C2220C104G8GACAUTO

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 19

Technical content

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 One world. One KEMET Benefits

• AEC–Q200 automotive qualified −55°C to +125°C operating temperature range
• Lead (Pb)-Free, RoHS and REACH compliant
• EIA 0402, 0603, 0805, 1206, 1210, 1812, and 2220 case sizes
• DC voltage ratings of 100 200 V and 250 V
• Capacitance offerings ranging from 0.5 pF up to 0.47 μF Available capacitance tolerances of ±0.10 pF, ±0.25 pF, ±0.5 pF, 1%, ±2%, ±5%, ±10%, and ±20% Overview KEMET’s Automotive Grade Series surface mount capacitors in C0G dielectric are suited for a variety of

applications

proven, reliable performance in harsh environments. Whether under-hood or in-cabin, these devices emphasize the vital and robust nature of capacitors required for mission and safety critical automotive circuits. Stricter testing protocol and inspection criteria have been established for automotive grade products in recognition of potentially harsh environmental conditions. KEMET automotive grade series capacitors meet the demanding Automotive Electronics Council's AEC–Q200 qualification requirements C0G dielectric features a 125°C maximum operating temperature and is considered “stable.” The Electronics Industries Alliance (EIA) characterizes C0G dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30 ppm/ ºC from −55°C to +125°C. Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G Dielectric, 10 – 250 VDC (Automotive Grade)

Ordering Information

C 1206 C 104 J 3 G A C AUTO Ceramic Case Size ( L" x W") Specification/ Series Capacitance Code (pF) Capacitance Tolerance1 Rated Voltage (VDC) Dielectric Failure Rate/ Design Termination F inish2 Packaging/Grade C-Spec) 0402 0603 0805 1206 1210 1812 2220 C Standard Two significant d igits number o f zeros Use for 9.9 pF Use for .99 pF ex. 2.2 pF 229 ex. 0.5 pF 508 B ±0.10 pF C ±0.25 pF D ±0.5 pF F ±1% G ±2% J ±5% K ±10% M ±20% 8 = 10 4 = 16 3 = 25 5 = 50 1 = 100 2 = 200 A = 250 G = C0G A = N/A C 100% Matte Sn S ee "Packaging C -Spec Ordering O ptions Table" be low 1 Additional capacitance tolerance offerings may be available. Contact KEMET for details. 2 Additional termination finish options may be available. Contact KEMET for details.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Packaging C-Spec Ordering Options Table Packaging Type1 Packaging/Grade Ordering Code (C-Spec)3 7" Reel AUTO 13" Reel / Unmarked AUTO7411 (EIA 0603 and smaller case sizes) AUTO7210 (EIA 0805 and larger case sizes) 7" Reel/Unmarked/2 mm pitch2 3190 13" Reel/Unmarked/2 mm pitch2 3191 1 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging Quantities" and "Tape & Reel Packaging Information". 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". 3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking". 3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". Benefits cont'd

• No piezoelectric noise Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
• Preferred capacitance solution at line frequencies and into the M Hz range
• No capacitance change with respect to applied rated DC voltage
• Negligible capacitance change with respect to temperature from 55°C to +125°C
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for e xcellent s olderability
• SnPb plated termination finish option available upon request (5% m inimum)

Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression, blocking and energy storage.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Automotive C-Spec Information KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, "AUTO". This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below). Product Change Notifi cation (PCN) The KEMET Product Change Notifi cation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, fi t , function, and /or reliability
• Changes in manufacturing site
• Product obsolescence KEMET Automotive C-Spec Customer Notifi cation due to: Days prior to implementationProcess/Product change Obsolescence* KEMET assigned1 Yes (with approval and sign off) Yes 180 days Minimum AUTO Yes (without approval) Yes 90 days Minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specifi cation requirements are properly understood and fulfi lled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part KEMET Automotive C-Spec PPAP (Product Part Approval Process) Level 1 2 3 4 5 KEMET AUTO ○ ○ 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
• Part Number specifi c PPAP available ○ Product family PPAP only

