LDBAB2680GC5N0

LDBAA2120GC5N0 KEMET | Alldatasheet

Document overview

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Technical content

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 One world. One KEMET Benefits

• Rated voltage: 16 and 50 VDC
• Capacitance range: 0.0033 – 0.1 µF
• EIA size: 1206 – 1812
• Capacitance tolerance: ±2%, ±5%
• Climatic category: 55/125/56
• RoHS Complaint and lead-free terminations
• Operating temperature range of -55˚C to +125˚C Overview Polyphenylene sulphide (PPS) film capacitor for surface mounting.

Applications

Typical applications include timing, filtering and use as a memory capacitor. The LDB Series is designed for high stability, accuracy and temperature. Surface Mount Metallized PPS Film Capacitor LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Part Number System LDB A A 2120 G C 5 N 0 Series Rated Voltage (VDC) Size Code Capacitance Code (pF) Capacitance Tolerance Dielectric Version Packaging Internal Use Metallized PPS A = 16 C = 50 See Dimension Table Digits 2-4 indicate the first three digits of the capacitance value. First digit indicates the number of zeros to be added. G = ±2% J = ±5% C = PPS 5 = Standard See Ordering Options Table 0 (Standard)

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Ordering Options Table Packaging Type Packaging Code Standard Packaging Options Tape & Reel (Standard Reel) N Dimensions – Millimeters Size Code Chip Size (EIA) W H L Nominal Tolerance Nominal Tolerance A 1206 1.7 +/-0.2 See Part Number Table 3.3 +0.3/-0.1

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Performance Characteristics Rated Voltage (VDC) 16 50 Capacitance Range (μF) 0.012 – 0.1 0.0033 – 0.1 Chip Size (EIA) 1206 – 1812 Capacitance Values E12 series Capacitance Tolerance ±2%, ±5% Category Temperature Range -55°C to +125°C Rated Temperature +105°C Voltage Derating The rated voltage is decreased with 1.25%/°C from +105°C to +125°C Climatic Category 55/125/56 Capacitance Drift Maximum 1% after a 2 year storage period at a temperature of +10°C to +40°C and a relative humidity of 40% to 60% Reliability (Reference MIL-HDBK-217) Failure rate ≤ 1 FIT, T = +40°C, V = 0.5 x VR

1 FIT = 10-9 failures / (components * hours)

Failure criteria: open or short circuit, cap. change > 10%, DF 2 times the catalog limits, IR < 0.005 x initial limit Insulation Resistance Measured at +25°C ±5°C Minimum Value Between Terminals 3,000 MΩ Charging time: 1 minute Charging voltage: 10 V DC for VR = 16 VDC

50 VDC for VR = 50 VDC

Maximum Values at 25°C ±5°C 1 kHz 0.6% Surge Voltage Test 1.75 x VR (5 seconds; T = 25 ± 5°C)

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC PPS Dielectric Typical Temperature Graphs PPS Dielectric Typical Frequency Graphs Note: measurements performed at T = 25 ± 5ºC

