C1HQ-1N8S-10

C1HQ_SERIES SUPERWORLD | Alldatasheet

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(a) (c) (b) (d) 1. PART NO. EXPRESSION : (b) Category Code (a) Series code 2. C0NFIGURATION & DIMENSIONS : 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Body : ceramic ( Pb Free ) (b) Termination : ( Pb Free ) a 3. SCHEMATIC : (c) Inductance code : 1N0 = 1.0nH 5. GENERAL SPECIFICATION : C1HQ SERIES PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 0.60± 0.10 BCD 1.00± 0.05 A 0.50± 0.05 b Ag(100%) Ni(100%)-1.5u m(min.) Sn(100%)-3.0u m(min.) 0.175± 0.075 C 1 H Q - 1 N 0 S - □□ a) Operating temp. : -40° C to +105° C ( including self-temperature. rise ) CERAMIC CHIP INDUCTORS (e) C A D B 11 ~ 99 : Internal control number (d) Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10% (e) 10: Standard Recommended PC Board Pattern H L G b) Storage condition (component in its packaging) i) Temperature : -10 to 40° C ii) Humidity : 60% 0.50~0.55 GH Unit:m/m 1.55 Ref. L 0.60~0.70

SUPERWORLD ELECTRONICS (S) PTE LTD C1HQ SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 28.01.2015 6. ELECTRICAL CHARACTERISTICS : 100 100 100 100 100 100 100 100 100 100 100 100 Test Frequency ( MHz ) 100 100C1HQ-1N0S-10 Part Number Typ. 710 DC Resistance ( Ω ) Min Q Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10% 1.0 (nH) 1.2 1.5 2.0 1.8 3.0 3.6 3.3 4.3 3.9 2.2 2.4 2.7 4.7 Inductance ( MHz ) Min. SRFRated Current (mA) Max 5.1 100 0.07 710 710 710 660 660 630 630 570 540 500 490 470 450 430 10000 >13000 11000 10500 10000 9600 9200 8700 8300 7800 7300 6900 6400 6300 100 100 100 100 100 420 400 390 370 360 6200 6100 6000 5500 5000 5.6 6.2 6.8 7.5 8.2 C1HQ-1N2S-10 C1HQ-1N5S-10 C1HQ-1N8S-10 C1HQ-2N0S-10 C1HQ-2N2S-10 C1HQ-2N4S-10 C1HQ-2N7S-10 C1HQ-3N0S-10 C1HQ-3N3S-10 C1HQ-3N6S-10 C1HQ-3N9S-10 C1HQ-4N3S-10 C1HQ-4N7S-10 C1HQ-5N1S-10 C1HQ-5N6S-10 C1HQ-6N2S-10 C1HQ-6N8S-10 C1HQ-7N5S-10 C1HQ-8N2S-10 Q(Typ.) Frequency(MHz) 300 800 900 1500 1800 129 147 110 217 156 104 244 177 116 100 103 101 Max. 0.014 Typ. >13000 8000 6000 6000 6000 6000 6000 6000 6000 5000 4000 4000 4000 4000 4000 3900 3900 3700 3600 0.070.016 0.070.030 0.070.035 0.080.035 0.080.040 0.090.050 0.090.060 0.110.070 0.120.075 0.140.080 0.150.085 0.160.090 0.170.095 0.190.110 0.200.120 0.220.130 0.230.130 0.250.135 0.270.140 100 350 480089.1C1HQ-9N1S-10 29 45 49 59 62 34000.290.150 100 330 4500810C1HQ-10NS-10 28 45 48 57 60 32000.310.165 100 300 4300812C1HQ-12NS-10 26 40 45 51 52 27000.390.165 100 280 4100815C1HQ-15NS-10 25 38 42 49 51 23000.450.190 CERAMIC CHIP INDUCTORS 10000>13000

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 28.01.2015 C1HQ SERIES 7. CHARACTERISTICS CURVES : CERAMIC CHIP INDUCTORS Impedance v.s. Frequency Characteristics Inductance v.s. Frequency Characteristics Q v.s. Frequency Characteristics 1 10 100 10 00 10000 FREQUENCY(MHz) 0.1 100 1000IMPEDANCE(Ohm) HC I1005HQ Z VS Fr eq . 1. 5 n 2.7n 4. 7 n 8.2n 15n 1 10 1 00 1000 10000 FREQUENCY(MHz) 100IND UC TANCE(nH) H CI1 00 5H Q L VS Fre q. 1.5 n 2.7n 4.7 n 8.2 n 15 n 1 10 100 1000 10000 FREQUENCY(MHz) 100 Q HCI1005HQ Q VS Freq. 1. 5n 4.7n 15n

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 5 28.01.2015 C1HQ SERIES may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume Figure 3 ReC0mmendable Upper limit t 8-3. Solder Volume CERAMIC CHIP INDUCTORS Minimum fillet height = soldering thickness + 25% product height

1. PACKAGING INFORMATION : SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 6 28.01.2015 C1HQ SERIES 9-1. Reel Dimension 7" x 8mm 178.0± 2.0 B( mm) 50 or more10± 1.5 A( mm)Type 13± 0.2 C(mm) D(mm) Chip Size Chip / Reel Inner Box Middle Box Carton 9-3. Packaging Quantity Material : Paper 9-2 Tape Dimension / 8mm W:8.0± 0.1 AoP P2:2± 0.10 E:1.75± 0.1 F:3.5± 0.1 Si ze Ko Bo t C1HQ 0.75± 0.10 Ao(mm) 1.15± 0.10 Bo(mm) Ko(mm) 0.80 max 0.80 max2.0± 0.05 P(mm) t(mm) 50000 250000 500000 C1HQ 10000 CERAMIC CHIP INDUCTORS D EMBOSSED CARRIER B A COVER TAPE 2.0± 0.5 ØC

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 28.01.2015 C1HQ SERIESCERAMIC CHIP INDUCTORS Base tape 9-4. Tearing Off Force Top cover tape 165° C to 180° C F The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Tearing SpeedRoom HumidityRoom Temp. (° C) 5~35 (%) 45~85 Room atm 860~1060 (hPa) 300 (mm/min) a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. To maintain the solderabililty of terminal electrodes : 1. Storage Conditions : Application Notice 2. Transportation :