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Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.acriche.comwww.acriche.com Specification C9WT728 CUSTOMER ApprovalApprovalDrawn SSC

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.acriche.comwww.acriche.com

CONTENTS

  1. Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Optical characteristics 5. Reliability Test 6. Color & Binning 7. Bin Code Description 8. Outline Dimension 9. Reel Structure 10. Packing 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.acriche.comwww.acriche.com C9WT728 C9WT728

Features

  • White & Warm colored SMT package.
  • H igh CRI PKG
  • Pb-free Reflow Soldering Application
  • Suitable for all SMT assembly methods ; Suitable for all soldering methods
  • RoHS Compliant
  • M SL LEVEL 2a TOP VIEW LED is designed for high current operation and high flux output applications. Furthermore, its thermal management characteristic is better than other LED solutions by package SMD design and good thermal emission material. According to these advantages, it enables to apply various lighting applications and design solution, automotive lighting etc. 1. Description

Applications

  • Interior lighting
  • General lighting
  • Indoor and out door displays
  • Architectural / Decorative lighting

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 2. Absolute maximum ratings ºC-40 ~ +100TstgStorage Temperature ºC-40 ~ +85ToprOperating Temperature V5VRReverse Voltage (per die) mA100IFM *2Peak Forward Current (Per die) mA90IFForward Current mW324PdPower Dissipation UnitValueSymbolParameter *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric & Optical characteristics 95IF =60mARaColor Rendering Index lm/W-73-IF =60mAŊelcOptical Efficiency cd-4.54.0IF =60mAIV Luminance Intensity *1 [2,600 ~ 4,700 K ] deg-120-IF =60mA2θ½Viewing Angle *2 K7,0002,600CCTColor Temperature lm-14.5-IF =60mAΦV Luminance Flux cd-4.84.0IF =60mAIV Luminance Intensity *1 [4,700 ~ 7,000 K] µA10--VR=5V IRReverse Current (per die) V3.63.33.0IF =20mA VFForward Voltage (per die) UnitMaxTypMinConditionSymbolParameter *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 4. Optical characteristics Forward Voltage vs. Forward Current (Per die) Forward Current vs. Relative Luminous Intensity -90 -60 -30 DirectivityAmbient Temperature vs. Maximum Forward Current (per die) -25 0 25 50 75 100 Forward Current IF[mA] Ambient temperature Ta( O Forward Voltage[V] Forward Current [mA] 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 Relative luminouce Flux [lm] Forward Current IF[mA]

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 5. Reliability Test 0/223 Time1KV at 1.5kΩ; 100pFMIL-STD- 883DESD(HBM) 0/221000 HoursTa =-40oC, IF =60mAInternal Reference Low Temperature Life Test 0/221000 HoursTa =85oC, IF =60mAInternal Reference High Temperature Life Test HoursTa =60oC, RH=90%, IF =60mAInternal Reference High Temperature High Humidity Life Test 0/221000 HoursTa =25oC, IF =60mAInternal Reference Operating Endurance Test 0/221000 HoursTa =-40oCEIAJ ED-4701 Low Temperature Storage 0/221000 HoursTa =60oC, RH=90%EIAJ ED-4701 High Temp. High Humidity Storage 0/221000 HoursTa =100oCEIAJ ED-4701 High Temperature Storage Cycle Ta =-40oC(30min) ~ 100oC(30min) EIAJ ED-4701Thermal Shock Number of Damaged Duration / CycleTest ConditionsReferenceItem -LSL*2 × 0.5IF =60mA (20mA per die)IVLuminous Intensity USL*1 × 2.0-VR=5VIRReverse Current USL*1 × 1.2-IF =60mA (20mA per die)VFForward Voltage MAXMIN Criteria for Judgment ConditionSymbolItem □ CRITERIA FOR JUDGING THE DAMAGE Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 6. Color & Binning 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515520525530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620630 830 CIE (y) C I E (x)

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 6. Color & Binning 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 3000K 2600K2700K2900K 3200K 3500K 3700K 4000K 4200K 4500K 4700K 5000K 5300K 5600K 6000K 6500K H4H2 H3H1 ENERGY STAR RANK (7000K~2600K) C2B2 7000K Y X Z CIE Y CIE X

