S D G Type RDS(ON) ID @VGS CEP03N100 CEF03N100 1000V 1000V 3.3A 3.3A d 10V 10V 0.33 13.2 d 3.3 d CEB03N100 1000V 6W 3.3A 10V TO-220/263 TO-220F http://www.cet-mos.com Rev 1. 2023.Jan Drain Current-Continuous @ TC = 25 C @ TC = 100 C A2.3 2.3 d VDSS@TJ max Pb-free lead plating ; RoHS compliant. Halogen Free. Operating and Store Temperature Range TJ,Tstg -55 to 175 C Thermal Characteristics Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Parameter Symbol Limit Units C/W C/W 62.5 0.9RqJC RqJA Single Pulsed Avalanche Energy g Single Pulsed Avalanche Current g EAS IAS 112 mJ A Details are subject to change without notice .
Electrical Characteristics Tc = 25 C unless otherwise noted Parameter Symbol Min Units Off Characteristics Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Body Leakage Current, Forward Gate Threshold Voltage Static Drain-Source On-Resistance BVDSS IDSS IGSSR IGSSF 64.8 3 4 -100 100 W V nA nA µA V Gate Body Leakage Current, Reverse On Characteristics b Dynamic Characteristics c Input Capacitance Reverse Transfer Capacitance Output Capacitance Switching Characteristics c Turn-On Delay Time Turn-Off Fall Time Turn-Off Delay Time Turn-On Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Drain-Source Diode Characteristics and Maximun Ratings Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage b Test Condition VGS = 0V, ID = 250µA VGS(th) RDS(on) Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS f VSD Typ Max 1000 VDS =1000V, VGS = 0V VGS = 30V, VDS = 0V VGS = -30V, VDS = 0V VGS = VDS, ID = 250µA VGS = 10V, ID = 1.5A VDD = 500V, ID =3A, VGS = 10V, RGEN = 10W VDS = 800V,ID = 1A, VGS = 10V VDS = 25V, VGS = 0V, f = 1.0 MHz VGS = 0V, IS = 3A 485 3.3 1.4 pF pF pF ns ns ns ns nC nC nC A V CEP03N100/CEB03N100 CEF03N100 Notes : a.Repetitive Rating : Pulse width limited by maximum junction temperature . b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2% . c.Guaranteed by design, not subject to production testing. d.Limited only by maximum temperature allowed . e.Pulse width limited by safe operating area . f.Full package IS(max) = 1.8A . g.L = 25mH, IAS = 3A, VDD = 50V, RG = 25W, Starting TJ = 25 C.
Figure 12. Normalized Thermal Transient Impedance Curve