CBTD16211 ICST | Alldatasheet

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/C0080 /C0115 /C0111/C0110/C0111 /C0115 CBTD16211 24-bit level shifting bus exchange switch with 12-bit output enables Product data 2001 Jun 13 INTEGRATED CIRCUITS

Philips Semiconductors Product data CBTD1621124-bit level shifting bus exchange switch with 12-bit output enables

22001 Jun 13 853-2260 26502

FEATURES

  • 5Ω switch connection between two ports
  • TTL compatible control input levels
  • Designed to be used in level shifting applications
  • Package options include shrink small outline (SSOP) and thin shrink small outline (TSSOP)
  • ESD protection exceeds 1000 V CDM per JESD22-C101
  • Latch-up testing is done to JESDEC Standard JESD78 which exceeds 100 mA

DESCRIPTION

The CBTD16211 provides 24 bits of high-speed TTL-compatible bus switching. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. A diode to VCC is integrated in the circuit to allow for level shifting between 5 V inputs and 3.3 V outputs. The device is organized as a dual 12-bit bus switch with separate output-enable (OE) inputs. It can be used as two 10-bit bus switches or as one 20-bit bus switch. When OE is low, the associated 10-bit bus switch is on, and port A is connected to port B. When OE is high, the switch is open, and a high-impedance state exists between the ports. The CBTD16211 is characterized for operation from –40 to +85 °C. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS Tamb = 25 °C; GND = 0 V TYPICAL UNIT tPLH tPHL Propagation delay An to Yn C L = 50 pF; VCC = 5 V 0.25 ns C IN Input capacitance VI = 0 V or VCC 4.3 pF C OUT Output capacitance Outputs disabled; VO = 0 V or VCC 6.9 pF ICC Total supply current Outputs disabled; VCC = 5.5 V 3.0 µA

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE ORDER CODE DWG NUMBER 56-Pin Plastic SSOP Type III –40 to +85 °C CBTD16211DL SOT371-1 56-Pin Plastic TSSOP Type II –40 to +85 °C CBTD16211DGG SOT364-1 FUNCTION TABLE INPUTS OUTPUTS 1OE 2OE 1A, 1B 2A, 2B L L 1A = 1B 2A = 2B L H 1A = 1B Z H L Z 2A = 2B H H Z Z H = High voltage level L = Low voltage level Z = High impedance “off” state LOGIC SYMBOL 1A1 1A12 2A1 2A12 1B1 1B12 2B1 2B12 SA00510 2OE 1OE

Philips Semiconductors Product data CBTD1621124-bit level shifting bus exchange switch with 12-bit output enables

2001 Jun 13 3

PIN NUMBER SYMBOL NAME AND FUNCTION

1 NC No internal connection

56, 55 1OE , 2OE Output enables 11, 12, 13, 14 1A1-1A12 Inputs 47, 46, 45, 44, 43, 421B1-1B12 Outputs 23, 24, 25, 26, 27, 282A1-2A12 Inputs 34, 33, 32, 31, 30, 292B1-2B12 Outputs 8, 19, 38, 49 GND Ground (0 V)

17 VCC Positive supply voltage

Philips Semiconductors Product data CBTD1621124-bit level shifting bus exchange switch with 12-bit output enables

