C2655

2SC2655 FOSHAN | Alldatasheet

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Technical content

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 6 TO-92LM 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-92LM Plastic Package. 饱和压降小,开关速度快,与 2SA1020 互补。 Low saturation voltage, high speed switching time, complementary to 2SA1020. 功率放大,功率开关。 Power amplifier and switching applications. PIN1：Base PIN 2 ：Collector PIN 3 ：Emitter 放大及印章代码 / h FE Classifications & Marking 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g hFE Classifications Symbol O Y hFE Range 70～140 120 ～240 1 2 3

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 50 V Collector to Emitter Voltage VCEO 50 V Emitter to Base Voltage V EBO 5.0 V Collector Current (DC) I C 2.0 A Collector Power Dissipation P C 900 mW Junction Temperature Tj 150 ℃ Storage Temperature Range Tstg -55～150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Collector to Emitter Breakdown Voltage VCEO IC=10mA IB=0 50 V Collector Cut-Off Current I CBO VCB=50V IE=0 1.0 μA Emitter Cut-Off Current I EBO VEB=5.0V IC=0 1.0 μA DC Current Gain hFE(1) V CE=2.0V IC=0.5A 70 240 hFE(2) V CE=2.0V IC=1.5A 40 Collector to Emitter Saturation Voltage VCE(sat) IC=1.0A IB=0.05A 0.5 V Base to Emitter Saturation Voltage V BE(sat) IC=1.0A IB=0.05A 1.2 V Transition Frequency f T VCE=2.0V IC=0.5A 50 100 MHz Collector output capacitance C ob VCB=10V IE=0 f=1.0MHz 30 45 pF Turn-On Time t on (如图示) 0.1 μs Turn-Off Time t f 0.1 μs Storage Time t stg 1.0 μs 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： C2655：  为型号代码 Y: 为h FE 分档代码 Note: BR: Company Code. C2655: Product Type. Y: h FE Classifications Symbol **: Lot No. Code,code change with Lot No. BR ** C2655 Y

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 时间：10±1 sec. Temp.:270±5 ℃ Time:10±1 sec 包装规格 / Packaging SPEC. 散件包装 / B U L K Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/Bag 只/袋 Bags/Inner Box 袋/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Bag 袋 Inner Box 盒 Outer Box 箱 TO-92LM 1,000 8 8,000 5 40,000 135×190 237×172×102 560×245×195 编带包装 / A M M O Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/tape 只/纸带 Tape/Inner Box 纸带/盒 Rows/Inner Box 纸带层/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Inner Box 盒 Outer Box 箱 TO-92LM 2,500 1 100 10 25,000 328×230×42 小箱 480×346×235 大箱 547×407×268 使用说明 / N o t i c e s