C1005B106J100ST

C2012N680J101NT HOTTECH | Alldatasheet

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Page:P11-P1 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. 1．PART NUMBER e.g.: C2012N680J101NT C 2012 N 680 J 101 N T 2．STRUCTURE 介质：Dielectric 电极：Electrode 端头：Terminal 银：Silver 镍：Nickel 锡：Tin Inner Structure Three Electrode layers Code: MLCC Size: 0603（0201） 1005（0402） 1608（0603） 2012（0805） 3216（1206） 3225（1210） 4532（1812） Dielectric: N=COG/NPO B=X7R A=X5R F=Y5V E=Z5U Capacitance: 0R5=0.5pF 100=10 pF 680=68 pF 104=100nF 106=10uF Tolerance B=±0.1pF C=±0.25PF D=±0. 5PF F=±1% G=±2% J =±5% K=±10% M=±20% Z=-20%- +80% Terminal: S: in silver N: Three Layers Packing: T: in Tape B: in Box Rated V oltage: 100=10V 250=25V 101=100V 102=1000V

Page:P11-P2 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. 3．SIZE AND ELECTRICAL PARAMETERS SIZE (mm) DIMENSION (mm) INCH METRIC L W T E 0805 2012 2.00±0.20 1.25±0.20 0.70±0.20 1.00±0.20 1.25±0.20 0.50±0.20 1206 3216 3.20±0.30 1.60±0.2 0.70±0.20 1.00±0.20 1.25±0.20 0.50±0.25 1210 3225 3.20±0.30 2.50±0.30 1.25±0.30 1.50±0.30 0.75±0.25

Page:P11-P3 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. 4. DIELECTRIC CHARACTERISTIC INTRODUCTION AND TEST METHOD ITEM STANDARD TEST METHOD Capacitance 0.5PF-47uF COG： C≤1000PF ：1MHz±10% 1.0±0.2Vrms C＞1000PF：1KHz±10% 1.0±0.2Vrms X7R/X5R： 1KHz±10% 1.0 ±0.2Vrms Y5V/Z5U： 1KHz±10% 1.0 ±0.2Vrms ≤10uF 120Hz 0.5±0.2Vrms ＞10uF Tolerance B=±0.1PF C= ±0.25PF D= ±0.5.PF K=±10% M= ±20% Rated V oltage 16、25、50、100、200、500、1000、2000 V (DC) Dissipation Factor COG/NPO DF≤0.15% 3.5%(16V) Y5V/Z5U DF ≤ 7%(C ≥ 100nF) . ≤ 3.5%(C<100nF) Insulation Resistance（IR） COG/NPO C≤10NF IR＞50000MΩ; C＞10NF IR＞5000ΩF Test voltage: rated Time: 1 minute Temperature: 18-25℃ Humidity: <80% X7R/X5R C≤25NF IR＞10000MΩ; C＞25NF RXC ＞100ΩF Y5V/Z5U C≤25NF IR＞4000MΩ; C＞25NF RXC ＞100ΩF Dielectric withstanding voltage No damage after test Apply 2.5x rated voltage to both terminations for 5 seconds, charge and discharge current are less than 50mA. (This test doesn ’t apply to high-voltage MLCC) Termination Adhesion No damage after test Test Condition: 5N 10 ±1S Bending Strength No damage after test and capacitance tolerance shall not be more than 10% After soldering capacitor on the PCB, 1mm per 1 second of bending for this PCB shall be applied. Solderability Temperature 235±5℃ Completely immerse the capacitor in the molthen rosin for 2s and then put it in the 10mm molthen solder with a temperature of 235±5℃（265±5℃）for 2(5)s. after that pick it up, clean the solvent and inspect it under 10x or more microscope. Time 1±1S Cover ≥95 Resistance to soldering Heat Tempertaure 265±5℃ Time 1±1S Cover ≥95 △C/C ≤0.5% or 0.5PF Temperature Cycling Dielectric COG/NPO X7R/X5R Y5V/Z5U Temperature: -55 ± 3 ℃ ~125 ± 3 ℃ COG/X7R Cycle times: 5 times per 30s Resume time: 24h No damage after test