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Dimensions – Millimeters (Inches) L B W S T EIA Size Code Metric Size Code L Length W Width T Thickness B Bandwidth S Separation Minimum Mounting Technique See Table 2 for Thickness 0.30 (.012) 0.10 Reflow Only 0603 1608 1.60 (.063) 0.15 (.006) 0.80 (.032) 0.15 (.006) 0.35 (.014) 0.15 (.006) 0.70 (.028) Solder Wave or S older Reflow0805 2012 2.00 (.079) 0.20 (.008) 1.25 (.049) 0.20 (.008) 0.50 (0.02) 0.25 (.010) 0.75 (.030) N/A 1210 3225 3.20 (.126) 0.20 (.008) 2.50 (.098) 0.20 (.008) 0.50 (0.02) 0.25 (.010) Solder Reflow Only1812 4532 4.50 (.177) 0.30 (.012) 3.20 (.126) 0.30 (.012) 0.60 (.024) 0.35 (.014) 2220 5650 5.70 (.224) 0.40 (.016) 5.00 (.197) 0.40 (.016) 0.60 (.024) 0.35 (.014) Qualification/Certification Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress T est Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website @www.aecouncil.com. Environmental Compliance Lead (Pb)-Free, RoHS, and REACH compliant without exemptions.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating T emperature Ra nge −55°C to +125°C C apacitance Change with Reference to +25°C and VDC Applied (TCC) ±30 ppm/ºC A ging Rate (Maximum Capacitance Loss/Decade Hour) 0% 1Dielectric Withstanding Voltage (DWV) 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) 2Dissipation Factor (DF) Maximum Limit @ 25ºC 0 .1% 3Insulation Resistance (IR) Limit @ 25°C 1,000 megohm microfarads or 100 GΩ (Rated voltage applied for 120 ±5 seconds @ 25°C) 1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2Capacitance and dissipation factor (DF) measured under the following conditions: 1 M Hz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF 1 k Hz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF 3To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value Dissipation Factor ( Maximum %) C apacitance Shift I nsulation Resistance C0G All All 0.5 0.3% or ±0.25 pF 10% of Initial Limit