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Environmental Test Data Damp Heat, Steady State Test Conditions Temperature +40°C ±2°C Relative Humidity (RH) 93% ±2% Test Duration 56 days Performance Capacitance Change |∆ C/C| ≤ 5% DF Change (∆tgδ) ≤ 30 x 10-4 at 1 kHz Insulation Resistance ≥ 50% of limit value Endurance Test Conditions Temperature 125°C ±2°C Test Duration 2,000 hours Voltage Applied 1.25 x VC Performance Capacitance Change |∆ C/C| ≤ 3% DF Change (∆tgδ) ≤ 30 x 10-4 at 1 kHz Insulation Resistance ≥ 50% of limit value Rapid Change of Temperature Test Conditions Temperature 1 hour at -55°C, 1 hour at +125°C Number of Cycles 1,000 Performance Capacitance Change |∆ C/C| ≤ 3% DF Change (∆tgδ) ≤ 50 x 10-4 at 1 kHz Insulation Resistance ≥ limit value No Mechanical Damage Reflow Test Conditions See Solder Process Performance Capacitance Change |∆ C/C| ≤ 3% DF Change (∆tgδ) ≤ 50 x 10-4 at 1 kHz Insulation Resistance ≥ limit value No Mechanical Damage Bending Test Conditions Deflection 1 to 6 mm Performance Capacitance Change |∆ C/C| ≤ 1% No visible damage on the terminations (pealing) neither on the body (cracking) Environmental Compliance All KEMET surface mount capacitors are RoHS Compliant.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Table 1 – Ratings & Part Number Reference VDC Capacitance Value (µF) Size Code Dimensions in mm Chip Size New KEMET Part Number Legacy Part NumberB H L 16 0.012 A 1.7 1.1 3.3 1206 DBAA2120(1)C5N0 LDBAA2120(1)C5N0 16 0.015 A 1.7 1.1 3.3 1206 DBAA2150(1)C5N0 LDBAA2150(1)C5N0 16 0.018 A 1.7 1.1 3.3 1206 DBAA2180(1)C5N0 LDBAA2180(1)C5N0 16 0.022 A 1.7 1.1 3.3 1206 DBAA2220(1)C5N0 LDBAA2220(1)C5N0 16 0.027 A 1.7 1.1 3.3 1206 DBAA2270(1)C5N0 LDBAA2270(1)C5N0 16 0.033 A 1.7 1.1 3.3 1206 DBAA2330(1)C5N0 LDBAA2330(1)C5N0 16 0.039 A 1.7 1.2 3.3 1206 DBAA2390(1)C5N0 LDBAA2390(1)C5N0 16 0.047 A 1.7 1.3 3.3 1206 DBAA2470(1)C5N0 LDBAA2470(1)C5N0 16 0.056 B 2.5 1.7 3.3 1210 DBAB2560(1)C5N0 LDBAB2560(1)C5N0 16 0.068 B 2.5 1.7 3.3 1210 DBAB2680(1)C5N0 LDBAB2680(1)C5N0 16 0.082 B 2.5 1.7 3.3 1210 DBAB2824(1)C5N0 LDBAB2824(1)C5N0 16 0.10 B 2.5 2.0 3.3 1210 DBAB3100(1)C5N0 LDBAB3100(1)C5N0 50 0.0033 A 1.7 1.1 3.3 1206 DBCA1330(1)C5N0 LDBCA1330(1)C5N0 50 0.0039 A 1.7 1.1 3.3 1206 DBCA1390(1)C5N0 LDBCA1390(1)C5N0 50 0.0047 A 1.7 1.1 3.3 1206 DBCA1470(1)C5N0 LDBCA1470(1)C5N0 50 0.0056 A 1.7 1.1 3.3 1206 DBCA1560(1)C5N0 LDBCA1560(1)C5N0 50 0.0068 A 1.7 1.1 3.3 1206 DBCA1680(1)C5N0 LDBCA1680(1)C5N0 50 0.0082 A 1.7 1.1 3.3 1206 DBCA1820(1)C5N0 LDBCA1820(1)C5N0 50 0.010 A 1.7 1.1 3.3 1206 DBCA2100(1)C5N0 LDBCA2100(1)C5N0 50 0.012 A 1.7 1.1 3.3 1206 DBCA2120(1)C5N0 LDBCA2120(1)C5N0 50 0.015 B 2.5 1.4 3.3 1210 DBCB2150(1)C5N0 LDBCB2150(1)C5N0 50 0.018 B 2.5 1.5 3.3 1210 DBCB2180(1)C5N0 LDBCB2180(1)C5N0 50 0.022 B 2.5 1.5 3.3 1210 DBCB2220(1)C5N0 LDBCB2220(1)C5N0 50 0.027 B 2.5 1.5 3.3 1210 DBCB2270(1)C5N0 LDBCB2270(1)C5N0 50 0.033 B 2.5 1.7 3.3 1210 DBCB2330(1)C5N0 LDBCB2330(1)C5N0 50 0.039 B 2.5 1.9 3.3 1210 DBCB2390(1)C5N0 LDBCB2390(1)C5N0 50 0.047 B 2.5 2.3 3.3 1210 DBCB2470(1)C5N0 LDBCB2470(1)C5N0 50 0.056 C 3.3 1.7 4.7 1812 DBCC2560(1)C5N0 LDBCC2560(1)C5N0 50 0.068 C 3.3 1.7 4.7 1812 DBCC2680(1)C5N0 LDBCC2680(1)C5N0 50 0.082 C 3.3 1.7 4.7 1812 DBCC2824(1)C5N0 LDBCC2824(1)C5N0 50 0.10 C 3.3 2.0 4.7 1812 DBCC3100(1)C5N0 LDBCC3100(1)C5N0 VDC Capacitance Value (µF) Size Code B (mm) H (mm) L (mm) Chip Size New KEMET Part Number Legacy Part Number

