CAS26C471DAGFC

CAS17C471KAGFC KEMET | Alldatasheet

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1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com One world. One KEMET Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Overview KEMET’s CAS surface mount safety certified capacitors are specifically designed for interference-suppression AC line filtering applications. When comparing to radial leaded disc capacitors, the CAS surface mount form factor provides engineers the ability to miniaturize their designs with a higher density solution. Having internationally recognized safety certifications, these capacitors are well-suited for applications that require keeping potentially disruptive or damaging line transients and EMI out of susceptible equipment. They are also an ideal solution when needing to suppress line disturbances at the source. Safety Certified Capacitors are classified as either X and/or Y capacitors. Class X capacitors are primarily used in line-to line (across-the-line) applications. Should the capacitor fail in this application, there is no danger of electric shock to humans but could result in a risk of fire. The Class Y capacitor is primarily used in line-to-ground (line by-pass) applications. In this application, failure of the capacitor could lead to danger of electric shock. With a working voltage of 250 VAC in line-to-line (Class X) and 250 VAC in line-to-ground (Class Y) applications, these safety capacitors meet the impulse test criteria outlined in IEC Standard 60384. Meeting subclass X1 and Y2 requirements, these devices are certified to withstand impulses up to 5 KV (X1/Y2) and 2.5 KV (X2) respectively. Benefits

• S afety Certified to IEC 60384-14 C lass X1/Y2, X2

50 VAC rating

.5 kV and 5 kV Impulse Voltages R eliable operation up to 125°C A vailable in C0G and X7R Dielectrics C ase sizes 1808, 1812, 2211, and 2220 C apacitance offerings ranging from 3.0 pF to 22 nF A vailable capacitance tolerances from ±0.5 pF to ±20% R oHS compliant

Applications

Typical applications include: L ine-to-line (Class X) filtering L ine-to-ground (Class Y) filtering A ntenna coupling P rimary and secondary coupling (switching power supplies) L ine disturbances suppression (motors and motor controls, relays, switching power supplies, and inverters) X Y Y Metal Enclosure Ground L N

2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade)

Ordering Information

(L"x W") Specification/ Series Capacitance Code (pF) Capacitance Tolerance AC Rated Voltage Dielectric Subclass Designation Termination Finish Packaging (Suffix/C-Spec) CAS = AC Safety Rated 17 = 1808 18 = 1812 21 = 2220 26 = 2211 C Two significant digits + number of zeros. Use 9 for 1.0 – 9.9 pF e.g., 2.2 pF = 229 D = ±0.5 pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% A =

250 VAC

G = C0G R = X7R F = X1/Y2 G = X2 C = 100% Matte Sn Blank = 7" Reel Dimensions – Millimeters (Inches) L B W S T EIA Size Code Metric Size Code L Length W Width T Thickness B Bandwidth S Separation Minimum Mounting Technique 1808 4520 4.50 (0.177) 2.00 (0.080) ±0.25 (0.010) See Table 2 for Thickness 0.50 (0.020) Solder Reflow Only 1812 4532 4.50 (0.177) 3.20 (0.126) ±0.40 (0.016) 0.50 (0.020) 2211 5728 5.70 (0.224) ±0.40 (0.016) 2.80 (0.110) ±0.30 (0.012) 0.60 (0.024) 2220 5750 5.70 (0.224) ±0.40 (0.016) 5.00 (0.197) ±0.40 (0.016) 0.60 (0.024) Qualification Safety Standard Specification Subclass Working Voltage Certificate No. TUV IEC 60384–14 X1/Y2 250 VAC R 50441101 R 50441118X2 UL CAN/CSA UL 60384–14 and E60384–14 X1/Y2 250 VAC E356389X2 These devices are TUV/ENEC recognized for antenna coupling and AC line-to-line (Class X) and line-to-ground (Class Y) applications per IEC60384–14.