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Capacitance Cap Code Case Size/Series C0402C C0603C C0805C Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A Rated Voltage (VDC) 100 200 250 100 200 250 100 200 250 Capacitance Tolerance Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 0.50 & 0.75 pF 5 08 & 758 B C D BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 1.0 9.1 pF* 109 919* B C D BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN pF* 100 910* F G J K M BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 100 pF 101 F G J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 110 180 pF* 111 181* F G J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 200 270 pF* 201 271* F G J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 300 pF 301 F G J K M BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN 330 pF 331 F G J K M BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN 360 pF 361 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 390 pF 391 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 430 pF 431 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 470 pF 471 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DP DP 510 820 pF* 511 821* F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN 910 pF 911 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DP DP DP 1,000 pF 102 F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DP DP DP 1,100 pF 112 F G J K M BB BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN ,200 pF 122 F G J K M BB BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN 1,300 pF 132 F G J K M BB BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN 1,500 pF 152 F G J K M BB BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN 1,600 pF 162 F G J K M BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN 1,800 pF 182 F G J K M BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN 2,000 pF 202 F G J K M BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN 2,200 pF 222 F G J K M BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN 2,400 pF 242 F G J K M CF CF CF CF CF DN DN DN DN DN DN DN 2,700 pF 272 F G J K M CF CF CF CF CF DN DN DN DN DN DN DN 3,000 pF 302 F G J K M CF CF CF CF CF DP DP DP DP DN DN DN 3,300 pF 332 F G J K M CF CF CF CF CF DP DP DP DP DN DN DN 3,600 pF 362 F G J K M CF CF CF CF CF DP DP DP DP DN DP DP 3,900 pF 392 F G J K M CF CF CF CF CF DE DE DE DE DN DP DP 4,300 pF 432 F G J K M CF CF CF CF CF DE DE DE DE DN DP DP 4,700 pF 472 F G J K M CF CF CF CF CF DE DE DE DE DN DP DP 5,100 pF 512 F G J K M CF CF CF CF DE DE DE DE DN DP DP 5,600 pF 562 F G J K M CF CF CF CF DN DN DN DN DN DP DP 6,200 pF 622 F G J K M CF CF CF CF DN DN DN DN DN DG DG 6,800 pF 682 F G J K M CF CF CF CF DN DN DN DN DN DG DG ,500 pF 752 F G J K M CF CF CF DN DN DN DN DN DG DG 8,200 pF 822 F G J K M CF CF CF DN DN DN DN DN DG DG 9,100 pF 912 F G J K M CF CF CF DN DN DN DN DN 10,000 pF 103 F G J K M CF CF CF DN DN DN DN DP 12,000 pF 123 F G J K M CF CF CF DN DN DN DN DE 15,000 pF 153 F G J K M CF CF CF DN DN DN DP DG 18,000 pF 183 F G J K M DN DN DN DP 22,000 pF 223 F G J K M DP DP DP DF 27,000 pF 273 F G J K M DF DF DF 33,000 pF 333 F G J K M DG DG DG 39,000 pF 393 F G J K M DG DG DG 47,000 pF 473 F G J K M DG DG DG Capacitance Cap Code Rated Voltage (VDC) 100 200 250 100 200 250 100 200 250 Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A Case Size/Series C0402C C0603C C0805C Table 1A – Capacitance Range/Selection Waterfall (0402 – 0805 Case Sizes) *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Table 1B – Capacitance Range/Selection Waterfall (1206 – 2220 Case Sizes) *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts. Cap Cap Code Case Size/Series C1206C C1210C C1812C C2220C Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 5 1 2 A 5 1 2 Rated Voltage (VDC) 100 200 250 100 200 250 100 200 250 100 200 Capacitance Tolerance Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 1.0 – 9.1 pF* 1 09 – 919* B C D EB EB EB EB EB EB EB FB FB FB FB FB FB FB pF* 100 910* F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB 100 430 pF* 101 431* F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB 470 910 pF* 471 911* F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB 1,000 pF 102 F G J K M EB EB EB EB EB EE EE FB FB FB FB FB FB FB GB GB GB GB 1,100 pF 112 F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB 1,200 pF 122 F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB 1,300 pF 132 F G J K M EB EB EB EB EC EC EC FB FB FB FB FB FC FC GB GB GB GB 1,500 pF 152 F G J K M EB EB EB EB ED EC EC FB FB FB FB FB FE FE GB GB GB GB 1,600 pF 162 F G J K M EB EB EB EB ED ED ED FB FB FB FB FB FE FE GB GB GB GB 1,800 pF 182 F G J K M EB EB EB EB ED ED ED FB FB FB FB FB FE FE GB GB GB GB 2,000 pF 202 F G J K M EB EB EB EB ED ED ED FB FB FB FB FC FE FE GB GB GB GB 2,200 pF 222 F G J K M EB EB EB EB EE EE ED FB FB FB FB FC FG FG GB GB GB GB 2,400 pF 242 F G J K M EB EB EB EB EC EC EC FB FB FB FB FC FC FC 2,700 pF 272 F G J K M EB EB EB EB EC EC EC FB FB FB FB FC FC FC GB GB GB GB 3,000 pF 302 F G J K M EC EC EC EC EC EB EB FB FB FB FB FC FF FF 3,300 pF 332 F G J K M EC EC EC EC EE EB EB FB FB FB FB FF FF FF GB GB GB GB ,600 pF 362 F G J K M EC EC EC EC EE EB EB FB FB FB FB FF FF FF 3,900 pF 392 F G J K M EC EC EC EC EF EB EB FB FB FB FB FF FF FF GB GB GB GB 4,300 pF 432 F G J K M EC EC EC EC EC EB EB FB FB FB FB FF FF FF 4,700 pF 472 F G J K M EC EC EC EC EC EB EB FF FF FF FF FG FG FG GB GB GD GD 5,100 pF 512 F G J K M ED ED ED ED ED EB EB FB FB FB FB FG FG FG 5,600 pF 562 F G J K M ED ED ED ED ED EB EB FB FB FB FB FG FG FG GB GB GH GH 6,200 pF 622 F G J K M EB EB EB EB EB EB EB FB FB FB FB FG FB FB 6,800 pF 682 F G J K M EB EB EB EB EB EB EB FB FB FB FB FG FB FB GB GB GJ GJ JE JE JB 7,500 pF 752 F G J K M EB EB EB EB EB EB EB FC FC FC FC FC FB FB 8,200 pF 822 F G J K M EC EC EC EC EB EC EC FC FC FC FC FC FB FB GB GH GB GB JE JE JB 9,100 pF 912 F G J K M EC EC EC EC EB EC EC FE FE FE FE FE FB FB 10,000 pF 103 F G J K M ED ED ED ED EB EC EC FF FF FF FF FF FB FB GB GH GB GB JE JE JB 12,000 pF 123 F G J K M EB EB EB EB EB ED ED FG FG FG FG FB FB FB GB GG GB GB JE JE JB 15,000 pF 153 F G J K M EB EB EB EB EB EF EF FG FG FG FG FB FC FC GB GB GB GB JE JE JB 18,000 pF 183 F G J K M EB EB EB EB EB EH EH FB FB FB FB FB FC FC GB GB GB GB JE JE JB 22,000 pF 223 F G J K M EB EB EB EB EC EH EH FB FB FB FB FB FF FF GB GB GB GB JE JB JB 27,000 pF 2 73 F G J K M EB EB EB EB EE FB FB FB FB FB FG FG GB GB GB GB JE JB JB 33,000 pF 333 F G J K M EB EB EB EB EE FB FB FB FB FB FH FH GB GB GB GB JB JB JB 39,000 pF 393 F G J K M EC EC EC EE EH FB FB FB FB FE FH FH GB GB GB GB JB JB JB 47,000 pF 473 F G J K M EC EC EC EE EH FB FB FB FB FE FJ FJ GB GB GD GD JB JB JB 56,000 pF 563 F G J K M ED ED ED EF FB FB FB FB FF GB GB GD GD JB JB JB 68,000 pF 683 F G J K M EF EF EF EH FB FB FB FC FG GB GB GK GK JB JB JB 82,000 pF 823 F G J K M EH EH EH EH FC FC FC FF FH GB GB GM GM JB JB JB 0.10 µF 104 F G J K M EH EH EH FE FE FE FG FM GB GD GM GM JB JB JD 0.12 µF 124 F G J K M FG FG FG FH GB GH JB JB JD 0.15 µF 154 F G J K M FH FH FH FM GD GN JB JB JG 0.18 µF 184 F G J K M FJ FJ FJ GH JB JD JG 0.22 µF 224 F G J K M FK FK FK GK JB JD JL 0.27 µF 274 F G J K M JB JF 0.33 µF 334 F G J K M JD JG 0.39 µF 394 F G J K M JG 0.47 µF 474 F G J K M JG Cap Cap Code Rated Voltage (VDC) 100 200 250 100 200 250 100 200 250 100 200 Voltage Code 8 4 3 5 1 2 A 8 4 3 5 1 2 A 5 1 2 A 5 1 2 Case Size/Series C1206C C1210C C1812C C2220C