Page:P11-P4 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Humidity and Moisture Resistance Dielectric COG/NPO X7R/X5R Y5V/Z5U Permanent Moisture T=40±2℃ T=21D Relative Humidity: 93+2~3% Resume Time: 1-2h △C/C ≤2% ≤10% ≤20% DF 0.03 0.05 0.07 IR RXC＞25S RXC＞25S RXC＞25S No damage after test T.C. characteristics dielectric △C/C T.C. COG/NPO ±30PPM +20℃ -55℃ +20℃ +125℃ Vibration No damage after test f=10-500Hz 0.75MM/2S Bump No damage after test 4000 times Life test dielectric COG/NPO X7R/X5R Y5V/Z5U Temperature: +125℃ NPO/X7R +85℃ Y5V/Z5U T=100 h Resume time: 24h DF 0.003 0.003 0. 05 IR RXC＞25S RXC＞25S RXC＞25S

Page:P11-P5 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. 5. T.C.CHARACTERISTICS Dielectric NPO(COG) X7R(X5R) Y5V Operating Temperature -55~125℃ -55~125(85)℃ -30~85℃ T.C.Characteristics ±30PPM/℃ ±15% -20~+80% COG8/NPO Typical Characteristics X7R/X5R Typical Characteristics Y5V Typical Characteristics

Page:P11-P6 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. 6. VOLTAGE AND CAPACITANCE ( COG/NPO) Size V oltage Capacitance 0201 25V 0.5 PF -1000PF 50V 0.5 PF -680PF 0402 25V 0.5 PF -2200PF 50V 0.5 PF -2200PF 0603 25V 0.5 PF -10000PF 50V 0.5 PF -10000PF 0805 25V 0.5 PF -68000PF 50V 0.5 PF -47000PF 1206 16V 0.5 PF -100000PF 25V 0.5 PF -100000PF 50V 0.5 PF -68000PF 1210 25V 470 PF -47000PF 50V 560 PF -56000PF 1812 25V 1000 PF -100000PF 50V 1000 PF -47000PF

Page:P11-P7 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. （X7R/X5R） Size V oltage Capacitance 0402 6.3V 100 PF -1.0 uF 10V 100 PF -680nF 16V 100 PF -220nF 0603 6.3V 100 PF -4.7 uF 10V 100 PF -4.7 uF 16V 100 PF -2.2 uF 25V 100 PF -2.2 uF 50V 100 PF -1.0 uF 0805 6.3V 220 PF -10 uF 10V 220 PF -10 uF 16V 220 PF -10 uF 25V 220 PF -4.7 uF 50V 220 PF -2.2 uF 1206 6.3V 220 PF -10 uF 10V 220 PF -10uF 16V 220 PF -10 uF 25V 220 PF -10 uF 50V 220 PF -10 uF 1210 6.3V 1000 PF -47 uF 10V 1000 PF -22 uF 16V 1000 PF -22 uF 25V 1000 PF -22 uF 50V 1000 PF -10 uF 1812 25V 10000 PF -47 uF 50V 10000 PF -22 uF

Page:P11-P8 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. (Y5V) Size V oltage Capacitance 0402 6.3V 100nF -1 uF 10V 100nF -1 uF 16V 22nF -680nF 50V 22nF -680nF 0603 6.3V 680nF-4.7 uF 10V 22nF -4.7 uF 16V 22nF -4.7 uF 25V 22nF -2.2 uF 50V 22nF -1 uF 0805 6.3V 4.7 uF -10 uF 10V 2.2 uF -10 uF 16V 22nF -4.7 uF 25V 22nF -2.2 uF 50V 22nF -1 uF 1206 6.3V / 10V 2.2uF -22 uF 16V 1uF -10 uF 25V 22nF -10 uF 50V 22nF -10 uF 1210 6.3V 22nF-47 uF 10V 10uF-22 uF 16V 2.2uF-10 uF 25V 220nF-2.2 uF 50V 22nF -10 uF 1812 25V 10uF-47 uF 50V 22nF-22uF

Page:P11-P9 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. 7.Packing Information Reel Dimension A B C F W 0201 0402 0603 0805 1206 1210 Inch 7.008±0.079 2.362±0.039 0.531±0.020 0.449±0.039 0.354±0.012 1812 Packing Quantity 0201 0402 0603 0805 1206 1210 1812 Paper Tape 10K/15K 10K 4K 4K 4K Plastic Tape 2K 2K 1K/2K 500PCS

Page:P11-P10 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Tape Unit: mm TYPE A B W P0 P1 P2

Page:P11-P11 HOTTECH CHIP CERAMIC CAPACITORS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. 8.WELDING TEMPERATURE Suitable reflow temperature 1-2℃/Sec ramp Preheat 150-183℃：2-3 minutes Time above 183℃：60-100 seconds Peak Temperature：230±10℃ Module should only be in oven for 5.5-6 minute