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 6. Color & Binning

  • COLOR RANK <IF=60mA, Ta=25℃> 5600 ~ 5300 K6500 ~ 6000 K C4C3C2C1 5300 ~ 4700 K6000 ~ 5300 K7000 ~ 6000 K ZYX CIE YCIE XCIE YCIE XCIE YCIE X CIE YCIE XCIE YCIE XCIE YCIE XCIE YCIE X 5000 ~ 4700 K5300 ~ 5000 K CIE YCIE XCIE YCIE XCIE YCIE XCIE YCIE X B2B1A2A1 6000 ~ 5600 K7000 ~ 6500 K
  • A~C, X~Z -> CCT 4700 ~ 7000 K * Measurement Uncertainty of the Color Coordinates : ± 0.01

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 6. Color & Binning

  • COLOR RANK <IF=60mA, Ta=25℃> 3000 ~ 2900 k3200 ~3000 K G4G3G2G1 CIE YCIE XCIE YCIE XCIE YCIE XCIE YCIE X 2700 ~ 2600 K2900 ~ 2700 K H4H3H2H1 CIE YCIE XCIE YCIE XCIE YCIE XCIE YCIE X 3500 ~ 3200 K3700 ~ 3500 K F4F3F2F1 CIE YCIE XCIE YCIE XCIE YCIE XCIE YCIE X E4E3E2E1 CIE YCIE XCIE YCIE XCIE YCIE XCIE YCIE X 4000 ~ 3700 k4200 ~4000 K CIE YCIE XCIE YCIE XCIE YCIE XCIE YCIE X D4D3D2D1 4500 ~ 4200 K4700 ~ 4500 K
  • D~H -> CCT 2600 ~ 4700 K * Measurement Uncertainty of the Color Coordinates : ± 0.01

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 7. Bin Code Description Z1A1M0 Forward Voltage [V]Color RankLuminous Intensity [mcd] Bin Code 4,7004,700K ~ 7,000K C4C3 C2C1 B2B1 A2A1 Z YX Color Rank @ IF = 60mA K ~ 7,000K 3.63.45A2 3.13.0Z1 3.23.1Z2 3.33.2Z3 3.453.3A1 Max.Min.RANK Average for Total Forward Voltage [V] @ IF = 60mA 2,6002,600K ~ 4,700KK ~ 4,700K G4G3 H2H1 E4E3 E2E1 D4D3 D2D1 F4F3 F2F1 G2G1 H4H3 Color Rank @ IF = 60mA 6,0005,500N5 4,5004,000M0 6,5006,000P0 5,0004,500M5 5,5005,000N0 Max.Min.RANK Luminous Intensity [mcd] @ IF = 60mA

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 8.Outline Dimension White Cathode W3W2W1 White Anode Circuit Diagram Right ViewFront View Rear View 456 1 23 Package Marking (Cathode) Package Outlines R eco m m en d e d S o l d er P a d ( Tolerance: ±0.2, Unit: mm ) * MATERIALS Ag Plating Copper AlloyElectrodes Silicone ResinEncapsulating Resin Heat-Resistant PolymerPackage MATERIALSPARTS

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 9. Reel Structure 5.7±0.1 (4.75) 12.0±0.2 5.3 2.1±0.1 1.75±0.15.5±0.05 0.3-0.05 4±0.1 2±0.05 8±0.1 ?1.5+0.1,-0 180 15.4±1.0 13±0.3 Package Marking ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 1,000pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com

1 SIDE

Material : Paper(SW3B(B)) a b c HUMIDITY INDICATOR Aluminum Vinyl Bag Reel DESI PAK PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. TYPE 7inch SIZE (mm) 220245 245 220 a b 102 142 c Acriche Semiconductor EcoLight RoHS TUV MADE IN KOREA 10. Packing

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. 11. Soldering (1) Lead Solder 10 sec. Max.Soldering time Condition 240℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 120~150℃Pre-heat Lead Solder (2) Lead-Free Solder (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. [Note] In case that the soldered products are reused in soldering process, we don’t guarantee the products. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Lead-free Solder 1~5 C / sec.o o o1~5 C / sec. Pre-heating 150~200 C 120sec. Max. Above 220 C o260 C Max. 10 sec. Max. 10 sec. Max.Soldering time Condition 260℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 150~200℃Pre-heat Lead Free Solder o 60sec. Max.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 12. Precaution for use 1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH 2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% 3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. 4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. 5) Quick cooling shall be avoided. 6) Components shall not be mounted on warped direction of PCB. 7) Anti radioactive ray design is not considered for the products. 8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. 9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. 10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. 11) The LEDs must be soldered within seven days after opening the moisture-proof packing. 12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 13) The appearance and specifications of the product may be modified for improvement without notice.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet SSC-QP-7-07-24 (Rev.00) Rev. 03 Rev. 03 June 2009June 2009 www.www.acricheacriche.com .com 13. Handling of Silicone Resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space.