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Thickness Code Case Size1 Thickness ± Range (mm) Paper Quantity1 Plastic Quantity 7" Reel 13" Reel 7" Reel 13" Reel BB 0402 0.50 ± 0.05 10,000 50,000 0 0 BD 0402 0.55 ± 0.05 10,000 50,000 0 0 CF 0603 0.80 ± 0.07 4,000 15,000 0 0 CH 0603 0.85 ± 0.07 4,000 10,000 0 0 DN 0805 0.78 ± 0.10 4,000 15,000 0 0 DP 0805 0.90 ± 0.10 4,000 15,000 0 0 DE 0805 1.00 ± 0.10 0 0 2,500 10,000 DF 0805 1.10 ± 0.10 0 0 2,500 10,000 DG 0805 1.25 ± 0.15 0 0 2,500 10,000 EB 1206 0.78 ± 0.10 4,000 10,000 4,000 10,000 EC 1206 0.90 ± 0.10 0 0 4,000 10,000 ED 1206 1.00 ± 0.10 0 0 2,500 10,000 EE 1206 1.10 ± 0.10 0 0 2,500 10,000 EF 1206 1.20 ± 0.15 0 0 2,500 10,000 EH 1206 1.60 ± 0.20 0 0 2,000 8,000 FB 1210 0.78 ± 0.10 0 0 4,000 10,000 FC 1210 0.90 ± 0.10 0 0 4,000 10,000 FE 1210 1.00 ± 0.10 0 0 2,500 10,000 FF 1210 1.10 ± 0.10 0 0 2,500 10,000 FG 1210 1.25 ± 0.15 0 0 2,500 10,000 FH 1210 1.55 ± 0.15 0 0 2,000 8,000 FM 1210 1.70 ± 0.20 0 0 2,000 8,000 FJ 1210 1.85 ± 0.20 0 0 2,000 8,000 FK 1210 2.10 ± 0.20 0 0 2,000 8,000 GB 1812 1.00 ± 0.10 0 0 1,000 4,000 GD 1812 1.25 ± 0.15 0 0 1,000 4,000 GH 1812 1.40 ± 0.15 0 0 1,000 4,000 GG 1812 1.55 ± 0.10 0 0 1,000 4,000 GK 1812 1.60 ± 0.20 0 0 1,000 4,000 GJ 1812 1.70 ± 0.15 0 0 1,000 4,000 GN 1812 1.70 ± 0.20 0 0 1,000 4,000 GM 1812 2.00 ± 0.20 0 0 500 2,000 JB 2220 1.00 ± 0.15 0 0 1,000 4,000 JD 2220 1.30 ± 0.15 0 0 1,000 4,000 JE 2220 1.40 ± 0.15 0 0 1,000 4,000 JF 2220 1.50 ± 0.15 0 0 1,000 4,000 JG 2220 1.70 ± 0.15 0 0 1,000 4,000 JL 2220 2.00 ± 0.20 0 0 500 2,000 Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity 1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2