3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Environmental Compliance These devices are RoHS compliant. They meet all requirements set forth by EU RoHS directives. Table 1A – Product Ordering Codes & Ratings – X1/Y2 C0G Capacitance Capacitance Code Case Size 1808 1812 2211 Class X1/Y2 Peak Impulse Voltage 5,000 V Capacitance Tolerance Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 3.0 pF 309 D AF 3.3 pF 339 D AF 3.9 pF 399 D AF 4.0 pF 409 D AF CK 4.7 pF 479 D AF CK 5.0 pF 509 D AF CK 5.6 pF 569 D AF CK 6.0 pF 609 D AF CK 6.8 pF 689 D AF CK 7.0 pF 709 D AF CK 8.0 pF 809 D AF CK 8.2 pF 829 D AF CK 10 pF 100 F G J K M AF BD CK 12 pF 120 F G J K M AF BD CK 15 pF 150 F G J K M AF BD CK 18 pF 180 F G J K M AF BD CK 22 pF 220 F G J K M AF BD CK 27 pF 270 F G J K M AF BD CK 33 pF 220 F G J K M AF BD CK 39 pF 390 F G J K M AG BD CK 47 pF 470 F G J K M AG BD CK 56 pF 560 F G J K M AG BD CK 68 pF 680 F G J K M AG BD CK 82 pF 820 F G J K M AG BD CK 100 pF 101 F G J K M AK BD CK 120 pF 121 F G J K M AK BD CM 150 pF 151 F G J K M AK BD CM 160 pF 161 F G J K M AK BD CM 180 pF 181 F G J K M AK BD CM 220 pF 221 F G J K M AK BK CM 270 pF 271 F G J K M AK BK CM 330 pF 331 F G J K M BK CM 390 pF 391 F G J K M BK CM 470 pF 471 F G J K M BK CM 560 pF 561 F G J K M CM 680 pF 681 F G J K M CM 720 pF 721 F G J K M 820 pF 821 F G J K M 1,000 pF 102 F G J K M

4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Table 1B – Product Ordering Codes & Ratings – X1/Y2 X7R Capacitance Capacitance Code Case Size 1808 1812 2211 2220 Class X1/Y2 Peak Impulse Voltage 5,000V Capacitance Tolerance Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 100 pF 101 J K M AG 120 pF 121 J K M AG 150 pF 151 J K M AG BG CG 180 pF 181 J K M AG BG CG DK 220 pF 221 J K M AG BG CG DK 270 pF 271 J K M AK BG CG DK 330 pF 331 J K M AK BG CG DK 390 pF 391 J K M AK BG CG DK 470 pF 471 J K M AK BG CK DK 560 pF 561 J K M AK BG CK DK 680 pF 681 J K M AK BK CK DK 820 pF 821 J K M AK BK CK DK 1,000 pF 102 J K M AK BM CM DK 1,200 pF 122 J K M CM DM 1,500 pF 152 J K M CM DM 1,800 pF 182 J K M CM DM 2,200 pF 222 J K M CM DM 2,700 pF 272 J K M DM 3,300 pF 332 J K M DM 3,900 pF 392 J K M DM 4,700 pF 472 J K M DM

5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Table 1C – Product Ordering Codes & Ratings – X2 C0G Capacitance Capacitance Code Case Size 1808 1812 Class X2 Peak Impulse Voltage 2,500V Capacitance Tolerance Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 3.0 pF 309 D AF 4.0 pF 409 D AF 5.0 pF 509 D AF 6.0 pF 609 D AF 7.0 pF 709 D AF 8.0 pF 809 D AF 9.0 pF 909 D AF 10 pF 100 F G J K M AF BD 12 pF 120 F G J K M AF BD 15 pF 150 F G J K M AF BD 22 pF 220 F G J K M AF BD 27 pF 270 F G J K M AF BD 33 pF 330 F G J K M AF BD 39 pF 390 F G J K M AG BD 47 pF 470 F G J K M AG BD 56 pF 560 F G J K M AG BD 68 pF 680 F G J K M AG BD 82 pF 820 F G J K M AG BD 100 pF 101 F G J K M AK BD 120 pF 121 F G J K M AK BD 150 pF 151 F G J K M AK BD 180 pF 181 F G J K M AK BD 220 pF 221 F G J K M AK BD 270 pF 271 F G J K M AK BD 330 pF 331 F G J K M AK BD 390 pF 391 F G J K M AK BD 470 pF 471 F G J K M AK BD 560 pF 561 F G J K M AK BD 680 pF 681 F G J K M AK BK 820 pF 821 F G J K M AK BK 1,000 pF 102 F G J K M AK BK

6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Table 1D – Product Ordering Codes & Ratings – X2 X7R Capacitance Capacitance Code Case Size 1808 1812 2220 Class X2 Peak Impulse Voltage 2,500V Capacitance Tolerance Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 150 pF 151 J K M AG 180 pF 181 J K M AG 220 pF 221 J K M AG 270 pF 271 J K M AG BG 300 pF 301 J K M AG BG 330 pF 331 J K M AG BG 390 pF 391 J K M AG BG 470 pF 471 J K M AG BG 560 pF 561 J K M AG BG 680 pF 681 J K M AG BG 720 pF 721 J K M AG BG 820 pF 821 J K M AG BG 1,000 pF 102 J K M AK BG 1,200 pF 122 J K M AK BG 1,500 pF 152 J K M AK BK 1,800 pF 182 J K M AK BK 2,200 pF 222 J K M AK BM 2,700 pF 272 J K M BM 3,300 pF 332 J K M BM 3,900 pF 392 J K M BM 4,700 pF 472 J K M BM 5,600 pF 562 J K M BM 0.010 uF 103 J K M DM 0.012 uF 123 J K M DM 0.015 uF 153 J K M DM 0.018 uF 183 J K M DM 0.022 uF 223 J K M DU