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Soldering Process Reflow Recommendations Preheating Maximum Preheating Time 180 seconds Minimum Temperature 150°C Maximum Temperature 200°C Maximum Time within Tmax and Tmax – 5°C (∆T5) 30 seconds (Tmax ≤ 250°C) 10 seconds (250 °C < Tmax ≤ 260°C) Maximum Time Over 217°C (∆T217) 150 seconds Maximum Temperature Ramp Rate 3°C/seconds (heating) 6°C/seconds (cooling) Second reflow If two reflow processes are needed, be sure that before the second reflow, the temperature on the capacitor’s surface is lower than 50°C. * For LDB series this value is 260 °C. Maximum Temperature on Component Body (Tmax) Capacitor Capacitor Volume (mm3) Hmax (mm) < 350 350 – 2,000 > 2,000 1.6 – 2.5 255°C * 250°C 245°C > 2.5 250°C 245°C 245°C *In line with JEDEC STD 020D ed. June 2007 with some limitations. * For LDB series this value is 260 °C. Flux/Cleaning/Storage and Moisture Flux suggestions We suggest to use a no-clean flux with a halogen content lower than 0.1%. Cleaning suggestions To clean the PCB assembly we suggest to use a suitable solvent like Isopropyl Alcohol, deionized water or neutral pH detergents. Solvents like Toluene, Xylene and Trichloroethylene should not be used.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Flux/Cleaning/Storage and Moisture cont'd Storage and moisture recommendations KEMET SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months shelf life (temperature ≤ 40°C/relative humidity ≤ 90%). After the MBB has been opened, components may stay in areas with controlled temperature and humidity (temperature ≤ 30°C/relative humidity ≤ 60%) for 168 hours [MSL 3] (rated voltage ≤ 100 VDC) or 696 hours [MSL 2a] (rated voltage > 100 VDC). For longer periods of time and/or higher temperature and/or higher relative humidity values, it is absolutely necessary to protect the components against humidity. If the reel inside the MBB is partially used, KEMET recommends to re-use the same MBB or to avoid areas without controlled temperature and humidity (see above). If the above conditions are not respected, components require a baking (minimum time: 48 hours at 55 ± 5°C) before the reflow. Manual assembly recommendations If PCBs are assembled manually, care must be taken to avoid any mechanical damage to the components. Our recommendations are the following (see Fig. 1): 1. When using tweezers, the components should be gripped across the two terminations (A); 2. Avoid any contact with the two cutting surfaces (C); 3. A vacuum pen is recommended on the top and bottom surfaces (B). Manual soldering recommendations LDE and LDB series have been designed for Surface Mount Technology, pick & place machines and reflow soldering systems. Using a manual soldering iron, issues may occur because the typical temperature for manual soldering is around 350°C. Therefore please pay careful attention:

• Never touch the capacitor body with the soldering iron but rather touch the soldering iron and the end termination with the tin wire edge (see Fig. 2);
• If the soldering iron is equipped with a temperature controller device: Set the temperature to 250 ± 3°C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5 seconds);
• If the soldering iron is NOT equipped with a temperature controller device: This is the worst situation. The following are a few practical suggestions but, clearly, the operator’s experience is extremely important: 1. Proceed as per Fig. 2; 2. As soon as the tin wire starts melting, move the soldering iron away as quickly as possible; 3. Wait a few seconds and check that the soldering joint has been properly created;
• If the soldering iron is equipped with a hot air flow device: Set the hot air temperature to 250 ± 3°C and do not send the hot air directly onto the capacitor plastic body. In this situation, the operator’s experience is very important;
• In any case, avoid mass-mounting SMD Film Capacitors manually.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Packaging Quantities Chip Size (EIA) Height (mm) Reel 1206 1.1 3000 1206 1.2 3000 1206 1.3 3000 1210 1.4 2250 1210 1.5 2250 1210 1.7 2250 1210 1.9 2250 1210 2.0 2250 1210 2.3 2250 1812 1.7 4000 1812 2.0 3000 Landing Size Dimensions in mm A B C D 1206 1.5 1.1 2.3 4.5 1210 2.3 1.1 2.3 4.5 1812 3 1.7 3.1 6.5 These landing area dimensions have the aim of taking full advantage of the new RoHS 6 terminations design. We suggest to use a Sn/Ag/Cu solder paste (suggested thickness: 0.10 – 0.15 mm). If a NOT Lead Free solder paste is used, a minimum peak temperature of 210°C on the component’s body is suggested.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Carrier Taping & Packaging (IEC 60286–2) Horizontal Taping Orientation Chip Size (EIA) Horizontal Mounting Dimensions in mm Taping Specification W H L W P1 A0 B0 K0 D W1 W2 Nominal Nominal Nominal -0.1/+0.3 +/-0.1 Nominal Nominal Nominal -/+2.0 -0/+2 Maximum 1206 1.7 All 3.3 8 4 2 3.8 1.3 180 8 12 1210 2.5 All 3.3 8 4 3 3.8 2.1 180 8 12 In accordance with IEC 60286-3 Materials: - carrier tape: antistatic material - cover tape: polyester + polythene - reel: recyclable polystyrene All parts in reels are packed in hermetically sealed Moisture Barrier Bag (MBB) Class 1.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC KEMET Corporation World Headquarters

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Simpsonville, SC 29681 Mailing Address: P.O. Box 5928 Greenville, SC 29606 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Corporate Offi ces Fort Lauderdale, FL Tel: 954-766-2800 North America Southeast Lake Mary, FL Tel: 407-855-8886 Northeast Wilmington, MA Tel: 978-658-1663 Central Novi, MI Tel: 248-306-9353 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Europe Southern Europe Sasso Marconi, Italy Tel: 39-051-939111 Skopje, Macedonia Tel: 389-2-55-14-623 Central Europe Landsberg, Germany Tel: 49-8191-3350800 Kamen, Germany Tel: 49-2307-438110 Northern Europe Harlow, United Kingdom Tel: 44-1279-460122 Espoo, Finland Tel: 358-9-5406-5000 Asia Northeast Asia Hong Kong Tel: 852-2305-1168 Shenzhen, China Tel: 86-755-2518-1306 Beijing, China Tel: 86-10-5877-1075 Shanghai, China Tel: 86-21-6447-0707 Seoul, South Korea Tel: 82-2-6294-0550 Taipei, Taiwan Tel: 886-2-27528585 Southeast Asia Singapore Tel: 65-6701-8033 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required.