C12200-461 HAMAMATSU | Alldatasheet

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High S/N ratio with 12 bit (-321) / 16 bit (-461) output Camera Link interface (Base configuration) Single power supply (+15 V) operation Real time dark current / shading correction function Frame readout mode for easy installation alignment 36.8 m/min. 293 mm Detection area 6144 pixels Horizontal spatial resolutionTDI technology OPTIONS X-ray TDI camera can inspect the samples easily by high speed scan with narrow irradiate area. S/N ratio is one of advantage and low X-ray radiation is enough to inspect the void existence. Furthermore it contribute to make a smaller size of system by reducing a lot of X-ray irradiation. Void inspection of BGAs X-ray TDI camera X-ray light source Line sensor reduced X-ray irradiation area X-ray TDI camera C12200 Series is useful for in-line applications requiring high-speed operation with high sensitivity. TDI imaging is appropriate for applications where it is desired to record a linear movement, or where the aspect ratio of the subject being imaged is significantly asymmetric. Low brightness under high resolution usage, a problem with conventional line sensor cameras, is improved with this X-ray TDI camera, making it suitable for applications which require high resolution. Printed circuit board (PCB) inspection Surface-mounted component inspection Battery inspection High-resolution in-line non-destructive inspection High speed readout Large field of view High SensitivityHigh Resolution Evolutional high speed scanning with TDI technology High speed readout TDI sensor Signal intensity X-ray TDI Camera Object X-ray source Shield box Conveyor belt Object motion X-ray TDI camera can reduce the X-ray irradiation on the sample dramatically by high speed with narrow irradiation area. So it can reduce the risks to break down the ICs on the PC. Time Delay Integration is a technology of scanning in which a frame transfer device produces a continuous video image of a moving object by means of a stack of linear arrays aligned with and synchronized to the motion of the object to be imaged in such a way that, as the image moves from one line to the next, the integrated charge moves along with it, providing higher resolution at lower light levels than is possible with a line-scan camera. DIMENSIONAL OUTLINES (Unit: mm) ★Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.

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  • Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearance are subject to change without notice. © 2014 Hamamatsu Photonics K.K. Cat. No. SFAS0026E07 JAN/2014 HPK Created in Japan Power supply unit : A8206-35 Power cable: A10847-05 (5 m) Software API Support (Microsoft Windows): DCAM-API (http://www.dcamapi.com) FeaturesFeatures X-ray TDI Camera C12200 Series MEASUREMENT EXAMPLES (38.264±0.5) 160±0.5 160±0.5 370±0.5 25±0.5 239±0.5 250±0.5 228±0.5 50.05±0.5 293.472 * (Sensor range) 5.5±0.3 10.6 11±0.5 15.1±0.3 6−φ4.5 50±0.5 42.4±0.5 30030 6(Sensor range) 64 221.184 * (Sensor range)32.9 123 134±0.5 360±0.5 5.5 10.7 4-φ4.5 270±0.516.1 147 302.2 2-M4 D=632.5 C12200-321(Approx. 5 kg) (Approx. 2 kg) A8206-35 (Option) C12200-461(Approx. 7 kg) (Sensor position) (Sensor position) * Sensor length is a theoretical value and does not include the dead space between CCDs. In case of overlapped type, the overlapped pixels are defined as 10 pixels. HAMAMATSU PHOTONICS K.K. HAMAMATSU PHOTONICS K.K., Systems Division 812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: export@sys.hpk.co.jp Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658 E-mail: info@hamamatsu.de United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: info@hamamatsu.co.uk North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 SE-164 40 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: info@hamamatsu.se www.hamamatsu.com

48 μm × 48 μm FOS (Fiber optic plate with scintillator) Approx. 25 kV to 90 kV

5.0 MHz

Max. 8.0 kHz (23.04 m/min) Max. 6.4 kHz (36.86 m/min) Base Configuration 0 dB to 14 dB (64 steps) DC +15 V (±1 V) C12200-461 6144 (H) × 128 (V) 6144 (H) × 110 (V) 293 mm(H) × 6 mm(V) 16 bit 16 bit

50 MHz

4608 (H) × 128 (V) 4608 (H) × 110 (V) 221 mm(H) × 6 mm(V) 12 bit 12 bit

40 MHz

Interface (Camera Link) Pixel clock (Camera Link) A/D gain value Power requirements Power consumption 1 × 1 binning 2 × 2 Lithium-ion battery inspection X-ray image intensifier (I.I.) camera : X-ray TDI camera: Slack of rolling Short of the solution Condition of the connection on electrode Inspection by X-ray TDI camera Inspection by 2D sensor In case of 2D sensor, the dimensional measurement cannot be implemented correctly because the image is distorted on the corner areas of the X-ray irradiation. The long length sample needs to be located on center of X-ray source, so the sample has to be relocated each time. X-ray TDI camera can capture the image with no distortion by line scan method, so it is not necessary to relocate the samples and it enables the continuous inspection for long length object without stopping. Not necessary to relocate the samples and possible to inspect the long length object with no distortion. High speed readout Large field of view High SensitivityHigh Resolution High-resolution, High-speed Camera with a Wide Field of View for In-line 100 % X-ray Inspection High speed readout Large field of view Resolution chart (2× magnification) < 16 Line Pair / mm = 31 mm resolution * When the focal size of the X-ray source is large, this value gets worse. High resolution image acquisition X-ray TDI Camera X-ray Source Object The image is distorted on the corner areas in thickness direction, and the dimensional measurement cannot be implemented correctly. The non-distortion image can be realized since X-ray is radiated vertically to the object and the dimensional measurement can be implemented correctly. Possible to inspect the mismatch of rolling and measure the length of electrode with no distortion. TDI technology offers all four simultaneously. C12200-321 has a following dead space between chips. The effect by the dead space to X-ray image depends on the measurement conditions such as X-ray magnification ratio and X-ray source's focus size. Dead space between chips C12200-321 Dead space 2 Edge pixel Dead space 1: 130 μm min. 200 μm max. Left chipCenter chip ±50 μm MAX. Dead space 1 Edge pixel Dead space 2: 130 μm min. 200 μm max. Right chip Center chip ±50 μm MAX. Inspection of a solder's back fillet If the back fillet of the solder on a PCB has a defect, a connection error will occur even with small vibrations. For observation of the back fillet part, X-ray transmission technique has been applied but only with an off-line system. Our X-ray TDI camera realizes in-line inspection because it can acquire high speed profile data with high sensitivity. 3D brightness level can be displayed using software. Normal soldering Soldering failure Line scan Line scan Profile 3D display Defect point MEASUREMENT EXAMPLES C12200-461 offers a wide detection area with no dead areas due to its staggered sensors. 10 pixels (Min. 4 pixels, Max. 16 pixels) 15.1±0.5 (Unit: mm) C12200-461 Wide detection width with no dead areas. Overlapped type measurement example *1 "Active CCD pixel number" is all outputting pixel number including overlapped pixel. When the overlapped pixels are deleted, actual pixel numbers will vary. And also, X-ray sensitive area will vary. *2 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance. *C12200-321 measurement image