1 Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). Image below based on Density Level B for an EIA 1210 case size. Y C C X X Grid Placement Courtyard Y

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Soldering Process Recommended Soldering Technique: Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. T emperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. Profile Feature Termination Finish SnPb 100% Matte Sn Preheat/Soak Temperature Minimum (TSmin) 100°C 150°C Temperature Maximum (TSmax) 150°C 200°C Time (tS) from TSmin to TSmax 60 – 120 seconds 60 – 120 seconds Ramp-Up Rate (TL to TP) 3°C/second ma ximum 3°C/second ma ximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum P eak Temperature (tP) 20 seconds maximum 30 seconds maximum Ramp-Down Rate (TP to TL) 6°C/second ma ximum 6°C/second ma ximum Time 25°C to Peak T emperature 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Time Temperature Tsmin 25° C to Peak tL tS tP Tsmax TL TP Maximum Ramp Up Rate = 3°C/sec Maximum Ramp Down Rate = 6°C/sec

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Construction Detailed Cross Section Barrier Layer (Ni) Inner Electrodes (Ni) Termination Finish (100% Matte Sn) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) Dielectric Material (CaZrO3) End Termination/ External Electrode (Cu) Dielectric Material (CaZrO3) Barrier Layer (Ni) End Termination/ External Electrode (Cu) Capacitor Marking (Optional): Laser marking option is not available on: C0G, Ultra Stable X8R and Y5V dielectric devices EIA 0402 case size devices EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Reel Embossed Plastic* or Punched Paper Carrier. Embossment or Punched Cavity Anti-Static Cover T ape (.10 mm (.004") Maximum Thickness) Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. KEMET Bar Code Label Sprocket Holes Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic Punched Paper 7" Reel 13" Reel 7" Reel 13" Reel Pitch (P1)* Pitch (P1)* 01005 – 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 & 2220 16 12 12 Array 0508 & 0612 8 4 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifi cations. New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) Packaging Type/Options C-3190 Automotive grade 7" reel unmarked C-3191 Automotive grade 13" reel unmarked C-7081 Commercial grade 7" reel unmarked C-7082 Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs
• Double the parts on each reel results in fewer reel changes and increased effi ciency
• Fewer reels result in lower packaging, shipping and storage costs, reducing waste