2001 Jun 13 4

ABSOLUTE MAXIMUM RATINGS 1, 2 SYMBOL PARAMETER CONDITIONS RATING UNIT VCC DC supply voltage –0.5 to +7.0 V IIK DC input diode current VI < 0 –50 mA VI DC input voltage3 –0.5 to +7.0 V VOUT DC output voltage3 output in Off or High state –0.5 to +5.5 V IOUT DC output current output in Low state 128 mA Tstg Storage temperature range –65 to +150 °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMITS UNITSYMBOL PARAMETER Min Max UNIT VCC DC supply voltage 4.5 5.5 V VIH High-level input voltage 2.0 — V VIL Low-level Input voltage — 0.8 V Tamb Operating free-air temperature range –40 +85 °C DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Tamb = –40 to +85 °C UNIT Min Typ1 Max VIK Input clamp voltage VCC = 4.5 V; II = –18 mA — — –1.2 V VOH Output high pass voltage See Figure 1 — — V I Input leakage current VCC = 0 V; VI = 5.5 V — — 10 µAII Input leakage current VCC = 5.5 V; VI = GND or 5.5 V — — ±1 µA ICC Quiescent supply current VCC = 5.5 V; IO = 0, VI = VCC or GND; 1OE =2OE =GND — — 1.5 mA ΔICC Additional supply current per input pin2 VCC = 5.5 V, one input at 3.4 V, other inputs at VCC or GND — — 2.5 mA C I Control pins VI = 3 V or 0 — 4.5 — pF C I(OFF) Port OFF capacitance VO = 3 V or 0, OE = VCC — 8 — pF VCC = 4.5 V; V1 = 0 V; II = 64 mA — 5 7 ron3 VCC = 4.5 V; V1 = 0 V; II = 30 mA — 5 7 Ω VCC = 4.5 V; V1 = 2.4 V; II = –15 mA — 35 50 NOTES: 1. All typical values are at VCC = 5 V, Tamb = 25 °C. 2. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. 3. Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) terminals.

Philips Semiconductors Product data CBTD1621124-bit level shifting bus exchange switch with 12-bit output enables

2001 Jun 13 5

GND = 0 V; tR; CL = 50 pF SYMBOL PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5.0 V ±0.5 V UNIT Min Max tpd Propagation delay1 A or B B or A — 0.25 ns ten Output enable time to High and Low level OE A or B 1.5 8.5 ns tdis Output disable time from High and Low level OE A or B 1.5 7 ns NOTE: 1. This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical on-state resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance).

Philips Semiconductors Product data CBTD1621124-bit level shifting bus exchange switch with 12-bit output enables

2001 Jun 13 6

VM = 1.5 V, VIN = GND to 3.0 V INPUT 1.5 V OUTPUT tPLH tPHL SA00028 1.5 V 1.5 V 1.5 V 3 V 0 V VOH VOL Waveform 1. Input (An) to Output (Yn) Propagation Delays Output Control (Low-level enabling ) 1.5 V tPZH tPHZ VOH VOL tPZL tPLZ 3.5 V 0 V VOL + 0.3 V VOH – 0.3 V SA00029 1.5 V 1.5 V 1.5 V 0 V 3 V Output Waveform 1 S1 at 7 V (see Note) Note: Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. Output Waveform 2 S1 at Open (see Note) Waveform 2. 3-State Output Enable and Disable Times TEST CIRCUIT AND WAVEFORMS C L = 50 pF 500 Ω Load Circuit DEFINITIONS C L = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. TEST S1 tpd open tPLZ /tPZL 7 V tPHZ /tPZH open SA00012 500 ΩFrom Output Under Test 7 V Open GND

2001 Jun 13 7

Figure 1. VOH values (Vin = VCC )

Philips Semiconductors Product data CBTD1621124-bit level shifting bus exchange switch with 12-bit output enables

2001 Jun 13 8

SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm SOT371-1

Philips Semiconductors Product data CBTD1621124-bit level shifting bus exchange switch with 12-bit output enables

2001 Jun 13 9

TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1

Philips Semiconductors Product data CBTD1621124-bit level shifting bus exchange switch with 12-bit output enables

2001 Jun 13 10

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors

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P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381  Copyright Philips Electronics North America Corporation 2001 All rights reserved. Printed in U.S.A. Date of release: 06-01 Document order number: 9793 750 08482 /C0080 /C0115 /C0111/C0110/C0111 /C0115 Data sheet status[1] Objective data Preliminary data Product data Product status[2] Development Qualification Production Definitions This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Data sheet status [1] Please consult the most recently issued datasheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.