7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Case Size Thickness Code Thickness Range (mm) Plastic Quantity 1808 AF 1.40±0.15 2,000 AG 1.60±0.20 2,000 AK 2.00±0.20 1,000 1812 BD 1.25±0.10 1,000 BG 1.60±0.20 1,000 BK 2.00±0.20 1,000 BM 2.50±0.30 500 2211 CG 1.60±0.20 1,000 CK 2.00±0.20 1,000 CM 2.50±0.30 500 CU 2.80±0.30 500 2220 DK 2.00±0.20 1,000 DM 2.50±0.30 500 DU 2.80±0.30 500 Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Y C C X X Grid Placement Courtyard Y

8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Soldering Process Recommended Reflow Soldering Profile KEMET’s family of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J–STD–020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Profile Feature Termination Finish 100% Matte Sn Preheat/Soak Temperature Minimum (T Smin) 150°C Temperature Maximum (T Smax) 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds Ramp-Up Rate (T L to TP) 3°C/second maximum Liquidous Temperature (T L) 217°C Time Above Liquidous (t L) 60 – 150 seconds Peak Temperature (T P) 260°C Time Within 5°C of Maximum Peak Temperature (tP) 30 seconds maximum Ramp-Down Rate (T P to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Time Temperature Tsmin Tsmax TL TP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tP tL ts 25°C to Peak

9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Item Standard Specification Requirements Visual examination and Dimensions IEC 60384–1 4.1 No remarkable defect. Dimensions to conform to individual specification sheet. Capacitance IEC 60384–1 4.2.2 Class I: C0G Capacitance ≤ 1,000 pF, 1.0 ±0.2 Vrms, 1 MHz ±10% Capacitance > 1,000 pF, 1.0 ±0.2 Vrms, 1 KHz ±10% Class II: (X7R) 1.0 ±0.2 V rms, 1 kHz ±10% Capacitance is within specified tolerance Dissipation Factor (DF) or Q IEC 60384–1 4.2.3 Dielectric Q/DF Requirement C0G Q ≥ 1,000 Cap ≥ 30 pF Q ≥ 400 +20C¹ Cap < 30 pF X7R D.F. < 2.5% 1. Example for 22 pF: Q ≥ 400 + (20 * 22) = 840 Temperature Coefficient IEC 60384–21/22 4.6 Dielectric Temperature Range C0G −55 to 125°CX7R Dielectric Capacitance Change C0G ±30 ppm/°C X7R ±15% Dielectric Strength IEC 60384–14 4.2.1 X Capacitor: 1,075 VDC (4.3 U R) Y Capacitor: 1,500 VAC Duration = 60 Seconds Charge current shall not exceed 50 mA Voltage shall be raised from zero to test voltage at a rate not exceeding 150 V rms/second No evidence of flashover Insulation Resistance IEC 60384–21/22 4.5.3

500 V for 60 seconds

<50 mA charging current Dielectric Insulation Resistance C0G 1,000 megohm microfarads or 100 GΩ Whichever is smaller X7R 500 megohm microfarads or 10 GΩ Whichever is smaller Solderability IEC 60384-21/22 4.10 Solder temperature: 245±5°C Dipping time: 2±0.2 seconds 75% minimum coverage of all metalized area Resistance to Solder Heat IEC 60384–14 4.4 IEC 60384–21/22 4.9 Solder temperature: 260 ±5°C Dipping time: 10 ±1 second Preheat 120°C – 150°C for 1 minute before immersing the capacitor in a eutectic solder. For X7R capacitors, measurements can be made after keeping at room temperature for 24 ±2 hours No visible damage. Dielectric IR Capacitance Change C0G ≥ 1 GΩ Within ±2.5% or ±0.25 pF, whichever is larger. X7R ±7.5% Temperature Cycling IEC 60384–21/22 4.11 Five cycles Step Temp. (°C) Time (min.) 1 −55°C 30 ±3 2 25°C 3 3 125°C 30 ±3 4 25°C 3 Measurements to be made after keeping at room temperature for 24 ±2 hours Dielectric IR Capacitance Change C0G Initial Limit Within ±2.5% or ±0.25 pF, whichever is larger. X7R ±7.5% Humidity (Damp Heat) Steady State IEC 60384–14 4.12 Test temperature: 40±2°C Humidity: 90 – 95% RH Test time: 500 +24/−0 hours Applied Voltage: 250 VAC Measurement to be made after keeping at room temperature for 24±2 hours Dielectric IR Capacitance Change C0G 25 megohm microfarads or 1 GΩ Whichever is smaller Within ±3.0% or ±2 pF, whichever is larger. X7R ±15%

