C2955 HAMAMATSU | Alldatasheet
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Technical content
From the backside of the chip, you can see through the silicon substrate to the patterns of the chip by means of an infrared light. A newly developed infrared CCD camera is used to inspect pattern images more clearly and easily than ever before. The C2955 is an IC internal inspection system incor- porating an infrared microscope and an infrared CCD camera. Use of a newly developed infrared CCD camera enables a high sensitivity approximately ten times that of conventional systems (in comparisons by HAMAMATSU), at a wavelength of 1.0 µm, making it possible to obtain sharp, clear images with high resolution. Using an infrared light which is transmitted through the silicon substrate enables observation of the interconnect lines in the IC, the wire bonding status, and the die bonding conditions, along with the diffusion zone conditions, without damaging the part under observation. Observation can be done from the back side, when the sample is prepared by scraping away the molding on the side opposite the surface of the silicon substrate. Because the metal wiring is never touched in the inspection process, precise testing can be carried out under optimum conditions, making it possible to inspect the condition of the diffusion zones, the multilayer interconnect lines, the Al-Si nodules wire bonding interfaces, and die bonding details. l Best suited for flip-chip evaluation l No damage to part under observation l High sensitivity, high resolution l Built-in contrast enhancement function l Shading correction function
l Infrared CCD Camera (camera head, camera control unit) l Video Monitor l Infrared Microscope l Environmental Conditions COMPONENTS
- Infrared CCD camera
- Camera control unit
- Video monitor
- Infrared microscope (including light source dimmer transformer*)
- Cables: 1 set * Specify the line voltage at ordering. APPLIC ATIONS
- Inspection of flip-chip and other packaged IC devices
- Testing for abnormalities (defects, failures) in metal and polysilicon wiring
- Observation of wire bonding
- Observation of various types of die bonding zones
- Simultaneous inspection of Al-Si nodules and multiple patterns
- Observation of pattern diffusion into substrate
- Identification of ESD failure locations
- Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult with our sales office.
- Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearance are subject to change without notice. © 1999 Hamamatsu Photonics K.K. OPTIONS
- C7103 IC Backside Polishing System IMAGE EXAMPLE ISO 9001/ISO 13485 EN 46001 Certificate: 09 105 79045 Homepage Address http://www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Systems Division 812 Joko-cho, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail:export@sys.hpk.co.jp Germany : Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658 France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 United Kingdom: Hamamatsu Photonics UK Limited: Lough Point, 2 Gladbeck Way, Windmill Hill, Enfield, Middlesex EN2 7JA, United Kingdom, Telephone: (44)208-367-3560, Fax: (44)208-367-6384 North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171-41 Solna, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 JUL/99 CR Created in Japan (PDF)