CAWT722-S SEOUL | Alldatasheet

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Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com Specification CAWT722-S CUSTOMER ApprovalApprovalDrawn SSC

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com

CONTENTS

  1. Feature & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Rank of CAWT722-S 7. Outline Dimension 8. Packing 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs 12. Reliability Test Item and Condition

SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com CAWT722-S CAWT722-S Description Features 사진 •W hite colored SMT package.

  • Material : InGaN/SiC
  • Encapsulating Resin : Silicon Resin
  • Suitable for all SMT assembly methods ; Suitable for all soldering methods
  • R oHS Compliant This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS.

Applications

  • Interior automotive
  • Office Automation, Electrical Appliances, Industrial Equipment

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 2. Absolute maximum ratings ºC-40 ~ +100TstgStorage Temperature ºC-40 ~ +85ToprOperating Temperature V5VRReverse Voltage (per die) mA100IFM *2Peak Forward Current mA90IFForward Current mW342PdPower Dissipation UnitValueSymbolParameter *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric & Optical characteristics -95-IF =60 mARaColor Rendering Index 0.4466-0.3408Y 0.4970-0.3545 IF =60 mA X Color Coordinate lm/W6857-IF =60 mAηopOptical Efficiency deg-120-IF =60 mA2θ½Viewing Angle *2 K4600-2500IF =60 mACCTColor Temperature lm13.111-IF =60 mAΦVLuminance Flux mcd55004500-IF =60 mAIVLuminance Intensity *1 µA10--VR=5V IRReverse Current (per die) V3.63.22.9IF =60 mAVFForward Voltage (per die) UnitMaxTypMinConditionSymbolParameter *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 4. Optical characteristics Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) Forward Voltage[V] Forward Current [mA] Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 0 15 304 56 07 5 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Relative Luminosity(a.u.) Forward Current IF[mA]

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 4. Optical characteristics Ambient Temperature vs. Allowable Forward Current (per die) -25 0 25 50 75 100 Forward Current IF[mA] Ambient temperature Ta( O Radiation Diagram (Ta=25 OC ) -90 -60 -30

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 4. Optical characteristics Spectrum (TA=25℃, IF=60mA) 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 Relative Emission Intensity[a.u.] Wavelength[nm]

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 5. Color & Binning 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515520525530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620630 830 CIE (y) C I E (x)

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com

  • COLOR RANK <IF=20mA, Ta=25℃> 5. Color & Binning R1R0RARB W1W0WAWB V1V0VAVB T1T0TATB S1S0SASB YXYXYXYX 2700K YXYXYXYX 3000K YXYXYXYX 3500K YXYXYXYX 4000K YXYXYXYX 4500K 0.34 0.36 0.38 0.40 0.42 0.44 0.46 4500K 4000K 3500K 3000K Y X WA WB VA VB TA TB SA SB RA RB 2700K * Measurement Uncertainty of the Color Coordinates : ± 0.01 *The single bin is not acceptable in the same group of CCT. (At least, 2 bins required to take when ordering)

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 5. Color & Binning 0.34 0.36 0.38 0.40 0.42 0.44 0.46 4500K 4000K 3500K 3000K Y X WA WB VA VB TA TB SA SB RA RB 2700K 0.34 0.36 0.38 0.40 0.42 0.44 0.46 Y X 2500K 2900K 3200K 3700K 4200K 4700K

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 6. Rank of CAWT722-S VFCIEIV X3X2X1 ▣ Rank Name Table [Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable. 3.63.5A3 3.53.4A2 3.43.3A1 3.33.2Z3 3.23.1Z2 3.13.0Z1 3.02.9Y3 MAXMIN Rank Name ▣ Forward Voltage[V] Color : T, V, WRank Name 68005500N5 MAXMIN 51004200M2 L5 42003500 63005100N1 MAXMIN 55004500M5 45003800L8 Color : R,S Rank Name ▣ Intensity value[mcd] WB WA 2700K VB VA 3000K 0K3500K4004500K TBSBRB TASARA T0S0R0 T1S1R1 Rank Name ▣ CIE (Color Rank) Available Rank

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 7.Outline Dimension Rear ViewRight ViewFront View Package Marking (Cathode) Package Outlines 12 3 456 ( Tolerance: ±0.2, Unit: mm ) Warm White Cathode W3W2W1 Warm White Anode Circuit Di agram * MATERIALS Recommended Solder Pad Ag Plating Copper AlloyElectrodes Silicon ResinEncapsulating Resin Heat-Resistant PolymerPackage MATERIALSPARTS

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 8. Packing Package Marking ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 700pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com

  • Reel Packing Structure

1 SIDE

Material : Paper(SW3B(B)) a b c HUMIDITY INDICATOR Aluminum Vinyl Bag Reel DESI PAK PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. TYPE 7inch SIZE (mm) 220245 245 220 a b 102 142 c Acriche Semiconductor EcoLight RoHS TUV MADE IN KOREA

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 9. Soldering 10 sec. Max. Soldering time Condition 240℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 120~150℃Pre-heat Lead Solder Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. (1) Lead Solder 10 sec. Max. Soldering time Condition 260℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 150~200℃Pre-heat Lead Free Solder 260 C Max.o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C1~5 C / sec. ooo o1~5 C / sec. Lead-frame Solder (2) Lead-Free Solder 10 sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 10. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 11. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 02Rev. 02 November 2008November 2008 www.ZLED.com www.ZLED.com 12. Reliability Test Item and Condition 0/223 Time1KV at 1.5kΩ; 100pFMIL-STD- 883DESD(HBM) HoursTa =-40oC, IF =20mAInternal Reference Low Temperature Life Test HoursTa =85oC, IF =20mAInternal Reference High Temperature Life Test HoursTa =85oC, RH=85%, IF =15mAInternal Reference High Temperature High Humidity Life Test HoursTa =25oC, IF =20mAInternal Reference Operating Endurance Test HoursTa =-40oCEIAJ ED- 4701 Low Temperature Storage HoursTa =85oC, RH=85%EIAJ ED- 4701 High Temperature High Humidity Storage HoursTa =100oCEIAJ ED- 4701 High Temperature Storage Cycle Ta =-40oC (30MIN) ~ 25oC (5MIN) ~ 100oC (30MIN) ~ 25oC (5MIN) EIAJ ED- 4701 Temperature Cycle Cycle Ta =-40oC (30MIN) ~ 100oC (30MIN) EIAJ ED- 4701Thermal Shock Number of Damage Duration / CycleTest ConditionReferenceItem Criteria for Judging the Damage -LSL*2 × 0.5IF =20mAIV Luminous Intensity USL*1 × 2.0-VR=5VIRReverse Current USL*1 × 1.2-IF =20mAVFForward Voltage MAXMIN Criteria for JudgementConditionSymbolItem Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level