10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions cont. Item Standard Specification Requirements Passive Flammability IEC 60384–14 4.17 IEC 60384–1 4.38 Volume sample: 21.56 mm3 Flame exposure time: 5 seconds maximum Category of flammability: C No evidence of burning Active Flammability IEC 60384–21/22 4.18 The capacitors applied V R (250 VAC). Then each sample shall be subjected to 20 discharges from a tank capacitor, charge to a voltage that, when discharged, Ui 2,500 V for X2, Ui 5,000 V for X1/Y2 across the capacitor under test. The interval between successive discharges shall be 5 seconds. The cheese cloth shall not burn with the flame. Endurance IEC 60384–14 4.14 Impulse Voltage: Each capacitor shall be subjected to a Vp = 5.0 KV (X1/Y2 Class Impulse 5 KV) impulse for three times before applied to endurance test. Test Temp: 125 ±3°C Test time: 1, 000 +48/−0 hours Applied Voltage: X capacitor: 1.25 V R (312.5 VAC) Y capacitor: 1.70 VR (425 VAC) Once every hour the voltage shall be increased to 1, 000 V rms for 0.1 second Measurement to be made after keeping at room temperature for 24 ±2 hours Appearance: No mechanical damage. Dielectric IR Cap. Change Q/DF C0G ≥1 GΩ Within ±5.0% or ±0.5 pF, whichever is larger. ≤ 2.5% X7R ±20% ≤ 5% Resistance to Flexure of Substrate IEC 60384–21/22 4.8 Capacitors mounted on substrate. The board shall be bent 1 mm with rate of 1 mm/second Dielectric Capacitance Change C0G Within ±3.0% or ±2 pF, whichever is larger. X7R ±12.5% Robustness of terminations (Adhesive Strength of Termination) IEC 60384–21/22 4.15 IEC 60384–1 4.13 Capacitors mounted on a substrate. A force of 10 N applied perpendicular to the place of substrate and parallel the line joining the center of terminations for 10 ±1 second. No remarkable damage or removal of the terminations Vibration IEC 60384–14 4.17

• Vibration frequency : 10~55 Hz/minute
• Total amplitude : 1.5 mm
• Repeat the conditions for 2 hours each in 3 perpendicular directions
• No remarkable damage
• Capacitance change and Q/D.F.: To meet initial specification Impulse Voltage IEC 60384–14 4.13 X1: 4.0 KV, X2: 2.5 KV Y2: 5.0 KV Number of impulses: 24 maximum There shall be no permanent breakdown or flashover.

11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 6 months of receipt. Construction Dielectric Material (BaTiO3/CaZrO3) Dielectric Material (BaTiO3/CaZrO3) Detailed Cross Section Barrier Layer (Ni) Inner Electrodes (Ni) Barrier Layer (Ni) Inner Electrodes (Ni) Termination Finish (100% Matte Sn) Termination Finish (100% Matte Sn) End Termination/ External Electrode (Cu) End Termination/ External Electrode (Cu)

12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Marking Subclass Designation Marking X1/Y2 KF X2 KG KEMET ID KEMET ID

13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. 8 mm, 12 mm or 16 mm carrier tape 180 mm (7.00") or 330 mm (13.00") Anti-static reel Embossed plastic* or punched paper carrier. Embossment or punched cavity Anti-static cover t ape (0.10 mm (0.004") maximum thickness) Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. KEMET Bar code label Sprocket holes Table 5 – Carrier Tape Configuration, Embossed Plastic (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel Pitch (P1)* 1808 12 4 ≥ 1812 12 8 *Refer to Figure 1 for W and P 1 carrier tape reference locations. *Refer to Tables 4 and 5 for tolerance specifications.

16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) Figure 5 – Reel Dimensions A D (See Note) Full Radius, See Note B (see Note) Access Hole at Slot Location (Ø 40 mm minimum) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth W3 (Includes flange distortion at outer edge) W2 (Measured at hub) W1 (Measured at hub) C (Arbor hole diameter) Note: Drive spokes optional; if used, dimensions B and D shall apply. N Table 7 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 12 mm 178±0.20 (7.008±0.008) 1.5 (0.059) 13.0 +0.5/−0.2 20.2 (0.795) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum See Note 2, Tables 2–3 W1 W2 Maximum W3 12 mm 50 (1.969) 12.4 +2.0/−0.0 18.4 (0.724) Shall accommodate tape width without interference

17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C 1100_CAS_SMD • 11/8/2022 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Safety Certified, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade) KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation.