BTP1207A3 CYSTEKEC | Alldatasheet

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Technical content

CYStech Electronics Corp. Spec. No. : C307A3 Issued Date : 2015.04.30 Revised Date : Page No. : 1/6 BTP1207A3 CYStek Product Specification General Purpose PNP Epitaxial Planar Transistor BTP1207A3

Description

  • The BTP1207A3 is designed for general purpose amplification.
  • Large IC , IC( Max) = -0.6A
  • High BVCEO, BVCEO= -150V
  • Pb-free lead plating and halogen-free package Symbol Outline BTP1207A3 TO-92

Ordering Information

(Pb-free lead plating and halogen-free package) 2000 pcs / Tape & Box BTP1207A3-0-BK-G TO-92 (Pb-free lead plating and halogen-free package) 1000 pcs/ bag, 10 bags/box, 10boxes/carton B：Base C：Collector E：Emitter E C B Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, TB :2000 pcs/tape & box; BK: 1000 pcs / bag, 10 bags/box, 10 boxes/carton Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C307A3 Issued Date : 2015.04.30 Revised Date : Page No. : 2/6 BTP1207A3 CYStek Product Specification Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage VCBO -160 V Collector-Emitter V oltage VCEO -150 V Emitter-Base V oltage VEBO -6 V Collector Current IC -0.6 A Power Dissipation PD 625 mW Operating Junction Temperature Range Tj -55~+150 °C Storage Temperature Range Tstg -55~+150 °C Thermal Characteristics Parameter Symbol Value Unit Thermal Resistance, Junction-to-ambient, max RθJA 200 °C/W Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO -160 - - V IC=-100μA BVCEO -150 - - V IC=-1mA BVEBO -6 - - V IE=-50μA ICBO - - -50 nA VCB=-150V IEBO - - -50 nA VEB=-6V *VCE(sat) 1 - -0.11 -0.2 V IC=-10mA, IB=-1mA *VCE(sat) 2 - -0.25 -0.4 V IC=-50mA, IB=-5mA *VBE(sat) 1 - - -0.9 V IC=-10mA, IB=-1mA *VBE(sat) 2 - - -1 V IC=-50mA, IB=-5mA hFE 1 100 - - - VCE=-5V , IC=-1mA hFE 2 120 - 270 - VCE=-5V , IC=-10mA hFE 3 80 - - - VCE=-5V , IC=-50mA fT 100 - - MHz VCE=-10V , IC=-10mA, f=100MHz Cob - - 6 pF VCB=-10V , f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%

CYStech Electronics Corp. Spec. No. : C307A3 Issued Date : 2015.04.30 Revised Date : Page No. : 3/6 BTP1207A3 CYStek Product Specification Typical Characteristics Current Gain vs Collector Current 100 1000 0.1 1 10 100 1000 Collector Current---IC(mA) Current Gain--- HFE VCE=5V VCE=1V VCE=6V HFE Saturation Voltage vs Collector Current 100 1000 10000 1 10 100 1000 Collector Current---I C(mA) Saturation Voltage---(mV) VCE(SAT) @IC=10IB Saturation Voltage vs Collector Current 100 1000 1 10 100 1000 Collector Current---I C(mA) Saturation Voltage---(mV) VBE(SAT) @IC=10IB Cutoff Frequency vs Collector Current 100 1000 0.1 1 10 100 Collector Current---I C(mA) Cutoff Frequency---f T(MHZ) fT@VCE=10V Capacitance Characteristics 100 0.1 1 10 100 Reverse Biased Voltage---V CB, VEB(V) Capacitance---(pF) Cib Cob fT=1MHz Power Derating Curve 100 200 300 400 500 600 700 0 50 100 150 200 Ambient Temperature --- T A(℃ ) Power Dissipation---PD(mW)

CYStech Electronics Corp. Spec. No. : C307A3 Issued Date : 2015.04.30 Revised Date : Page No. : 4/6 BTP1207A3 CYStek Product Specification TO-92 Taping Outline Millimeters DIM Item Min. Max. A Component body height 4.33 4.83 D Tape Feed Diameter 3.80 4.20 D1 Lead Diameter H2AH2AH2H2 D2 A H W L P F1F2 D1 D T 0.36 0.53 D2 Component Body Diameter 4.33 4.83 F1,F2 Component Lead Pitch 2.40 2.90 F1,F2 F1-F2 - ±0.3 H Height Of Seating Plane 15.50 16.50 H1 Feed Hole Location 8.50 9.50 H2 Front To Rear Deflection - 1 H2A Deflection Left Or Right - 1 H3 Component Height - 27 H4 Feed Hole To Bottom Of Component - 21 L Lead Length After Component Removal - 11 L1 Lead Wire Enclosure 2.50 - P Feed Hole Pitch 12.50 12.90 P1 Center Of Seating Plane Location 5.95 6.75 P2 4 Feed Hole Pitch 50.30 51.30 T Over All Tape Thickness - 0.55 T1 Total Taped Package Thickness - 1.42 T2 Carrier Tape Thickness 0.36 0.68 W Tape Width 17.50 19.00 W1 Adhesive Tape Width 5.00 7.00 - 20 pcs Pitch 253 255

CYStech Electronics Corp. Spec. No. : C307A3 Issued Date : 2015.04.30 Revised Date : Page No. : 5/6 BTP1207A3 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 5 +1/-1 seconds 260 +0/-5 °C Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C307A3 Issued Date : 2015.04.30 Revised Date : Page No. : 6/6 BTP1207A3 CYStek Product Specification TO-92 Dimension *: Typical D 0.0142 0.0220 0.36 0.56 α1 - *5° - *5° F 0.1323 0.1480 3.36 3.76 α3 - *2° - *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. P1207 Marking: A D B C I α1 E F Date Code GH Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3