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions Po T F W Center Lines of Cavity Ao Bo User Direction of Unreeling Cover Tape Ko B1 is for tape feeder reference only, including draft concentric about B o. ØD1 ØDo Embossment For cavity size, see Note 1 Table 4 [10 pitches cumulative tolerance on tape ± 0.2 mm] Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 D1 Minimum Note 1 E1 P0 P2 R Reference Note 2 S1 Minimum Note 3 T Maximum Maximum 8 mm 1.5 +0.10/-0.0 1.0 (0.039) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004)12 mm 1.5 (0.059) (1.181)16 mm Variable Dimensions — Millimeters (Inches) Tape Size Pitch B1 Maximum Note 4 Minimum F P1 T2 Maximum W Maximum A0,B0 & K0 8 mm Single (4 mm) 4.35 (0.171) 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 2.5 (0.098) 8.3 (0.327) Note 512 mm Single (4 mm) & Double (8 mm) 8.2 (0.323) 10.25 (0.404) 5.5 ±0.05 (0.217 ±0.002) 8.0 ±0.10 (0.315 ±0.004) 4.6 (0.181) 12.3 (0.484) 16 mm Triple (12 mm) 12.1 (0.476) 14.25 (0.561) 7.5 ±0.05 (0.138 ±0.002) 12.0 ±0.10 (0.157 ±0.004) 4.6 (0.181) 16.3 (0.642) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A 0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions User Direction of Unreeling Top Cover Tape T Center Lines of Cavity ØDo Po F W G Cavity Size, See Note 1, Table 7 Bottom Cover Tape Bottom Cover Tape [10 pitches cumulative tolerance on tape ± 0.2 mm] Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum R Reference Note 2 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) Maximum 0.75 (0.030) (0.984) Variable Dimensions — Millimeters (Inches) Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A 0 B0 8 mm Half (2 mm) 6.25 (0.246) 3.5 ±0.05 (0.138 ±0.002) 2.0 ±0.05 (0.079 ±0.002) 1.1 (0.098) 8.3 (0.327) Note 1 8 mm Single (4 mm) 4.0 ±0.10 (0.157 ±0.004) 8.3 (0.327) 1. The cavity defi ned by A0, B0 and T shall surround the component with suffi cient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6).

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Figure 6 – Reel Dimensions A D (See Note) Full Radius, See Note B (see Note) Access Hole at Slot Location (Ø 40 mm minimum) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth W3 (Includes flange distortion at outer edge) W2 (Measured at hub) W1 (Measured at hub) C (Arbor hole diameter) Note: Drive spokes optional; if used, dimensions B and D shall apply. N Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/-0.2 20.2 (0.795)12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 8 mm (1.969) 8.4 +1.5/-0.0 14.4 (0.567) Shall accommodate tape width without interference12 mm 12.4 +2.0/-0.0 18.4 (0.724) 22.4 (0.882)

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) KEMET Corporation World Headquarters

2835 KEMET Way

Simpsonville, SC 29681 Mailing Address: P.O. Box 5928 Greenville, SC 29606 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Corporate Offi ces Fort Lauderdale, FL Tel: 954-766-2800 North America Northeast Wilmington, MA Tel: 978-658-1663 Southeast Lake Mary, FL Tel: 407-855-8886 Central Novi, MI Tel: 248-994-1030 Irving, TX Tel: 972-915-6041 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Europe Southern Europe Sasso Marconi, Italy Tel: 39-051-939111 Skopje, Macedonia Tel: 389-2-55-14-623 Central Europe Landsberg, Germany Tel: 49-8191-3350800 Kamen, Germany Tel: 49-2307-438110 Northern Europe Wyboston, United Kingdom Tel: 44-1480-273082 Espoo, Finland Tel: 358-9-5406-5000 Asia Northeast Asia Hong Kong Tel: 852-2305-1168 Shenzhen, China Tel: 86-755-2518-1306 Beijing, China Tel: 86-10-5877-1075 Shanghai, China Tel: 86-21-6447-0707 Seoul, South Korea Tel: 82-2-6294-0550 Taipei, Taiwan Tel: 886-2-27528585 Southeast Asia Singapore Tel: 65-6701-8033 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C 1022_C0G_AUTO_SMD • 2/29/2016 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required.